JP2016515298A5 - - Google Patents

Download PDF

Info

Publication number
JP2016515298A5
JP2016515298A5 JP2015558903A JP2015558903A JP2016515298A5 JP 2016515298 A5 JP2016515298 A5 JP 2016515298A5 JP 2015558903 A JP2015558903 A JP 2015558903A JP 2015558903 A JP2015558903 A JP 2015558903A JP 2016515298 A5 JP2016515298 A5 JP 2016515298A5
Authority
JP
Japan
Prior art keywords
particles
metal
polymer matrix
composite
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015558903A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016515298A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/016828 external-priority patent/WO2014130431A2/en
Publication of JP2016515298A publication Critical patent/JP2016515298A/ja
Publication of JP2016515298A5 publication Critical patent/JP2016515298A5/ja
Pending legal-status Critical Current

Links

JP2015558903A 2013-02-21 2014-02-18 電磁干渉軽減特性を有するポリマー複合物 Pending JP2016515298A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361767482P 2013-02-21 2013-02-21
US61/767,482 2013-02-21
PCT/US2014/016828 WO2014130431A2 (en) 2013-02-21 2014-02-18 Polymer composites with electromagnetic interference mitigation properties

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019071096A Division JP2019143149A (ja) 2013-02-21 2019-04-03 電磁干渉軽減特性を有するポリマー複合物

Publications (2)

Publication Number Publication Date
JP2016515298A JP2016515298A (ja) 2016-05-26
JP2016515298A5 true JP2016515298A5 (enExample) 2017-03-09

Family

ID=50239981

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015558903A Pending JP2016515298A (ja) 2013-02-21 2014-02-18 電磁干渉軽減特性を有するポリマー複合物
JP2019071096A Pending JP2019143149A (ja) 2013-02-21 2019-04-03 電磁干渉軽減特性を有するポリマー複合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019071096A Pending JP2019143149A (ja) 2013-02-21 2019-04-03 電磁干渉軽減特性を有するポリマー複合物

Country Status (5)

