CN105122502A - 用于锂离子二次电池的多层混杂型电池隔板及其制造方法 - Google Patents

用于锂离子二次电池的多层混杂型电池隔板及其制造方法 Download PDF

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CN105122502A
CN105122502A CN201480015019.1A CN201480015019A CN105122502A CN 105122502 A CN105122502 A CN 105122502A CN 201480015019 A CN201480015019 A CN 201480015019A CN 105122502 A CN105122502 A CN 105122502A
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separator
layer
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polypropylene
wet
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Chinese (zh)
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石烈
吉尔·V·沃森
罗纳德·W·考尔
罗尼·E·史密斯
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Celgard LLC
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Celgard LLC
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Priority to CN201911015617.XA priority Critical patent/CN110767864A/zh
Priority to CN201811466451.9A priority patent/CN109360927A/zh
Publication of CN105122502A publication Critical patent/CN105122502A/zh
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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/44—Fibrous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403—Manufacturing processes of separators, membranes or diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/403—Manufacturing processes of separators, membranes or diaphragms
    • H01M50/406—Moulding; Embossing; Cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/411—Organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/411—Organic material
    • H01M50/414—Synthetic resins, e.g. thermoplastics or thermosetting resins
    • H01M50/417—Polyolefins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/449—Separators, membranes or diaphragms characterised by the material having a layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/463—Separators, membranes or diaphragms characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489—Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489—Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H01M50/491—Porosity
    • H—ELECTRICITY
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/489—Separators, membranes, diaphragms or spacing elements inside the cells, characterised by their physical properties, e.g. swelling degree, hydrophilicity or shut down properties
    • H01M50/494—Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/22—All layers being foamed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/246—All polymers belonging to those covered by groups B32B27/32 and B32B27/30
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/025—Polyolefin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/10—Batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Cell Separators (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201480015019.1A 2013-03-15 2014-03-14 用于锂离子二次电池的多层混杂型电池隔板及其制造方法 Pending CN105122502A (zh)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107925035A (zh) * 2015-06-03 2018-04-17 赛尔格有限责任公司 改进的低电阻抗微孔电池隔膜、隔板、电池单元、电池及相关方法
CN108305979A (zh) * 2018-01-09 2018-07-20 深圳中兴创新材料技术有限公司 复合隔膜及其制备方法和应用
CN108305975A (zh) * 2018-01-09 2018-07-20 深圳中兴创新材料技术有限公司 一种用于锂离子电池的复合隔膜及其制备方法
CN108336280A (zh) * 2018-01-09 2018-07-27 深圳中兴创新材料技术有限公司 一种复合隔膜及其制备方法和应用
CN110168773A (zh) * 2016-11-11 2019-08-23 赛尔格有限责任公司 改进的微米层膜、改进的电池隔板及相关方法
CN110364666A (zh) * 2018-04-11 2019-10-22 宁德新能源科技有限公司 隔离膜和锂离子电池
CN110998910A (zh) * 2017-05-26 2020-04-10 赛尔格有限责任公司 新的或改进的微孔膜、电池隔板、被涂覆的隔板、电池及相关方法

