KR20160067940A - 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 - Google Patents

페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 Download PDF

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Publication number
KR20160067940A
KR20160067940A KR1020167011943A KR20167011943A KR20160067940A KR 20160067940 A KR20160067940 A KR 20160067940A KR 1020167011943 A KR1020167011943 A KR 1020167011943A KR 20167011943 A KR20167011943 A KR 20167011943A KR 20160067940 A KR20160067940 A KR 20160067940A
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South Korea
Prior art keywords
ferrite
layer
gold
wafer
etching
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Ceased
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KR1020167011943A
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English (en)
Korean (ko)
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존 브린 밀스
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코닌클리케 필립스 엔.브이.
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Publication of KR20160067940A publication Critical patent/KR20160067940A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/18Phase-shifters
    • H01P1/19Phase-shifters using a ferromagnetic device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/12Hollow waveguides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/046Printed circuit coils structurally combined with ferromagnetic material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/69398Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Chemically Coating (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020167011943A 2013-10-07 2014-10-01 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 Ceased KR20160067940A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13187538 2013-10-07
EP13187538.7 2013-10-07
PCT/EP2014/071079 WO2015052059A1 (en) 2013-10-07 2014-10-01 Precision batch production method for manufacturing ferrite rods

Publications (1)

Publication Number Publication Date
KR20160067940A true KR20160067940A (ko) 2016-06-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167011943A Ceased KR20160067940A (ko) 2013-10-07 2014-10-01 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법

Country Status (7)

