JP2016516279A - リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法 - Google Patents

リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法 Download PDF

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JP2016516279A
JP2016516279A JP2016502299A JP2016502299A JP2016516279A JP 2016516279 A JP2016516279 A JP 2016516279A JP 2016502299 A JP2016502299 A JP 2016502299A JP 2016502299 A JP2016502299 A JP 2016502299A JP 2016516279 A JP2016516279 A JP 2016516279A
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separator
layer
range
polypropylene
battery
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JP2016516279A5 (enExample
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シ，リー
ヴィ． ワトソン，ジル
ヴィ． ワトソン，ジル
コール，ロナルド，ダブリュー．
スミス，ロニー，イー．
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セルガード エルエルシー
セルガード エルエルシー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
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    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
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    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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    • H01—ELECTRIC ELEMENTS
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    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
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    • H01M50/489—Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Cell Separators (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2016502299A 2013-03-15 2014-03-14 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法 Pending JP2016516279A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361792722P 2013-03-15 2013-03-15
US61/792,722 2013-03-15
PCT/US2014/026983 WO2014152130A1 (en) 2013-03-15 2014-03-14 Multilayer hybrid battery separators for lithium ion secondary batteries and methods of making same

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JP2018228429A Division JP2019054003A (ja) 2013-03-15 2018-12-05 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法

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JP2016516279A true JP2016516279A (ja) 2016-06-02
JP2016516279A5 JP2016516279A5 (enExample) 2017-10-12

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JP2016502299A Pending JP2016516279A (ja) 2013-03-15 2014-03-14 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法
JP2018228429A Pending JP2019054003A (ja) 2013-03-15 2018-12-05 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよびその製造方法
JP2020144295A Active JP7483562B2 (ja) 2013-03-15 2020-08-28 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよび電池

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JP2020144295A Active JP7483562B2 (ja) 2013-03-15 2020-08-28 リチウム・イオン二次電池用の多層ハイブリッド電池セパレータおよび電池

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US (4) US9455432B2 (enExample)
JP (3) JP2016516279A (enExample)
KR (2) KR102226140B1 (enExample)
CN (3) CN109360927A (enExample)
WO (1) WO2014152130A1 (enExample)

