JP2016535930A5 - - Google Patents

Download PDF

Info

Publication number
JP2016535930A5
JP2016535930A5 JP2016517478A JP2016517478A JP2016535930A5 JP 2016535930 A5 JP2016535930 A5 JP 2016535930A5 JP 2016517478 A JP2016517478 A JP 2016517478A JP 2016517478 A JP2016517478 A JP 2016517478A JP 2016535930 A5 JP2016535930 A5 JP 2016535930A5
Authority
JP
Japan
Prior art keywords
ferrite
semiconductor substrate
layer
resist coating
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016517478A
Other languages
English (en)
Japanese (ja)
Other versions
JP6293875B2 (ja
JP2016535930A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2014/071079 external-priority patent/WO2015052059A1/en
Publication of JP2016535930A publication Critical patent/JP2016535930A/ja
Application granted granted Critical
Publication of JP6293875B2 publication Critical patent/JP6293875B2/ja
Publication of JP2016535930A5 publication Critical patent/JP2016535930A5/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016517478A 2013-10-07 2014-10-01 フェライトロッドを製造するための精密バッチ製造法 Expired - Fee Related JP6293875B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13187538 2013-10-07
EP13187538.7 2013-10-07
PCT/EP2014/071079 WO2015052059A1 (en) 2013-10-07 2014-10-01 Precision batch production method for manufacturing ferrite rods

Publications (3)

Publication Number Publication Date
JP2016535930A JP2016535930A (ja) 2016-11-17
JP6293875B2 JP6293875B2 (ja) 2018-04-25
JP2016535930A5 true JP2016535930A5 (https=) 2018-05-10

Family

ID=49303841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016517478A Expired - Fee Related JP6293875B2 (ja) 2013-10-07 2014-10-01 フェライトロッドを製造するための精密バッチ製造法

Country Status (7)