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103650204B (zh) 2011-07-11 2016-11-16 加州理工学院 用于电化学系统的新颖分隔物
US9379368B2 (en) 2011-07-11 2016-06-28 California Institute Of Technology Electrochemical systems with electronically conductive layers
WO2014056591A1 (de) * 2012-10-08 2014-04-17 Treofan Germany Gmbh & Co. Kg Mikroporöse separator-folie mit homogener porosität und erhöhter durchstossfestigkeit
US9991492B2 (en) 2013-11-18 2018-06-05 California Institute Of Technology Separator enclosures for electrodes and electrochemical cells
US10714724B2 (en) 2013-11-18 2020-07-14 California Institute Of Technology Membranes for electrochemical cells
US11283136B2 (en) * 2014-09-29 2022-03-22 Gs Yuasa International Ltd. Energy storage device and method of producing energy storage device
CN105330937A (zh) * 2015-11-17 2016-02-17 梅庆波 一种湿法制备聚乙烯塑料聚合物的方法
WO2017096258A1 (en) 2015-12-02 2017-06-08 California Institute Of Technology Three-dimensional ion transport networks and current collectors for electrochemical cells
US9780060B2 (en) * 2015-12-03 2017-10-03 Texas Instruments Incorporated Packaged IC with solderable sidewalls
US10050013B2 (en) * 2015-12-29 2018-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Packaged semiconductor devices and packaging methods
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
US20190221880A1 (en) * 2016-06-08 2019-07-18 Nissan Motor Co., Ltd. Nonaqueous Electrolyte Secondary Battery
US20170373011A1 (en) * 2016-06-28 2017-12-28 General Electric Company Semiconductor die backside devices and methods of fabrication thereof
KR101959263B1 (ko) * 2016-08-26 2019-03-19 더블유스코프코리아 주식회사 우수한 인성 및 내열수축성을 가지는 리튬이차전지용 분리막 필름 및 이의 제조방법
KR101964055B1 (ko) * 2016-09-20 2019-04-02 더블유스코프코리아 주식회사 다공성 분리막 및 그 제조방법
KR101964056B1 (ko) * 2016-09-22 2019-04-03 더블유스코프코리아 주식회사 리튬이차전지용 폴리올레핀 분리막 다층 필름 및 이의 제조방법
JP7421932B2 (ja) 2016-11-07 2024-01-25 セルガード エルエルシー 電池セパレーター
US10763242B2 (en) 2017-06-23 2020-09-01 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US10541153B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10541209B2 (en) 2017-08-03 2020-01-21 General Electric Company Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
US10804115B2 (en) 2017-08-03 2020-10-13 General Electric Company Electronics package with integrated interconnect structure and method of manufacturing thereof
US10741466B2 (en) 2017-11-17 2020-08-11 Infineon Technologies Ag Formation of conductive connection tracks in package mold body using electroless plating
KR102439828B1 (ko) * 2017-11-30 2022-09-01 주식회사 엘지에너지솔루션 리튬 음극 호스트용 다공성 고분자 막 및 이를 포함하는 리튬 이차전지
US10777536B2 (en) 2017-12-08 2020-09-15 Infineon Technologies Ag Semiconductor package with air cavity
EP3847709A4 (en) * 2018-09-07 2022-06-08 Applied Materials, Inc. Ceramic coating on separator for batteries
JP7152106B2 (ja) * 2018-10-30 2022-10-12 帝人株式会社 ポリオレフィン微多孔膜及び液体フィルター
CN109980156B (zh) * 2018-12-24 2024-04-26 中材锂膜有限公司 一种湿法锂离子电池隔膜用除油装置
US11217659B1 (en) 2019-01-24 2022-01-04 Matthew W. Barlow Direct application additive manufacturing for conductive wafer interconnect
CN117996356A (zh) 2019-03-18 2024-05-07 宁德新能源科技有限公司 隔离膜和电化学装置
US10796981B1 (en) 2019-04-04 2020-10-06 Infineon Technologies Ag Chip to lead interconnect in encapsulant of molded semiconductor package
US11133281B2 (en) 2019-04-04 2021-09-28 Infineon Technologies Ag Chip to chip interconnect in encapsulant of molded semiconductor package
CN112018052A (zh) 2019-05-31 2020-12-01 英飞凌科技奥地利有限公司 具有可激光活化模制化合物的半导体封装
US11101541B2 (en) * 2019-10-03 2021-08-24 Advanced Semiconductor Engineering, Inc. Semiconductor assembly and method for manufacturing the same
KR102832317B1 (ko) * 2020-02-07 2025-07-11 삼성전자주식회사 반도체 패키지
US20230155253A1 (en) * 2020-04-17 2023-05-18 Celgard, Llc Assymetric porous membrane
US11587800B2 (en) 2020-05-22 2023-02-21 Infineon Technologies Ag Semiconductor package with lead tip inspection feature
CN116325317B (zh) * 2022-02-21 2025-08-15 宁德时代新能源科技股份有限公司 电池、用电设备、制备电池的方法和设备
KR102566179B1 (ko) 2022-02-23 2023-08-11 주식회사 엘지에너지솔루션 전기화학소자용 분리막 기재, 상기 기재를 포함하는 분리막 및 전지 셀 분리막 형성방법
TWI819653B (zh) * 2022-06-13 2023-10-21 群創光電股份有限公司 電子裝置與形成電子裝置的方法
CN117276239A (zh) * 2022-06-13 2023-12-22 群创光电股份有限公司 电子装置与形成电子装置的方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1286502A (zh) * 1999-08-30 2001-03-07 思凯德公司 爆裂倾向降低的电池隔板
CN1294608A (zh) * 1999-02-19 2001-05-09 东燃化学株式会社 聚烯烃微多孔膜及其制造方法
JP2001150583A (ja) * 1999-11-25 2001-06-05 Ube Ind Ltd 複合多孔質フィルム及びその製造方法
CN1883065A (zh) * 2003-11-21 2006-12-20 永备电池有限公司 高放电容量锂电池
CN101174679A (zh) * 2006-04-07 2008-05-07 赛尔格有限责任公司 表现出改善强度和稳定性的多层隔板
CN101469078A (zh) * 2007-12-26 2009-07-01 Sk能源 微孔性聚烯烃多层膜及其制备方法
CN101536221A (zh) * 2006-11-17 2009-09-16 赛尔格有限责任公司 共挤出的多层电池隔板
CN101821876A (zh) * 2007-10-12 2010-09-01 东燃化学株式会社 微孔膜和此种膜的制造和使用方法
JP2010245028A (ja) * 2009-03-19 2010-10-28 Asahi Kasei E-Materials Corp 積層微多孔膜及び非水電解質二次電池用セパレータ
CN102141387A (zh) * 2010-01-19 2011-08-03 赛尔格有限责任公司 X射线敏感的电池隔板以及相关方法
CN102171855A (zh) * 2008-09-03 2011-08-31 三菱树脂株式会社 隔板用叠层多孔膜
CN102209632A (zh) * 2008-11-10 2011-10-05 三菱树脂株式会社 叠层多孔膜、锂电池用隔板及电池
WO2012018675A1 (en) * 2010-08-02 2012-02-09 Celgard, Llc High melt temperature microporous lithium-ion rechargeable battery separators and methods of preparation and use

