JP2016533029A5 - - Google Patents

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JP2016533029A5
JP2016533029A5 JP2016528617A JP2016528617A JP2016533029A5 JP 2016533029 A5 JP2016533029 A5 JP 2016533029A5 JP 2016528617 A JP2016528617 A JP 2016528617A JP 2016528617 A JP2016528617 A JP 2016528617A JP 2016533029 A5 JP2016533029 A5 JP 2016533029A5
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Japan
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growth substrate
substrate
forming
thinning
sapphire substrate
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JP2016528617A
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Japanese (ja)
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JP2016533029A (ja
JP6429872B2 (ja
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Priority claimed from PCT/IB2014/062784 external-priority patent/WO2015011583A1/en
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Publication of JP2016533029A5 publication Critical patent/JP2016533029A5/ja
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JP2016528617A 2013-07-22 2014-07-02 基板ウェハ上に形成された発光デバイスを分離する方法 Active JP6429872B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361856857P 2013-07-22 2013-07-22
US61/856,857 2013-07-22
PCT/IB2014/062784 WO2015011583A1 (en) 2013-07-22 2014-07-02 Method of separating light emitting devices formed on a substrate wafer

Related Child Applications (1)

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JP2018203388A Division JP2019033280A (ja) 2013-07-22 2018-10-30 基板ウェハ上に形成された発光デバイスを分離する方法

Publications (3)

Publication Number Publication Date
JP2016533029A JP2016533029A (ja) 2016-10-20
JP2016533029A5 true JP2016533029A5 (OSRAM) 2017-08-10
JP6429872B2 JP6429872B2 (ja) 2018-11-28

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JP2016528617A Active JP6429872B2 (ja) 2013-07-22 2014-07-02 基板ウェハ上に形成された発光デバイスを分離する方法
JP2018203388A Pending JP2019033280A (ja) 2013-07-22 2018-10-30 基板ウェハ上に形成された発光デバイスを分離する方法

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JP2018203388A Pending JP2019033280A (ja) 2013-07-22 2018-10-30 基板ウェハ上に形成された発光デバイスを分離する方法

Country Status (7)

Country Link
US (3) US10079327B2 (OSRAM)
EP (1) EP3025378B1 (OSRAM)
JP (2) JP6429872B2 (OSRAM)
KR (1) KR102231083B1 (OSRAM)
CN (1) CN105556684B (OSRAM)
TW (2) TWI726494B (OSRAM)
WO (1) WO2015011583A1 (OSRAM)

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WO2022141233A1 (zh) * 2020-12-30 2022-07-07 泉州三安半导体科技有限公司 一种半导体发光元件及其制备方法
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