Country Link
US (3) US9704613B2 (enExample)
EP (1) EP2959490A2 (enExample)
JP (2) JP2016515298A (enExample)
CN (1) CN105009225B (enExample)
WO (1) WO2014130431A2 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340750B1 (ko) 2005-03-21 2013-12-12 쿠프론 인코포레이티드 항미생물-항바이러스 중합체 마스터 배치, 이로부터의 중합체 물질의 제조방법, 및 그의 제품
KR102183853B1 (ko) 2012-08-09 2020-11-27 이오에스 서페이시즈 엘엘시 항균 고체 표면, 및 이를 제조하기 위한 처리법 및 방법
CN105814979B (zh) 2013-12-18 2020-01-10 3M创新有限公司 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品
EP3192108B1 (en) * 2014-09-12 2019-03-27 SABIC Global Technologies B.V. Use of ambient-robust solution processing for preparing nanoscale organic ferroelectric films
US11369050B2 (en) 2015-06-09 2022-06-21 3M Innovative Properties Company High frequency electromagnetic interference (EMI) composites
US11058039B2 (en) 2015-12-29 2021-07-06 3M Innovative Properties Company Composites for high frequency electromagnetic interference (EMI) applications
AT518664B1 (de) * 2016-04-22 2017-12-15 Trench Austria Gmbh HGÜ-Luftdrosselspule und Verfahren zur Herstellung
CN109906672B (zh) * 2016-10-31 2021-03-26 3M创新有限公司 用于电磁干扰(emi)应用的高介电损耗复合材料
JP6757973B2 (ja) * 2016-11-18 2020-09-23 独立行政法人国立高等専門学校機構 複合素子の製造方法
CN106793727A (zh) * 2016-12-13 2017-05-31 苏州城邦达力材料科技有限公司 一种电磁屏蔽膜及其制备方法
US11434381B2 (en) 2017-03-06 2022-09-06 Bic-Violex Sa Coating
CN107129736B (zh) * 2017-04-17 2019-11-12 中国人民解放军61489部队 一种具有辐射屏蔽能力的放射性沾染控制与清除材料
CN107249291B (zh) * 2017-06-22 2019-02-05 朱勇 电力调度自动化系统用电磁屏蔽材料
CN107135641A (zh) * 2017-07-11 2017-09-05 苏州城邦达力材料科技有限公司 一种新型非金属体系的电磁屏蔽膜及其制备方法
CN107172873A (zh) * 2017-07-11 2017-09-15 苏州城邦达力材料科技有限公司 一种导电高分子材料电磁屏蔽膜及其制备方法
JP7286623B2 (ja) * 2018-03-30 2023-06-05 ダイキン工業株式会社 電波吸収材料および電波吸収シート
EP3776728A1 (en) 2018-04-06 2021-02-17 3M Innovative Properties Company Radar standing wave dampnening components and systems
JP6588596B2 (ja) * 2018-05-07 2019-10-09 藤森工業株式会社 粘着剤層及び粘着フィルム
WO2019220345A1 (en) 2018-05-16 2019-11-21 3M Innovative Properties Company Electric field grading composition, methods of making the same, and composite articles including the same
JP7264391B2 (ja) * 2018-07-11 2023-04-25 北川工業株式会社 熱伝導組成物
CN109111873A (zh) * 2018-08-06 2019-01-01 广州市花林景观工程有限公司 具有电磁屏蔽效果的建筑用塑料卷材
CN109021854A (zh) * 2018-08-06 2018-12-18 广州市花林景观工程有限公司 一种半导电塑料卷材结构
CN108912966A (zh) * 2018-08-06 2018-11-30 广州市花林景观工程有限公司 用于卫生间的多功能涂料的制备方法
WO2020041320A1 (en) * 2018-08-21 2020-02-27 Laird Technologies, Inc. Patterned materials and films and systems and methods for making the same
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020170608A1 (ja) * 2019-02-20 2020-08-27 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
JP6733857B1 (ja) * 2019-02-20 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
EP3942574B1 (en) 2019-03-18 2023-11-15 3M Innovative Properties Company Multilayer electric field grading article, methods of making the same, and articles including the same
JP6733858B1 (ja) * 2019-04-15 2020-08-05 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
WO2020213215A1 (ja) * 2019-04-15 2020-10-22 住友金属鉱山株式会社 電磁波吸収材料及び電磁波吸収体
CN110157346B (zh) * 2019-05-06 2021-05-07 费植煌 一种含石墨烯的装饰膜
JP2019206726A (ja) * 2019-09-12 2019-12-05 藤森工業株式会社 粘着剤層及び粘着フィルム
CN111826617A (zh) * 2019-11-06 2020-10-27 深圳科诺桥科技股份有限公司 电磁波屏蔽膜及其制备方法
US20230174774A1 (en) * 2020-05-29 2023-06-08 Kyocera Corporation Resin composition and electronic component
CN116671270A (zh) 2020-12-29 2023-08-29 3M创新有限公司 电磁吸收复合材料
WO2022144638A1 (en) 2020-12-29 2022-07-07 3M Innovative Properties Company Electromagnetic absorbing composites
CN112920451B (zh) * 2021-02-09 2021-11-16 复旦大学 一种金属碳化物太赫兹电磁屏蔽复合材料及其制备方法
EP4299661A4 (en) 2021-02-25 2025-01-15 Mitsui Chemicals, Inc. Electromagnetic-wave absorbing and thermally conductive material, and electromagnetic-wave absorbing and thermally conductive housing
WO2022214886A1 (en) 2021-04-08 2022-10-13 3M Innovative Properties Company Anti-reflective assemblies