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WO2013009750A2 (en) 2011-07-11 2013-01-17 California Institute Of Technology Novel separators for electrochemical systems
US9379368B2 (en) 2011-07-11 2016-06-28 California Institute Of Technology Electrochemical systems with electronically conductive layers
KR20150066532A (ko) * 2012-10-08 2015-06-16 트레오판 저머니 게엠베하 앤 코. 카게 균질한 다공성과 천공에 대해 더 큰 저항성을 가지는 미세다공성 분리막 필름
US10714724B2 (en) 2013-11-18 2020-07-14 California Institute Of Technology Membranes for electrochemical cells
WO2015074037A2 (en) 2013-11-18 2015-05-21 California Institute Of Technology Separator enclosures for electrodes and electrochemical cells
CN105470433B (zh) * 2014-09-29 2020-06-23 株式会社杰士汤浅国际 蓄电元件和蓄电元件的制造方法
US10256447B2 (en) * 2015-06-03 2019-04-09 Celgard, Llc Low electrical resistance microporous battery separator membranes, separators, cells, batteries, and related methods
CN105330937A (zh) * 2015-11-17 2016-02-17 梅庆波 一种湿法制备聚乙烯塑料聚合物的方法
US10340528B2 (en) 2015-12-02 2019-07-02 California Institute Of Technology Three-dimensional ion transport networks and current collectors for electrochemical cells
US9780060B2 (en) * 2015-12-03 2017-10-03 Texas Instruments Incorporated Packaged IC with solderable sidewalls
US10050013B2 (en) * 2015-12-29 2018-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Packaged semiconductor devices and packaging methods
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
WO2017212597A1 (ja) * 2016-06-08 2017-12-14 日産自動車株式会社 非水電解質二次電池
US20170373011A1 (en) * 2016-06-28 2017-12-28 General Electric Company Semiconductor die backside devices and methods of fabrication thereof
KR101959263B1 (ko) * 2016-08-26 2019-03-19 더블유스코프코리아 주식회사 우수한 인성 및 내열수축성을 가지는 리튬이차전지용 분리막 필름 및 이의 제조방법
KR101964055B1 (ko) * 2016-09-20 2019-04-02 더블유스코프코리아 주식회사 다공성 분리막 및 그 제조방법
KR101964056B1 (ko) * 2016-09-22 2019-04-03 더블유스코프코리아 주식회사 리튬이차전지용 폴리올레핀 분리막 다층 필름 및 이의 제조방법
US11165121B2 (en) 2016-11-07 2021-11-02 Celgard, Llc Additives for improved battery performance, improved additive-containing membranes, improved battery separators, improved batteries, and related methods
EP3539173A4 (en) 2016-11-11 2020-10-28 Celgard LLC IMPROVED MICROLAYER MEMBRANES, IMPROVED BATTERY SEPARATORS AND RELATED PROCESSES
US20210126319A1 (en) * 2017-05-26 2021-04-29 Ceigard, LLC New or improved microporous membranes, battery separators, coated separators, batteries, and related methods
US10763242B2 (en) 2017-06-23 2020-09-01 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US10804115B2 (en) 2017-08-03 2020-10-13 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541153B2 (en) * 2017-08-03 2020-01-21 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541209B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
US10741466B2 (en) 2017-11-17 2020-08-11 Infineon Technologies Ag Formation of conductive connection tracks in package mold body using electroless plating
KR102439828B1 (ko) * 2017-11-30 2022-09-01 주식회사 엘지에너지솔루션 리튬 음극 호스트용 다공성 고분자 막 및 이를 포함하는 리튬 이차전지
CN110010559B (zh) 2017-12-08 2024-09-06 英飞凌科技股份有限公司 具有空气腔体的半导体封装件
CN108305975B (zh) * 2018-01-09 2021-04-20 深圳中兴新材技术股份有限公司 一种用于锂离子电池的复合隔膜及其制备方法
CN108305979B (zh) * 2018-01-09 2021-06-29 深圳中兴新材技术股份有限公司 复合隔膜及其制备方法和应用
CN108336280B (zh) * 2018-01-09 2021-09-14 深圳中兴新材技术股份有限公司 一种复合隔膜及其制备方法和应用
CN110364666B (zh) * 2018-04-11 2022-05-24 宁德新能源科技有限公司 隔离膜和锂离子电池
EP3847709A4 (en) * 2018-09-07 2022-06-08 Applied Materials, Inc. CERAMIC COATING ON SEPARATOR FOR BATTERIES
JP7152106B2 (ja) * 2018-10-30 2022-10-12 帝人株式会社 ポリオレフィン微多孔膜及び液体フィルター
CN109980156B (zh) * 2018-12-24 2024-04-26 中材锂膜有限公司 一种湿法锂离子电池隔膜用除油装置
US11217659B1 (en) 2019-01-24 2022-01-04 Matthew W. Barlow Direct application additive manufacturing for conductive wafer interconnect
CN109980164A (zh) 2019-03-18 2019-07-05 宁德新能源科技有限公司 隔离膜和电化学装置
US10796981B1 (en) 2019-04-04 2020-10-06 Infineon Technologies Ag Chip to lead interconnect in encapsulant of molded semiconductor package
US11133281B2 (en) 2019-04-04 2021-09-28 Infineon Technologies Ag Chip to chip interconnect in encapsulant of molded semiconductor package
CN112018052A (zh) 2019-05-31 2020-12-01 英飞凌科技奥地利有限公司 具有可激光活化模制化合物的半导体封装
US11101541B2 (en) * 2019-10-03 2021-08-24 Advanced Semiconductor Engineering, Inc. Semiconductor assembly and method for manufacturing the same
KR102832317B1 (ko) * 2020-02-07 2025-07-11 삼성전자주식회사 반도체 패키지
EP4132783A4 (en) * 2020-04-17 2024-05-08 Celgard LLC ASYMMETRICAL POROUS MEMBRANE
US11587800B2 (en) 2020-05-22 2023-02-21 Infineon Technologies Ag Semiconductor package with lead tip inspection feature
JP2024510855A (ja) * 2022-02-21 2024-03-12 寧徳時代新能源科技股▲分▼有限公司 電池、電力消費装置、電池の製造方法及び装置
EP4700961A2 (en) 2022-02-23 2026-02-25 LG Energy Solution, Ltd. Substrate for separator of electrochemical device, separator including same, and method of forming battery cell separator
TWI819653B (zh) * 2022-06-13 2023-10-21 群創光電股份有限公司 電子裝置與形成電子裝置的方法
CN117276239A (zh) * 2022-06-13 2023-12-22 群创光电股份有限公司 电子装置与形成电子装置的方法
US12706351B2 (en) * 2022-12-27 2026-08-11 Rivian Ip Holdings, Llc Battery membranes and components thereof
JP2025536601A (ja) * 2023-03-17 2025-11-07 香港時代新能源科技有限公司 セパレータ、二次電池と電力消費装置
CN119275488A (zh) * 2023-07-06 2025-01-07 宁德时代新能源科技股份有限公司 隔离膜、制备方法、二次电池和用电装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001150583A (ja) * 1999-11-25 2001-06-05 Ube Ind Ltd 複合多孔質フィルム及びその製造方法
JP2009160933A (ja) * 2007-12-26 2009-07-23 Sk Energy Co Ltd ポリオレフィン系微多孔膜及びその製造方法
JP2010245028A (ja) * 2009-03-19 2010-10-28 Asahi Kasei E-Materials Corp 積層微多孔膜及び非水電解質二次電池用セパレータ

