JP2016522963A - 少なくとも1つの折り目を含む回路ボード - Google Patents
少なくとも1つの折り目を含む回路ボード Download PDFInfo
- Publication number
- JP2016522963A JP2016522963A JP2016511062A JP2016511062A JP2016522963A JP 2016522963 A JP2016522963 A JP 2016522963A JP 2016511062 A JP2016511062 A JP 2016511062A JP 2016511062 A JP2016511062 A JP 2016511062A JP 2016522963 A JP2016522963 A JP 2016522963A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit board
- fold
- light source
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0058—Reflectors for light sources adapted to cooperate with light sources of shapes different from point-like or linear, e.g. circular light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/048—Optical design with facets structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/10—Construction
- F21V7/18—Construction with provision for folding or collapsing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (15)
- 照明デバイスの少なくとも1つの光源を担持する回路ボードであって、
基板を含み、
前記基板は、突出部を形成し、前記基板の周縁から前記基板の内側部分まで延在する少なくとも1つの折り目を含み、これにより、前記基板は、多角形のファンネル形状を有する、回路ボード。 - 前記少なくとも1つの折り目は、少なくとも1つの折線と、前記少なくとも1つの折線の両側にある前記基板の2つの部分とを含む、請求項1に記載の回路ボード。
- 前記基板の前記2つの部分の間の角度は、0乃至90°の間隔、好適には0乃至45°の間隔、最も好適には0乃至10°の間隔に含まれる、請求項2に記載の回路ボード。
- 前記2つの部分は、少なくとも部分的に互いに当接する、請求項2又は3に記載の回路ボード。
- 前記少なくとも1つの折り目は、前記基板の前記周縁の別々の点から、共通の点に向かって延在する少なくとも2つの折線を含む、請求項1乃至4の何れか一項に記載の回路ボード。
- 前記少なくとも1つの折り目の奥行きは、前記基板の前記内側部分から、前記基板の前記周縁に向かう方向において増加する、請求項1乃至5の何れか一項に記載の回路ボード。
- 前記基板は、多角形であり、
前記少なくとも1つの折り目は、前記多角形の一角から、前記基板の前記内側部分に延在する、請求項1乃至6の何れか一項に記載の回路ボード。 - 前記少なくとも1つの折り目は、前記多角形のファンネル形状の内側に突出する、請求項1乃至7の何れか一項に記載の回路ボード。
- 前記少なくとも1つの折り目は、前記少なくとも1つの光源によって生成される熱を散逸する、請求項1乃至8の何れか一項に記載の回路ボード。
- 前記基板は、金属といった少なくとも1W/(mK)の熱伝導率を有する材料を含む、請求項1乃至9の何れか一項に記載の回路ボード。
- 前記少なくとも1つの光源によって放出される光を反射するように、前記基板に配置される反射面を更に含む、請求項1乃至10の何れか一項に記載の回路ボード。
- 前記少なくとも1つの光源によって放出される光を反射するように配置される反射性はんだレジストを更に含む、請求項1乃至11の何れか一項に記載の回路ボード。
- 前記基板を前記多角形のファンネル形状に支持するように、前記基板の前記多角形のファンネル形状の円周の周りに少なくとも部分的に延在するばねを更に含む、請求項1乃至12の何れか一項に記載の回路ボード。
- 請求項1乃至13の何れか一項に記載の回路ボードと、
前記回路ボードに結合される少なくとも1つの光源と、
を含む、照明デバイス。 - 照明デバイスの少なくとも1つの光源を担持する回路ボードを製造する方法であって、
基板を提供するステップと、
突出部を形成し、前記基板の周縁から前記基板の内側部分まで延在する少なくとも1つの折り目を形成し、これにより、前記基板が多角形のファンネル形状を得るように、前記基板を折り畳むステップと、
を含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13166495.5 | 2013-05-03 | ||
EP13166495 | 2013-05-03 | ||
PCT/EP2014/058844 WO2014177625A1 (en) | 2013-05-03 | 2014-04-30 | Circuit board comprising at least one fold |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016522963A true JP2016522963A (ja) | 2016-08-04 |
Family
ID=48463706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016511062A Pending JP2016522963A (ja) | 2013-05-03 | 2014-04-30 | 少なくとも1つの折り目を含む回路ボード |
Country Status (6)
Country | Link |
---|---|
US (1) | US9872381B2 (ja) |
EP (1) | EP2992742B8 (ja) |
JP (1) | JP2016522963A (ja) |
CN (1) | CN105210457B (ja) |
RU (1) | RU2015151853A (ja) |
WO (1) | WO2014177625A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3094161B1 (en) * | 2015-05-08 | 2017-10-18 | OSRAM GmbH | A lighting device and corresponding method |
CN106545756A (zh) * | 2016-10-18 | 2017-03-29 | 上海顿格电子贸易有限公司 | 一种通用led基板 |
DE102017114235B4 (de) * | 2017-06-27 | 2020-01-02 | Bjb Gmbh & Co. Kg | Leuchte für die Raum- und Gebäudebeleuchtung |
US10948140B2 (en) * | 2017-09-11 | 2021-03-16 | Signify Holding B.V. | LED strips with conical structure for collimated light emission |
