JP2016539517A5 - - Google Patents

Download PDF

Info

Publication number
JP2016539517A5
JP2016539517A5 JP2016555448A JP2016555448A JP2016539517A5 JP 2016539517 A5 JP2016539517 A5 JP 2016539517A5 JP 2016555448 A JP2016555448 A JP 2016555448A JP 2016555448 A JP2016555448 A JP 2016555448A JP 2016539517 A5 JP2016539517 A5 JP 2016539517A5
Authority
JP
Japan
Prior art keywords
conductive layer
terminal
mlcc
slots
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016555448A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016539517A (ja
Filing date
Publication date
Priority claimed from US14/090,589 external-priority patent/US20150146340A1/en
Application filed filed Critical
Publication of JP2016539517A publication Critical patent/JP2016539517A/ja
Publication of JP2016539517A5 publication Critical patent/JP2016539517A5/ja
Pending legal-status Critical Current

Links

JP2016555448A 2013-11-26 2014-11-06 少なくとも１つのスロットを含む多層セラミックキャパシタ Pending JP2016539517A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/090,589 2013-11-26
US14/090,589 US20150146340A1 (en) 2013-11-26 2013-11-26 Multilayer ceramic capacitor including at least one slot
PCT/US2014/064290 WO2015080847A1 (en) 2013-11-26 2014-11-06 Multilayer ceramic capacitor including at least one slot

Publications (2)

Publication Number Publication Date
JP2016539517A JP2016539517A (ja) 2016-12-15
JP2016539517A5 true JP2016539517A5 (enExample) 2017-11-30

Family

ID=51947505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016555448A Pending JP2016539517A (ja) 2013-11-26 2014-11-06 少なくとも１つのスロットを含む多層セラミックキャパシタ

Country Status (5)

Country Link
US (1) US20150146340A1 (enExample)
EP (1) EP3074992B1 (enExample)
JP (1) JP2016539517A (enExample)
CN (1) CN105765679B (enExample)
WO (1) WO2015080847A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO2865735T3 (enExample) 2013-07-12 2018-07-21
US10179254B2 (en) * 2015-09-21 2019-01-15 Apple Inc. Capacitor structure with acoustic noise self-canceling characteristics
JP6958515B2 (ja) * 2018-09-03 2021-11-02 株式会社オートネットワーク技術研究所 回路構造体及び電気接続箱
CN110662352A (zh) * 2019-10-28 2020-01-07 维沃移动通信有限公司 一种电路板装置及其加工方法和移动终端
JP2023551326A (ja) 2020-11-30 2023-12-07 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 積層セラミックコンデンサ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169841U (enExample) * 1979-05-22 1980-12-05
JPH0658861B2 (ja) * 1988-12-09 1994-08-03 株式会社村田製作所 積層コンデンサ
JPH03215915A (ja) * 1990-01-19 1991-09-20 Murata Mfg Co Ltd 積層コンデンサ
JP2878919B2 (ja) * 1991-12-30 1999-04-05 韓國電子通信研究院 高周波ノイズ除去用チップ型キャパシター
JPH08191034A (ja) * 1994-11-09 1996-07-23 Taiyo Yuden Co Ltd 積層コンデンサ
EP1075004A4 (en) * 1999-02-17 2007-05-02 Tdk Corp CAPACITOR
US6356429B2 (en) * 1999-02-18 2002-03-12 Tdk Corporation Capacitor
JP2001167908A (ja) * 1999-12-03 2001-06-22 Tdk Corp 半導体電子部品
JP3923723B2 (ja) * 2000-11-22 2007-06-06 Ｔｄｋ株式会社 積層型電子部品
JP2004273917A (ja) * 2003-03-11 2004-09-30 Murata Mfg Co Ltd チップ状積層セラミック電子部品
US6798640B1 (en) * 2003-09-03 2004-09-28 Sun Microsystems, Inc. Capacitor having plates with a pattern void of conductive material and method of making therfor
US20070030166A1 (en) * 2005-08-02 2007-02-08 Warner Thomas P Device selection module and method for selecting devices
JP2007220917A (ja) * 2006-02-16 2007-08-30 Tdk Corp 積層コンデンサ
JP4925779B2 (ja) * 2006-09-27 2012-05-09 京セラ株式会社 積層コンデンサ
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
JP5530172B2 (ja) * 2009-12-25 2014-06-25 太平洋セメント株式会社 電子部品の内部電極の製造方法
KR101158194B1 (ko) * 2010-04-01 2012-06-19 한양대학교 산학협력단 적층형 세라믹 캐패시터의 모델링 방법
KR20130012715A (ko) * 2011-07-26 2013-02-05 삼성전기주식회사 적층형 세라믹 캐패시터

Similar Documents

Publication Publication Date Title
JP2016539517A5 (enExample)
WO2015175558A3 (en) Energy storage device and method of production thereof
JP5573868B2 (ja) 等価回路作成方法、等価回路作成プログラム及び等価回路作成装置
WO2015050589A3 (en) Photonic sintering of polymer thick film copper conductor compositions
PH12014000075A1 (en) Laminated electronic component and manufacturing method for the same
PL3309881T3 (pl) Łatwa do przetwarzania elektrolityczna folia miedziana, elektroda ją zawierająca, akumulator ją zawierający oraz sposób jej wytwarzania
JP2011135033A (ja) 積層セラミックキャパシタ
US20160049252A1 (en) Multilayer ceramic capacitor and board having the same
JP2016085982A5 (enExample)
EP3121819A4 (en) Conductive paste, laminated ceramic component, printed circuit board, and electronic device
JP2016058753A5 (enExample)
WO2014184102A3 (en) Method for depositing thick copper layers onto sintered materials
JP2017184367A5 (enExample)
JP2016086150A (ja) 積層セラミックキャパシタ
JP2017045521A5 (enExample)
JP2015520573A5 (enExample)
WO2018221896A8 (ko) 나노와이어 투명 전극 및 이의 제조 방법
JP2015192083A5 (enExample)
JP2014203943A5 (enExample)
US20180096794A1 (en) Capacitor component
JP2014222783A (ja) 積層コンデンサ及び積層コンデンサの実装構造体
JP2017519326A5 (enExample)
JP3195208U (ja) 金属抵抗体
JP2018523299A5 (enExample)
JP2015012055A5 (enExample)