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539256A (en) 1982-09-09 1985-09-03 Minnesota Mining And Manufacturing Co. Microporous sheet material, method of making and articles made therewith
JPS60242035A (ja) 1984-04-27 1985-12-02 Toa Nenryo Kogyo Kk ポリエチレン微多孔膜の製造方法
JPS60228122A (ja) 1984-04-27 1985-11-13 Toa Nenryo Kogyo Kk ポリエチレン極薄フイルムの製造方法
JP3352801B2 (ja) 1994-01-31 2002-12-03 日東電工株式会社 多孔質フィルム、その製造法およびその用途
DE69514711T2 (de) 1994-05-12 2000-05-31 Ube Industries, Ltd. Poröser mehrschichtiger Film
US5667911A (en) 1994-11-17 1997-09-16 Hoechst Celanese Corporation Methods of making cross-ply microporous membrane battery separator, and the battery separators made thereby
TW297171B (enExample) 1994-12-20 1997-02-01 Hoechst Celanese Corp
US5922492A (en) 1996-06-04 1999-07-13 Tonen Chemical Corporation Microporous polyolefin battery separator
US5952120A (en) 1997-04-15 1999-09-14 Celgard Llc Method of making a trilayer battery separator
KR100667052B1 (ko) * 1999-02-19 2007-01-10 토넨 케미칼 코퍼레이션 폴리올레핀 미세다공성 막과 그의 제조방법
US6602593B1 (en) * 1999-08-30 2003-08-05 Celgard Inc. Battery separators with reduced splitting propensity
CA2392547A1 (en) 1999-12-09 2001-06-14 Ntk Powerdex, Inc. Battery separator for li-ion and/or li-ion polymer battery
US20020136945A1 (en) * 2000-01-18 2002-09-26 Call Ronald W. Multilayer battery separators
JP4931163B2 (ja) * 2001-04-24 2012-05-16 旭化成イーマテリアルズ株式会社 ポリオレフィン製微多孔膜
US20050112462A1 (en) * 2003-11-21 2005-05-26 Marple Jack W. High discharge capacity lithium battery
US20050031943A1 (en) * 2003-08-07 2005-02-10 Call Ronald W. Battery separator and method of making same
US20070238017A1 (en) * 2006-04-07 2007-10-11 Celgard Llc Multilayer separator exhibiting improved strength and stability
JP5202816B2 (ja) 2006-04-07 2013-06-05 東レバッテリーセパレータフィルム株式会社 ポリオレフィン微多孔膜及びその製造方法
US10003058B2 (en) * 2006-11-17 2018-06-19 Celgard, Llc Method of making a co-extruded, multi-layered battery separator
US8748028B2 (en) * 2007-11-02 2014-06-10 Toray Battery Separator Film Co. Ltd. Multi-layer microporous membrane, battery separator and battery
KR101347460B1 (ko) * 2007-10-12 2014-01-03 도레이 배터리 세퍼레이터 필름 주식회사 미세다공성 막 및 이의 제조 및 사용 방법
KR101437852B1 (ko) * 2007-12-26 2014-09-04 에스케이이노베이션 주식회사 다층 폴리올레핀계 미세다공막 및 그 제조방법
JP2010024502A (ja) 2008-07-22 2010-02-04 Sumitomo Light Metal Ind Ltd 電解コンデンサ電極用アルミニウム箔
CN103311484A (zh) * 2008-09-03 2013-09-18 三菱树脂株式会社 隔板用叠层多孔膜
EP2572880B1 (en) * 2008-11-10 2015-02-25 Mitsubishi Plastics, Inc. Laminated porous film, separator for lithium cell and cell
US9453805B2 (en) * 2010-01-19 2016-09-27 Celgard, Llc X-ray sensitive battery separators and related methods
US9196509B2 (en) * 2010-02-16 2015-11-24 Deca Technologies Inc Semiconductor device and method of adaptive patterning for panelized packaging
CN102195020A (zh) * 2010-03-04 2011-09-21 赛尔格有限责任公司 一种防止或减少锂离子电池突然热失控的方法
CN106960931A (zh) * 2010-08-02 2017-07-18 赛尔格有限责任公司 高熔温微孔锂离子可充电电池的隔板及其制备与使用方法
KR20120109258A (ko) * 2011-03-28 2012-10-08 삼성전기주식회사 이차 전지 섬유상 분리막 및 그 제조 방법
US9331029B2 (en) * 2014-03-13 2016-05-03 Freescale Semiconductor Inc. Microelectronic packages having mold-embedded traces and methods for the production thereof
US9502397B1 (en) * 2015-04-29 2016-11-22 Deca Technologies, Inc. 3D interconnect component for fully molded packages

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001150583A (ja) * 1999-11-25 2001-06-05 Ube Ind Ltd 複合多孔質フィルム及びその製造方法
JP2009160933A (ja) * 2007-12-26 2009-07-23 Sk Energy Co Ltd ポリオレフィン系微多孔膜及びその製造方法
JP2010245028A (ja) * 2009-03-19 2010-10-28 Asahi Kasei E-Materials Corp 積層微多孔膜及び非水電解質二次電池用セパレータ

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