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539256A (en) 1982-09-09 1985-09-03 Minnesota Mining And Manufacturing Co. Microporous sheet material, method of making and articles made therewith
JPS60242035A (ja) 1984-04-27 1985-12-02 Toa Nenryo Kogyo Kk ポリエチレン微多孔膜の製造方法
JPS60228122A (ja) 1984-04-27 1985-11-13 Toa Nenryo Kogyo Kk ポリエチレン極薄フイルムの製造方法
JP3352801B2 (ja) 1994-01-31 2002-12-03 日東電工株式会社 多孔質フィルム、その製造法およびその用途
DE69514711T2 (de) 1994-05-12 2000-05-31 Ube Industries, Ltd. Poröser mehrschichtiger Film
US5667911A (en) 1994-11-17 1997-09-16 Hoechst Celanese Corporation Methods of making cross-ply microporous membrane battery separator, and the battery separators made thereby
TW297171B (enExample) 1994-12-20 1997-02-01 Hoechst Celanese Corp
US5922492A (en) 1996-06-04 1999-07-13 Tonen Chemical Corporation Microporous polyolefin battery separator
US5952120A (en) 1997-04-15 1999-09-14 Celgard Llc Method of making a trilayer battery separator
JP2004500686A (ja) 1999-12-09 2004-01-08 日本特殊陶業株式会社 リチウムイオン電池用セパレータ及び／又はリチウムイオンポリマー電池
US20020136945A1 (en) * 2000-01-18 2002-09-26 Call Ronald W. Multilayer battery separators
JP4931163B2 (ja) 2001-04-24 2012-05-16 旭化成イーマテリアルズ株式会社 ポリオレフィン製微多孔膜
US20050031943A1 (en) * 2003-08-07 2005-02-10 Call Ronald W. Battery separator and method of making same
JP5202816B2 (ja) 2006-04-07 2013-06-05 東レバッテリーセパレータフィルム株式会社 ポリオレフィン微多孔膜及びその製造方法
US8748028B2 (en) 2007-11-02 2014-06-10 Toray Battery Separator Film Co. Ltd. Multi-layer microporous membrane, battery separator and battery
US8003204B2 (en) * 2007-12-26 2011-08-23 Sk Energy Co., Ltd. Microporous polyolefin multi layer film and preparing method thereof
JP2010024502A (ja) 2008-07-22 2010-02-04 Sumitomo Light Metal Ind Ltd 電解コンデンサ電極用アルミニウム箔
US9196509B2 (en) * 2010-02-16 2015-11-24 Deca Technologies Inc Semiconductor device and method of adaptive patterning for panelized packaging
CN102195020A (zh) * 2010-03-04 2011-09-21 赛尔格有限责任公司 一种防止或减少锂离子电池突然热失控的方法
KR20120109258A (ko) 2011-03-28 2012-10-08 삼성전기주식회사 이차 전지 섬유상 분리막 및 그 제조 방법
US9331029B2 (en) * 2014-03-13 2016-05-03 Freescale Semiconductor Inc. Microelectronic packages having mold-embedded traces and methods for the production thereof
US9502397B1 (en) * 2015-04-29 2016-11-22 Deca Technologies, Inc. 3D interconnect component for fully molded packages