DE102017127094A1 (de) * | 2017-11-17 | 2019-05-23 | CONDA Technik und Form GmbH | Leuchtenkörper |
CN108131652B (zh) * | 2017-12-06 | 2020-05-19 | 梁栋 | 散热装置及其制造方法 |
CN208780959U (zh) * | 2018-10-30 | 2019-04-23 | 京东方科技集团股份有限公司 | 一种反射片、背光模组以及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340184A (ja) * | 2004-04-30 | 2005-12-08 | Du Pont Toray Co Ltd | Led照明装置 |
WO2006080301A1 (ja) * | 2005-01-25 | 2006-08-03 | The Furukawa Electric Co., Ltd. | 電子部品実装配線体および電子部品実装構造体 |
JP2011249534A (ja) * | 2010-05-26 | 2011-12-08 | Daisho Denshi Co Ltd | 折り曲げ可能配線基板、発光モジュール、発光モジュールの製造方法、折り曲げ可能配線基板の製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0636620A (ja) | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | フレキシブルフラットケーブル |
US5519596A (en) * | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
JP2004363352A (ja) * | 2003-06-05 | 2004-12-24 | Keyence Corp | 紫外線照射装置 |
US20080271913A1 (en) | 2005-01-25 | 2008-11-06 | Noritsugu Enomoto | Three-Dimensional Wiring Body for Mounting Electronic Component and Electronic Component Mounting Structure |
DE102007046639A1 (de) * | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Dreidimensionale bestückte elektrische Leiterplattenanordnungen, insbesondere LED-Beleuchtungseinrichtungen, und Verfahren zu deren Herstellung |
JP4621799B1 (ja) * | 2009-05-22 | 2011-01-26 | シャープ株式会社 | 光反射シート、光源装置及び表示装置 |
IT1396164B1 (it) | 2009-07-27 | 2012-11-16 | Venturini | Faro a led |
JP5333765B2 (ja) | 2009-08-07 | 2013-11-06 | 中村製作所株式会社 | 発光モジュール用プリント基板 |
US8829771B2 (en) * | 2009-11-09 | 2014-09-09 | Lg Innotek Co., Ltd. | Lighting device |
DE102009054840A1 (de) | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
JP5323668B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | 照明装置及びその製造方法 |
JP5853374B2 (ja) * | 2010-03-12 | 2016-02-09 | オムロン株式会社 | 照明装置 |
JP2011249536A (ja) | 2010-05-26 | 2011-12-08 | Daisho Denshi Co Ltd | 折り曲げ可能配線基板、発光モジュール、発光モジュールの製造方法、折り曲げ可能配線基板の製造方法 |
JP5914839B2 (ja) | 2010-10-25 | 2016-05-11 | パナソニックIpマネジメント株式会社 | 発光装置及びそれを備えた照明器具 |
TWI446602B (zh) | 2011-06-13 | 2014-07-21 | Subtron Technology Co Ltd | 封裝載板及封裝結構 |
CN102595788B (zh) * | 2012-03-05 | 2015-02-04 | 蔡子丰 | 发光灯具中的三维金属基pcb电路板组件结构的制造方法 |
CN202652681U (zh) * | 2012-06-08 | 2013-01-02 | 王定锋 | Led三维电路板 |
-
2014
- 2014-04-30 US US14/888,789 patent/US9872381B2/en active Active
- 2014-04-30 WO PCT/EP2014/058844 patent/WO2014177625A1/en active Application Filing
- 2014-04-30 EP EP14721344.1A patent/EP2992742B8/en active Active
- 2014-04-30 CN CN201480024976.0A patent/CN105210457B/zh active Active
- 2014-04-30 RU RU2015151853A patent/RU2015151853A/ru not_active Application Discontinuation
- 2014-04-30 JP JP2016511062A patent/JP2016522963A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340184A (ja) * | 2004-04-30 | 2005-12-08 | Du Pont Toray Co Ltd | Led照明装置 |
WO2006080301A1 (ja) * | 2005-01-25 | 2006-08-03 | The Furukawa Electric Co., Ltd. | 電子部品実装配線体および電子部品実装構造体 |
JP2011249534A (ja) * | 2010-05-26 | 2011-12-08 | Daisho Denshi Co Ltd | 折り曲げ可能配線基板、発光モジュール、発光モジュールの製造方法、折り曲げ可能配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105210457B (zh) | 2019-03-08 |
EP2992742A1 (en) | 2016-03-09 |
RU2015151853A (ru) | 2017-06-08 |
WO2014177625A1 (en) | 2014-11-06 |
EP2992742B1 (en) | 2018-12-05 |
CN105210457A (zh) | 2015-12-30 |
US20160088721A1 (en) | 2016-03-24 |
EP2992742B8 (en) | 2019-01-09 |
US9872381B2 (en) | 2018-01-16 |
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