Country Link
US (1) US9825347B2 (https=)
EP (1) EP3055871A1 (https=)
JP (1) JP6293875B2 (https=)
KR (1) KR20160067940A (https=)
CN (1) CN105814655B (https=)
SG (1) SG11201602499TA (https=)
WO (1) WO2015052059A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101940981B1 (ko) 2014-05-05 2019-01-23 3디 글래스 솔루션즈 인코포레이티드 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판
US12165809B2 (en) 2016-02-25 2024-12-10 3D Glass Solutions, Inc. 3D capacitor and capacitor array fabricating photoactive substrates
KR20200010598A (ko) 2016-02-25 2020-01-30 3디 글래스 솔루션즈 인코포레이티드 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재
WO2017177171A1 (en) 2016-04-08 2017-10-12 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
US9912028B2 (en) * 2016-04-18 2018-03-06 Eagantu Ltd. Wide band radio frequency circulator
WO2018200804A1 (en) * 2017-04-28 2018-11-01 3D Glass Solutions, Inc. Rf circulator
AU2018297035B2 (en) 2017-07-07 2021-02-25 3D Glass Solutions, Inc. 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates
WO2019118761A1 (en) 2017-12-15 2019-06-20 3D Glass Solutions, Inc. Coupled transmission line resonate rf filter
KR102600200B1 (ko) 2018-01-04 2023-11-10 3디 글래스 솔루션즈 인코포레이티드 고효율 rf 회로들을 위한 임피던스 정합 도전성 구조
KR102145746B1 (ko) 2018-04-10 2020-08-19 3디 글래스 솔루션즈 인코포레이티드 Rf 집적형 전력 조절 커패시터
KR102475010B1 (ko) 2018-05-29 2022-12-07 3디 글래스 솔루션즈 인코포레이티드 저 삽입 손실 rf 전송 라인
KR102518025B1 (ko) 2018-09-17 2023-04-06 3디 글래스 솔루션즈 인코포레이티드 접지면을 갖는 고효율 컴팩트형 슬롯 안테나
US11996600B2 (en) 2018-11-14 2024-05-28 Optisys, Inc. Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles
US11211680B2 (en) 2018-11-14 2021-12-28 Optisys, LLC Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing
KR20210093316A (ko) 2018-11-19 2021-07-27 옵티시스, 엘엘씨 불규칙 육각 단면형 중공의 금속 도파관 필터
JP7241433B2 (ja) 2018-12-28 2023-03-17 スリーディー グラス ソリューションズ,インク 光活性ガラス基板におけるrf、マイクロ波及びmm波システムのためのヘテロジニアスインテグレーション
WO2020139955A1 (en) 2018-12-28 2020-07-02 3D Glass Solutions, Inc. Annular capacitor rf, microwave and mm wave systems
WO2020206323A1 (en) 2019-04-05 2020-10-08 3D Glass Solutions, Inc. Glass based empty substrate integrated waveguide devices
WO2020214788A1 (en) 2019-04-18 2020-10-22 3D Glass Solutions, Inc. High efficiency die dicing and release
US10727216B1 (en) 2019-05-10 2020-07-28 Sandisk Technologies Llc Method for removing a bulk substrate from a bonded assembly of wafers
CN110202880B (zh) * 2019-06-03 2020-05-22 西安交通大学 一种柔性微波器件及其制备方法
WO2021211855A1 (en) 2020-04-17 2021-10-21 3D Glass Solutions, Inc. Broadband inductor
US11501905B2 (en) * 2020-08-31 2022-11-15 Boston Applied Technologies, Inc. Composition and method of making a monolithic heterostructure of multiferroic thin films
EP4229718A4 (en) 2020-10-19 2024-09-11 Optisys, Inc. DOUBLE-COAXIAL TRANSITION WIDEBAND WAVEGUIDE
WO2022094325A1 (en) 2020-10-29 2022-05-05 Optisys, Inc. Integrated balanced radiating elements
CN112103602B (zh) * 2020-11-05 2021-03-16 中国电子科技集团公司第九研究所 一种宽带高频法拉第隔离器
CN112909458B (zh) * 2021-02-08 2021-09-10 湖南国科雷电子科技有限公司 一种w波段e面波导滤波器
US12009596B2 (en) 2021-05-14 2024-06-11 Optisys, Inc. Planar monolithic combiner and multiplexer for antenna arrays
CN116345099B (zh) * 2023-01-13 2026-01-06 西南应用磁学研究所(中国电子科技集团公司第九研究所) 一种硅基腔体环行器/隔离器及其加工方法
CN120824531B (zh) * 2025-06-27 2026-02-06 河北美泰电子科技有限公司 一种晶圆级异质集成的mems环行器及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238163A (en) * 1975-09-20 1977-03-24 Omron Tateisi Electronics Co Passive element
JPS5246787A (en) * 1975-10-11 1977-04-13 Hitachi Ltd Coil for integrated circuit and process for production of same
JPH02166801A (ja) * 1988-12-20 1990-06-27 Mitsubishi Electric Corp ファラデー旋回子用フェライト
JPH02188001A (ja) * 1989-01-17 1990-07-24 Uniden Corp 円偏波対直線偏波変換器
JPH06164222A (ja) 1992-11-25 1994-06-10 Murata Mfg Co Ltd マイクロ波用磁性体及びその製造方法
US5772820A (en) 1995-08-07 1998-06-30 Northrop Grumman Corporation Process for fabricating a microwave power device
US5828271A (en) 1997-03-06 1998-10-27 Northrop Grumman Corporation Planar ferrite toroid microwave phase shifter
US5876539A (en) 1997-06-17 1999-03-02 Northrop Grumman Corporaiton Fabrication of ferrite toroids
US6060433A (en) 1998-01-26 2000-05-09 Nz Applied Technologies Corporation Method of making a microwave device having a polycrystalline ferrite substrate
US6171886B1 (en) * 1998-06-30 2001-01-09 Eastman Kodak Company Method of making integrated hybrid silicon-based micro-actuator devices
US6249039B1 (en) * 1998-09-10 2001-06-19 Bourns, Inc. Integrated inductive components and method of fabricating such components
US6498549B1 (en) 1998-12-07 2002-12-24 Corning Applied Technologies Corporation Dual-tuning microwave devices using ferroelectric/ferrite layers
US6600601B1 (en) 1999-04-12 2003-07-29 Shin-Etsu Chemical Co., Ltd. Polarization-independent optical isolator and production method thereof
US6645677B1 (en) 2000-09-18 2003-11-11 Micronic Laser Systems Ab Dual layer reticle blank and manufacturing process
US6673181B1 (en) * 2001-10-29 2004-01-06 Northrop Grumman Corporation Method of manufacturing ferromagnetic toroids used in ferrite phase shifters
JP2003264405A (ja) * 2002-03-08 2003-09-19 Opnext Japan Inc 高周波伝送線路およびそれを用いた電子部品並びに電子装置
US6952042B2 (en) 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US7078983B2 (en) 2004-06-09 2006-07-18 Raytheon Company Low-profile circulator
JP2005244084A (ja) * 2004-02-27 2005-09-08 Mitsubishi Electric Corp らせん状高周波コイルとその製造方法
EP1746430A1 (en) * 2005-07-22 2007-01-24 Liaisons Electroniques-Mecaniques Lem S.A. Orthogonal fluxgate magnetic field sensor
US7480435B2 (en) * 2005-12-30 2009-01-20 Intel Corporation Embedded waveguide printed circuit board structure
TW200905703A (en) * 2007-07-27 2009-02-01 Delta Electronics Inc Magnetic device and manufacturing method thereof
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
JP5815353B2 (ja) * 2011-09-28 2015-11-17 株式会社フジクラ コイル配線素子およびコイル配線素子の製造方法
US9293245B2 (en) * 2013-08-05 2016-03-22 Qualcomm Mems Technologies, Inc. Integration of a coil and a discontinuous magnetic core

Also Published As

Publication number Publication date
CN105814655A (zh) 2016-07-27
JP6293875B2 (ja) 2018-04-25
US9825347B2 (en) 2017-11-21
US20160254579A1 (en) 2016-09-01
WO2015052059A1 (en) 2015-04-16
JP2016535930A (ja) 2016-11-17
SG11201602499TA (en) 2016-04-28
EP3055871A1 (en) 2016-08-17
CN105814655B (zh) 2018-08-07

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