CN105765679B - 包括至少一个狭缝的多层陶瓷电容器 - Google Patents

包括至少一个狭缝的多层陶瓷电容器 Download PDF

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Publication number
CN105765679B
CN105765679B CN201480064181.2A CN201480064181A CN105765679B CN 105765679 B CN105765679 B CN 105765679B CN 201480064181 A CN201480064181 A CN 201480064181A CN 105765679 B CN105765679 B CN 105765679B
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China
Prior art keywords
conductive layer
terminal
mlcc
slit
slits
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Active
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CN201480064181.2A
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English (en)
Chinese (zh)
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CN105765679A (zh
Inventor
C·H·尹
K·P·黄
Y·K·宋
D·W·金
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Qualcomm Inc
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Qualcomm Inc
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Publication of CN105765679A publication Critical patent/CN105765679A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201480064181.2A 2013-11-26 2014-11-06 包括至少一个狭缝的多层陶瓷电容器 Active CN105765679B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/090,589 2013-11-26
US14/090,589 US20150146340A1 (en) 2013-11-26 2013-11-26 Multilayer ceramic capacitor including at least one slot
PCT/US2014/064290 WO2015080847A1 (en) 2013-11-26 2014-11-06 Multilayer ceramic capacitor including at least one slot

Publications (2)

Publication Number Publication Date
CN105765679A CN105765679A (zh) 2016-07-13
CN105765679B true CN105765679B (zh) 2019-09-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480064181.2A Active CN105765679B (zh) 2013-11-26 2014-11-06 包括至少一个狭缝的多层陶瓷电容器

Country Status (5)

Country Link
US (1) US20150146340A1 (enExample)
EP (1) EP3074992B1 (enExample)
JP (1) JP2016539517A (enExample)
CN (1) CN105765679B (enExample)
WO (1) WO2015080847A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO2865735T3 (enExample) 2013-07-12 2018-07-21
US10179254B2 (en) * 2015-09-21 2019-01-15 Apple Inc. Capacitor structure with acoustic noise self-canceling characteristics
JP6958515B2 (ja) * 2018-09-03 2021-11-02 株式会社オートネットワーク技術研究所 回路構造体及び電気接続箱
CN110662352A (zh) * 2019-10-28 2020-01-07 维沃移动通信有限公司 一种电路板装置及其加工方法和移动终端
JP2023551326A (ja) 2020-11-30 2023-12-07 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 積層セラミックコンデンサ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5099387A (en) * 1990-01-19 1992-03-24 Murata Manufacturing Co., Ltd. Multilayer capacitor
US20010028545A1 (en) * 1999-02-18 2001-10-11 Tdk Corporation Capacitor
CN101369487A (zh) * 2007-06-13 2009-02-18 阿维科斯公司 可控等效串联电阻的去耦电容器
US20130027841A1 (en) * 2011-07-26 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Multi-layered ceramic capacitor

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55169841U (enExample) * 1979-05-22 1980-12-05
JPH0658861B2 (ja) * 1988-12-09 1994-08-03 株式会社村田製作所 積層コンデンサ
JP2878919B2 (ja) * 1991-12-30 1999-04-05 韓國電子通信研究院 高周波ノイズ除去用チップ型キャパシター
JPH08191034A (ja) * 1994-11-09 1996-07-23 Taiyo Yuden Co Ltd 積層コンデンサ
EP1075004A4 (en) * 1999-02-17 2007-05-02 Tdk Corp CAPACITOR
JP2001167908A (ja) * 1999-12-03 2001-06-22 Tdk Corp 半導体電子部品
JP3923723B2 (ja) * 2000-11-22 2007-06-06 Ｔｄｋ株式会社 積層型電子部品
JP2004273917A (ja) * 2003-03-11 2004-09-30 Murata Mfg Co Ltd チップ状積層セラミック電子部品
US6798640B1 (en) * 2003-09-03 2004-09-28 Sun Microsystems, Inc. Capacitor having plates with a pattern void of conductive material and method of making therfor
US20070030166A1 (en) * 2005-08-02 2007-02-08 Warner Thomas P Device selection module and method for selecting devices
JP2007220917A (ja) * 2006-02-16 2007-08-30 Tdk Corp 積層コンデンサ
JP4925779B2 (ja) * 2006-09-27 2012-05-09 京セラ株式会社 積層コンデンサ
JP5530172B2 (ja) * 2009-12-25 2014-06-25 太平洋セメント株式会社 電子部品の内部電極の製造方法
KR101158194B1 (ko) * 2010-04-01 2012-06-19 한양대학교 산학협력단 적층형 세라믹 캐패시터의 모델링 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5099387A (en) * 1990-01-19 1992-03-24 Murata Manufacturing Co., Ltd. Multilayer capacitor
US20010028545A1 (en) * 1999-02-18 2001-10-11 Tdk Corporation Capacitor
CN101369487A (zh) * 2007-06-13 2009-02-18 阿维科斯公司 可控等效串联电阻的去耦电容器
US20130027841A1 (en) * 2011-07-26 2013-01-31 Samsung Electro-Mechanics Co., Ltd. Multi-layered ceramic capacitor

Also Published As

Publication number Publication date
US20150146340A1 (en) 2015-05-28
CN105765679A (zh) 2016-07-13
EP3074992A1 (en) 2016-10-05
EP3074992B1 (en) 2021-02-17
WO2015080847A1 (en) 2015-06-04
JP2016539517A (ja) 2016-12-15

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