CN105814655B - 用于制造铁氧体棒的精确批量生产方法 - Google Patents
用于制造铁氧体棒的精确批量生产方法 Download PDFInfo
- Publication number
- CN105814655B CN105814655B CN201480066647.2A CN201480066647A CN105814655B CN 105814655 B CN105814655 B CN 105814655B CN 201480066647 A CN201480066647 A CN 201480066647A CN 105814655 B CN105814655 B CN 105814655B
- Authority
- CN
- China
- Prior art keywords
- ferrite
- layer
- semiconductor substrate
- resist coating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/19—Phase-shifters using a ferromagnetic device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/69398—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Coils Or Transformers For Communication (AREA)
- Chemically Coating (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13187538 | 2013-10-07 | ||
| EP13187538.7 | 2013-10-07 | ||
| PCT/EP2014/071079 WO2015052059A1 (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105814655A CN105814655A (zh) | 2016-07-27 |
| CN105814655B true CN105814655B (zh) | 2018-08-07 |
Family
ID=49303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480066647.2A Expired - Fee Related CN105814655B (zh) | 2013-10-07 | 2014-10-01 | 用于制造铁氧体棒的精确批量生产方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9825347B2 (https=) |
| EP (1) | EP3055871A1 (https=) |
| JP (1) | JP6293875B2 (https=) |
| KR (1) | KR20160067940A (https=) |
| CN (1) | CN105814655B (https=) |
| SG (1) | SG11201602499TA (https=) |
| WO (1) | WO2015052059A1 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10665377B2 (en) | 2014-05-05 | 2020-05-26 | 3D Glass Solutions, Inc. | 2D and 3D inductors antenna and transformers fabricating photoactive substrates |
| KR102479144B1 (ko) | 2016-02-25 | 2022-12-20 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| WO2017184352A1 (en) * | 2016-04-18 | 2017-10-26 | Eagantu Ltd. | A wide band radio frequency circulator |
| US11101532B2 (en) | 2017-04-28 | 2021-08-24 | 3D Glass Solutions, Inc. | RF circulator |
| AU2018297035B2 (en) | 2017-07-07 | 2021-02-25 | 3D Glass Solutions, Inc. | 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates |
| US10854946B2 (en) | 2017-12-15 | 2020-12-01 | 3D Glass Solutions, Inc. | Coupled transmission line resonate RF filter |
| AU2018399638B2 (en) | 2018-01-04 | 2021-09-02 | 3D Glass Solutions, Inc. | Impedance matching conductive structure for high efficiency RF circuits |
| WO2019199470A1 (en) | 2018-04-10 | 2019-10-17 | 3D Glass Solutions, Inc. | Rf integrated power condition capacitor |
| US10903545B2 (en) | 2018-05-29 | 2021-01-26 | 3D Glass Solutions, Inc. | Method of making a mechanically stabilized radio frequency transmission line device |
| AU2019344542B2 (en) | 2018-09-17 | 2022-02-24 | 3D Glass Solutions, Inc. | High efficiency compact slotted antenna with a ground plane |
| EP3881391A4 (en) * | 2018-11-14 | 2022-07-27 | Optisys, LLC | HOLLOW METAL WAVEGUIDES WITH IRREGULAR HEXAGONAL CROSS-SECTIONS AND METHOD OF MANUFACTURE THEREOF |
| US11996600B2 (en) | 2018-11-14 | 2024-05-28 | Optisys, Inc. | Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles |
| WO2020106774A1 (en) | 2018-11-19 | 2020-05-28 | Optisys, LLC | Irregular hexagon cross-sectioned hollow metal waveguide filters |
| EP3903347A4 (en) | 2018-12-28 | 2022-03-09 | 3D Glass Solutions, Inc. | HETEROGENE INTEGRATION FOR HF, MICROWAVE AND MM WAVE SYSTEMS ON PHOTOACTIVE GLASS SUBSTRATES |
| AU2019416327B2 (en) | 2018-12-28 | 2021-12-09 | 3D Glass Solutions, Inc. | Annular capacitor RF, microwave and MM wave systems |
| KR20210147040A (ko) | 2019-04-05 | 2021-12-06 | 3디 글래스 솔루션즈 인코포레이티드 | 유리 기반의 빈 기판 집적 도파관 디바이스 |
| CA3136642C (en) | 2019-04-18 | 2023-01-03 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
| US10727216B1 (en) | 2019-05-10 | 2020-07-28 | Sandisk Technologies Llc | Method for removing a bulk substrate from a bonded assembly of wafers |
| CN110202880B (zh) * | 2019-06-03 | 2020-05-22 | 西安交通大学 | 一种柔性微波器件及其制备方法 |
| JP2023516817A (ja) | 2020-04-17 | 2023-04-20 | スリーディー グラス ソリューションズ,インク | 広帯域誘導 |
| US11501905B2 (en) * | 2020-08-31 | 2022-11-15 | Boston Applied Technologies, Inc. | Composition and method of making a monolithic heterostructure of multiferroic thin films |
| WO2022087027A1 (en) | 2020-10-19 | 2022-04-28 | Optisys, LLC | Broadband waveguide to dual-coaxial transition |
| US12183970B2 (en) | 2020-10-29 | 2024-12-31 | Optisys, Inc. | Integrated balancing radiating elements |