Country Link
US (1) US9825347B2 (https=)
EP (1) EP3055871A1 (https=)
JP (1) JP6293875B2 (https=)
KR (1) KR20160067940A (https=)
CN (1) CN105814655B (https=)
SG (1) SG11201602499TA (https=)
WO (1) WO2015052059A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10665377B2 (en) 2014-05-05 2020-05-26 3D Glass Solutions, Inc. 2D and 3D inductors antenna and transformers fabricating photoactive substrates
KR102479144B1 (ko) 2016-02-25 2022-12-20 3디 글래스 솔루션즈 인코포레이티드 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재
US12165809B2 (en) 2016-02-25 2024-12-10 3D Glass Solutions, Inc. 3D capacitor and capacitor array fabricating photoactive substrates
WO2017177171A1 (en) 2016-04-08 2017-10-12 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
WO2017184352A1 (en) * 2016-04-18 2017-10-26 Eagantu Ltd. A wide band radio frequency circulator
US11101532B2 (en) 2017-04-28 2021-08-24 3D Glass Solutions, Inc. RF circulator
AU2018297035B2 (en) 2017-07-07 2021-02-25 3D Glass Solutions, Inc. 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates
US10854946B2 (en) 2017-12-15 2020-12-01 3D Glass Solutions, Inc. Coupled transmission line resonate RF filter
AU2018399638B2 (en) 2018-01-04 2021-09-02 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency RF circuits
WO2019199470A1 (en) 2018-04-10 2019-10-17 3D Glass Solutions, Inc. Rf integrated power condition capacitor
US10903545B2 (en) 2018-05-29 2021-01-26 3D Glass Solutions, Inc. Method of making a mechanically stabilized radio frequency transmission line device
AU2019344542B2 (en) 2018-09-17 2022-02-24 3D Glass Solutions, Inc. High efficiency compact slotted antenna with a ground plane
EP3881391A4 (en) * 2018-11-14 2022-07-27 Optisys, LLC HOLLOW METAL WAVEGUIDES WITH IRREGULAR HEXAGONAL CROSS-SECTIONS AND METHOD OF MANUFACTURE THEREOF
US11996600B2 (en) 2018-11-14 2024-05-28 Optisys, Inc. Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles
WO2020106774A1 (en) 2018-11-19 2020-05-28 Optisys, LLC Irregular hexagon cross-sectioned hollow metal waveguide filters
EP3903347A4 (en) 2018-12-28 2022-03-09 3D Glass Solutions, Inc. HETEROGENE INTEGRATION FOR HF, MICROWAVE AND MM WAVE SYSTEMS ON PHOTOACTIVE GLASS SUBSTRATES
AU2019416327B2 (en) 2018-12-28 2021-12-09 3D Glass Solutions, Inc. Annular capacitor RF, microwave and MM wave systems
KR20210147040A (ko) 2019-04-05 2021-12-06 3디 글래스 솔루션즈 인코포레이티드 유리 기반의 빈 기판 집적 도파관 디바이스
CA3136642C (en) 2019-04-18 2023-01-03 3D Glass Solutions, Inc. High efficiency die dicing and release
US10727216B1 (en) 2019-05-10 2020-07-28 Sandisk Technologies Llc Method for removing a bulk substrate from a bonded assembly of wafers
CN110202880B (zh) * 2019-06-03 2020-05-22 西安交通大学 一种柔性微波器件及其制备方法
JP2023516817A (ja) 2020-04-17 2023-04-20 スリーディー グラス ソリューションズ,インク 広帯域誘導
US11501905B2 (en) * 2020-08-31 2022-11-15 Boston Applied Technologies, Inc. Composition and method of making a monolithic heterostructure of multiferroic thin films
WO2022087027A1 (en) 2020-10-19 2022-04-28 Optisys, LLC Broadband waveguide to dual-coaxial transition
US12183970B2 (en) 2020-10-29 2024-12-31 Optisys, Inc. Integrated balancing radiating elements
CN112103602B (zh) * 2020-11-05 2021-03-16 中国电子科技集团公司第九研究所 一种宽带高频法拉第隔离器
CN112909458B (zh) * 2021-02-08 2021-09-10 湖南国科雷电子科技有限公司 一种w波段e面波导滤波器
US12009596B2 (en) 2021-05-14 2024-06-11 Optisys, Inc. Planar monolithic combiner and multiplexer for antenna arrays
CN116345099B (zh) * 2023-01-13 2026-01-06 西南应用磁学研究所(中国电子科技集团公司第九研究所) 一种硅基腔体环行器/隔离器及其加工方法
CN120824531B (zh) * 2025-06-27 2026-02-06 河北美泰电子科技有限公司 一种晶圆级异质集成的mems环行器及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238163A (en) * 1975-09-20 1977-03-24 Omron Tateisi Electronics Co Passive element
JPS5246787A (en) * 1975-10-11 1977-04-13 Hitachi Ltd Coil for integrated circuit and process for production of same
JPH02166801A (ja) * 1988-12-20 1990-06-27 Mitsubishi Electric Corp ファラデー旋回子用フェライト
JPH02188001A (ja) * 1989-01-17 1990-07-24 Uniden Corp 円偏波対直線偏波変換器
JPH06164222A (ja) 1992-11-25 1994-06-10 Murata Mfg Co Ltd マイクロ波用磁性体及びその製造方法
US5772820A (en) 1995-08-07 1998-06-30 Northrop Grumman Corporation Process for fabricating a microwave power device
US5828271A (en) 1997-03-06 1998-10-27 Northrop Grumman Corporation Planar ferrite toroid microwave phase shifter
US5876539A (en) 1997-06-17 1999-03-02 Northrop Grumman Corporaiton Fabrication of ferrite toroids
US6060433A (en) 1998-01-26 2000-05-09 Nz Applied Technologies Corporation Method of making a microwave device having a polycrystalline ferrite substrate
US6171886B1 (en) * 1998-06-30 2001-01-09 Eastman Kodak Company Method of making integrated hybrid silicon-based micro-actuator devices
US6249039B1 (en) * 1998-09-10 2001-06-19 Bourns, Inc. Integrated inductive components and method of fabricating such components
US6498549B1 (en) 1998-12-07 2002-12-24 Corning Applied Technologies Corporation Dual-tuning microwave devices using ferroelectric/ferrite layers
US6600601B1 (en) 1999-04-12 2003-07-29 Shin-Etsu Chemical Co., Ltd. Polarization-independent optical isolator and production method thereof
US6645677B1 (en) 2000-09-18 2003-11-11 Micronic Laser Systems Ab Dual layer reticle blank and manufacturing process
US6673181B1 (en) * 2001-10-29 2004-01-06 Northrop Grumman Corporation Method of manufacturing ferromagnetic toroids used in ferrite phase shifters
JP2003264405A (ja) * 2002-03-08 2003-09-19 Opnext Japan Inc 高周波伝送線路およびそれを用いた電子部品並びに電子装置
US6952042B2 (en) 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US7078983B2 (en) * 2004-06-09 2006-07-18 Raytheon Company Low-profile circulator
JP2005244084A (ja) * 2004-02-27 2005-09-08 Mitsubishi Electric Corp らせん状高周波コイルとその製造方法
EP1746430A1 (en) * 2005-07-22 2007-01-24 Liaisons Electroniques-Mecaniques Lem S.A. Orthogonal fluxgate magnetic field sensor
US7480435B2 (en) 2005-12-30 2009-01-20 Intel Corporation Embedded waveguide printed circuit board structure
TW200905703A (en) * 2007-07-27 2009-02-01 Delta Electronics Inc Magnetic device and manufacturing method thereof
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
JP5815353B2 (ja) * 2011-09-28 2015-11-17 株式会社フジクラ コイル配線素子およびコイル配線素子の製造方法
US9293245B2 (en) * 2013-08-05 2016-03-22 Qualcomm Mems Technologies, Inc. Integration of a coil and a discontinuous magnetic core

Similar Documents

Publication Publication Date Title
JP2016535930A5 (https=)
TWI517207B (zh) 用於高溫選擇性融化結合的方法和構造
TWI659002B (zh) 用於製造貫穿玻璃之連通件的接合材料回蝕製程
JP2009111367A5 (https=)
JP2015088521A5 (https=)
JP2007311584A5 (https=)
JP2013508254A5 (https=)
JP2009088498A5 (https=)
JP2015530743A5 (https=)
JP2009135472A5 (https=)
WO2009044659A1 (ja) パターン形成方法
CN103794488B (zh) 一种衬底的刻蚀方法
WO2010147839A3 (en) Silicon-rich nitride etch stop layer for vapor hf etching in mems device fabrication
PH12019500371A1 (en) A method of manufacturing an insulation layer on silicon carbide and a semiconductor device
JP2009001895A (ja) シャドーマスク
WO2015003656A1 (zh) 玻璃衬底的刻蚀方法
CN106241729A (zh) 包括接触层的cmos-mems集成装置及制造方法
JP2015154054A5 (https=)
TW200710292A (en) Semiconductor device and method for manufacturing multilayered substrate for semiconductor device
CN106129026B (zh) 半导体结构及其制作方法
WO2016060455A3 (ko) 박막 트랜지스터 제조 방법 및 박막 트랜지스터
CN105392093B (zh) 麦克风芯片的制造方法
CN103579008A (zh) 一种焊盘结构及其制备方法
CN101800189B (zh) 利用苯并环丁烯制作介质桥的方法
JP6180162B2 (ja) 基板の貼り合わせ方法および貼り合わせ基板