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1294608A (zh) * 1999-02-19 2001-05-09 东燃化学株式会社 聚烯烃微多孔膜及其制造方法
CN1286502A (zh) * 1999-08-30 2001-03-07 思凯德公司 爆裂倾向降低的电池隔板
JP2001150583A (ja) * 1999-11-25 2001-06-05 Ube Ind Ltd 複合多孔質フィルム及びその製造方法
CN1883065A (zh) * 2003-11-21 2006-12-20 永备电池有限公司 高放电容量锂电池
CN101174679A (zh) * 2006-04-07 2008-05-07 赛尔格有限责任公司 表现出改善强度和稳定性的多层隔板
CN101536221A (zh) * 2006-11-17 2009-09-16 赛尔格有限责任公司 共挤出的多层电池隔板
CN101821876A (zh) * 2007-10-12 2010-09-01 东燃化学株式会社 微孔膜和此种膜的制造和使用方法
CN101469078A (zh) * 2007-12-26 2009-07-01 Sk能源 微孔性聚烯烃多层膜及其制备方法
CN102171855A (zh) * 2008-09-03 2011-08-31 三菱树脂株式会社 隔板用叠层多孔膜
CN102209632A (zh) * 2008-11-10 2011-10-05 三菱树脂株式会社 叠层多孔膜、锂电池用隔板及电池
JP2010245028A (ja) * 2009-03-19 2010-10-28 Asahi Kasei E-Materials Corp 積層微多孔膜及び非水電解質二次電池用セパレータ
CN102141387A (zh) * 2010-01-19 2011-08-03 赛尔格有限责任公司 X射线敏感的电池隔板以及相关方法
WO2012018675A1 (en) * 2010-08-02 2012-02-09 Celgard, Llc High melt temperature microporous lithium-ion rechargeable battery separators and methods of preparation and use

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107925035A (zh) * 2015-06-03 2018-04-17 赛尔格有限责任公司 改进的低电阻抗微孔电池隔膜、隔板、电池单元、电池及相关方法
CN107925035B (zh) * 2015-06-03 2021-12-10 赛尔格有限责任公司 一种改性聚烯烃电池隔膜
CN110168773A (zh) * 2016-11-11 2019-08-23 赛尔格有限责任公司 改进的微米层膜、改进的电池隔板及相关方法
CN110998910A (zh) * 2017-05-26 2020-04-10 赛尔格有限责任公司 新的或改进的微孔膜、电池隔板、被涂覆的隔板、电池及相关方法
TWI762647B (zh) * 2017-05-26 2022-05-01 美商希爾格得有限公司 新穎或經改良的微孔膜、電池組分隔件、經塗覆之分隔件、電池組及相關方法
TWI817413B (zh) * 2017-05-26 2023-10-01 美商希爾格得有限公司 新穎或經改良的微孔膜、電池組分隔件、經塗覆之分隔件、電池組及相關方法
CN108305979A (zh) * 2018-01-09 2018-07-20 深圳中兴创新材料技术有限公司 复合隔膜及其制备方法和应用
CN108305975A (zh) * 2018-01-09 2018-07-20 深圳中兴创新材料技术有限公司 一种用于锂离子电池的复合隔膜及其制备方法
CN108336280A (zh) * 2018-01-09 2018-07-27 深圳中兴创新材料技术有限公司 一种复合隔膜及其制备方法和应用
CN108305979B (zh) * 2018-01-09 2021-06-29 深圳中兴新材技术股份有限公司 复合隔膜及其制备方法和应用
CN108336280B (zh) * 2018-01-09 2021-09-14 深圳中兴新材技术股份有限公司 一种复合隔膜及其制备方法和应用
CN110364666A (zh) * 2018-04-11 2019-10-22 宁德新能源科技有限公司 隔离膜和锂离子电池

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