| CN112103602B (zh) * | 2020-11-05 | 2021-03-16 | 中国电子科技集团公司第九研究所 | 一种宽带高频法拉第隔离器 |
| CN112909458B (zh) * | 2021-02-08 | 2021-09-10 | 湖南国科雷电子科技有限公司 | 一种w波段e面波导滤波器 |
| US12009596B2 (en) | 2021-05-14 | 2024-06-11 | Optisys, Inc. | Planar monolithic combiner and multiplexer for antenna arrays |
| CN116345099B (zh) * | 2023-01-13 | 2026-01-06 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种硅基腔体环行器/隔离器及其加工方法 |
| CN120824531B (zh) * | 2025-06-27 | 2026-02-06 | 河北美泰电子科技有限公司 | 一种晶圆级异质集成的mems环行器及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5238163A (en) * | 1975-09-20 | 1977-03-24 | Omron Tateisi Electronics Co | Passive element |
| JPS5246787A (en) * | 1975-10-11 | 1977-04-13 | Hitachi Ltd | Coil for integrated circuit and process for production of same |
| JPH02166801A (ja) * | 1988-12-20 | 1990-06-27 | Mitsubishi Electric Corp | ファラデー旋回子用フェライト |
| JPH02188001A (ja) * | 1989-01-17 | 1990-07-24 | Uniden Corp | 円偏波対直線偏波変換器 |
| JPH06164222A (ja) | 1992-11-25 | 1994-06-10 | Murata Mfg Co Ltd | マイクロ波用磁性体及びその製造方法 |
| US5772820A (en) | 1995-08-07 | 1998-06-30 | Northrop Grumman Corporation | Process for fabricating a microwave power device |
| US5828271A (en) | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
| US5876539A (en) | 1997-06-17 | 1999-03-02 | Northrop Grumman Corporaiton | Fabrication of ferrite toroids |
| US6060433A (en) | 1998-01-26 | 2000-05-09 | Nz Applied Technologies Corporation | Method of making a microwave device having a polycrystalline ferrite substrate |
| US6171886B1 (en) * | 1998-06-30 | 2001-01-09 | Eastman Kodak Company | Method of making integrated hybrid silicon-based micro-actuator devices |
| US6249039B1 (en) * | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
| US6498549B1 (en) | 1998-12-07 | 2002-12-24 | Corning Applied Technologies Corporation | Dual-tuning microwave devices using ferroelectric/ferrite layers |
| US6600601B1 (en) | 1999-04-12 | 2003-07-29 | Shin-Etsu Chemical Co., Ltd. | Polarization-independent optical isolator and production method thereof |
| US6645677B1 (en) | 2000-09-18 | 2003-11-11 | Micronic Laser Systems Ab | Dual layer reticle blank and manufacturing process |
| US6673181B1 (en) * | 2001-10-29 | 2004-01-06 | Northrop Grumman Corporation | Method of manufacturing ferromagnetic toroids used in ferrite phase shifters |
| JP2003264405A (ja) * | 2002-03-08 | 2003-09-19 | Opnext Japan Inc | 高周波伝送線路およびそれを用いた電子部品並びに電子装置 |
| US6952042B2 (en) | 2002-06-17 | 2005-10-04 | Honeywell International, Inc. | Microelectromechanical device with integrated conductive shield |
| US7078983B2 (en) * | 2004-06-09 | 2006-07-18 | Raytheon Company | Low-profile circulator |
| JP2005244084A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | らせん状高周波コイルとその製造方法 |
| EP1746430A1 (en) * | 2005-07-22 | 2007-01-24 | Liaisons Electroniques-Mecaniques Lem S.A. | Orthogonal fluxgate magnetic field sensor |
| US7480435B2 (en) | 2005-12-30 | 2009-01-20 | Intel Corporation | Embedded waveguide printed circuit board structure |
| TW200905703A (en) * | 2007-07-27 | 2009-02-01 | Delta Electronics Inc | Magnetic device and manufacturing method thereof |
| US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
| JP5815353B2 (ja) * | 2011-09-28 | 2015-11-17 | 株式会社フジクラ | コイル配線素子およびコイル配線素子の製造方法 |
| US9293245B2 (en) * | 2013-08-05 | 2016-03-22 | Qualcomm Mems Technologies, Inc. | Integration of a coil and a discontinuous magnetic core |
-
2014
- 2014-10-01 EP EP14780474.4A patent/EP3055871A1/en not_active Withdrawn
- 2014-10-01 KR KR1020167011943A patent/KR20160067940A/ko not_active Ceased
- 2014-10-01 SG SG11201602499TA patent/SG11201602499TA/en unknown
- 2014-10-01 US US15/027,286 patent/US9825347B2/en not_active Expired - Fee Related
- 2014-10-01 WO PCT/EP2014/071079 patent/WO2015052059A1/en not_active Ceased
- 2014-10-01 JP JP2016517478A patent/JP6293875B2/ja not_active Expired - Fee Related
- 2014-10-01 CN CN201480066647.2A patent/CN105814655B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201602499TA (en) | 2016-04-28 |
| CN105814655A (zh) | 2016-07-27 |
| KR20160067940A (ko) | 2016-06-14 |
| US9825347B2 (en) | 2017-11-21 |
| US20160254579A1 (en) | 2016-09-01 |
| JP6293875B2 (ja) | 2018-04-25 |
| WO2015052059A1 (en) | 2015-04-16 |
| EP3055871A1 (en) | 2016-08-17 |
| JP2016535930A (ja) | 2016-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180807 Termination date: 20201001 |