CN116162373B (zh) * 2022-11-01 2023-11-10 开滦（集团）有限责任公司 一种基于二茂铁基聚合物包覆MXene复合材料的聚甲醛涂料及制备方法和应用
EP4421866A1 (en) * 2023-02-24 2024-08-28 Infineon Technologies AG Radio frequency semiconductor device and method for fabricating a radio frequency semiconductor device
CN116675560A (zh) * 2023-05-24 2023-09-01 中国人民解放军海军工程大学 一种高温泡沫陶瓷复合结构吸波材料及其制备方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671275A (en) 1969-12-12 1972-06-20 Hughes Aircraft Co Lossy dielectric structure for dissipating electrical microwave energy
JPS5418755B2 (enExample) * 1973-03-07 1979-07-10
JPS54100205A (en) * 1978-01-24 1979-08-07 Kansai Paint Co Ltd Radio wave absorbing paint composition
JPS54100203A (en) * 1978-01-24 1979-08-07 Kansai Paint Co Ltd Radio wave absorbing paint composition
JPS54116801A (en) * 1978-03-02 1979-09-11 Kansai Paint Co Ltd Radio wave absorbing corrosionnproof tape
US4538151A (en) * 1982-03-31 1985-08-27 Nippon Electric Co., Ltd. Electro-magnetic wave absorbing material
US4568603A (en) 1984-05-11 1986-02-04 Oldham Susan L Fiber-reinforced syntactic foam composites prepared from polyglycidyl aromatic amine and polycarboxylic acid anhydride
US5180513A (en) * 1987-02-06 1993-01-19 Key-Tech, Inc. Shielded plastic enclosure to house electronic equipment
US4963291A (en) * 1988-06-13 1990-10-16 Bercaw Robert M Insulating electromagnetic shielding resin composition
US5691498A (en) 1992-02-07 1997-11-25 Trw Inc. Hermetically-sealed electrically-absorptive low-pass radio frequency filters and electromagnetically lossy ceramic materials for said filters
US5324887A (en) 1992-06-26 1994-06-28 Texas Instruments Incorporated Screen printed of mask printed microwave absorbing material on module lids to suppress EMI
US6310141B1 (en) 2000-06-27 2001-10-30 Dyneon Llc Fluoropolymer-containing compositions
JP4038363B2 (ja) * 2000-12-25 2008-01-23 日本特殊陶業株式会社 配線基板
DE10112125A1 (de) * 2001-03-14 2002-10-10 Frey Juergen Verfahren zum Regeln von Prozessparametern zur Erzielung konstanter Prozessbedingungen
JP2004143347A (ja) * 2002-10-25 2004-05-20 Kyocera Corp 樹脂複合体及びこれを用いた電磁波吸収体並びにこれを用いた高周波回路用パッケージ
JP2004172200A (ja) * 2002-11-18 2004-06-17 Riken Corp 電波吸収材料及び電波吸収体
JP2004253640A (ja) * 2003-02-20 2004-09-09 Matsushita Electric Ind Co Ltd 電磁波吸収材料
US20040232389A1 (en) * 2003-05-22 2004-11-25 Elkovitch Mark D. Electrically conductive compositions and method of manufacture thereof
CN1470581A (zh) 2003-06-13 2004-01-28 长春恒威电磁兼容技术有限公司 高吸收轻量型电磁波吸收涂料
TW200516126A (en) * 2003-06-23 2005-05-16 Toray Industries Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
EP1502930A1 (en) * 2003-07-26 2005-02-02 ABC Taiwan Electronics Corp. Epoxy resin of electromagnetic interference suppression and manufacturing method thereof and an inductor applied in the electromagnetic interference suppression
JP2006107770A (ja) * 2004-09-30 2006-04-20 Sumitomo Bakelite Co Ltd 誘電体ペースト、キャパシタおよび基板
KR100907669B1 (ko) * 2007-06-26 2009-07-14 에스씨씨(주) 전자파 차폐를 위한 조성물
US7815820B2 (en) * 2007-10-18 2010-10-19 General Electric Company Electromagnetic interference shielding polymer composites and methods of manufacture
TWI405801B (zh) 2007-10-19 2013-08-21 Nat Univ Tsing Hua 具有電磁波干擾遮蔽效應之多壁碳奈米管／高分子奈米複合材之製備方法
KR20100028384A (ko) * 2008-09-04 2010-03-12 삼성전기주식회사 복합체 및 그의 제조방법
JP2011018873A (ja) 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
BR112012000203B1 (pt) * 2009-06-12 2020-01-28 Lord Corp método para proteção de um substrato contra relâmpagos
WO2011068819A2 (en) * 2009-12-02 2011-06-09 Laird Technologies, Inc. Stretched articles suitable for use as emi absorbers
JP2011142052A (ja) * 2010-01-08 2011-07-21 Hitachi Chem Co Ltd 銅導体インク及び導電性基板及びその製造方法
US20110228442A1 (en) * 2010-03-16 2011-09-22 Strategic Polymer Sciences, Inc. Capacitor having high temperature stability, high dielectric constant, low dielectric loss, and low leakage current
CN102241844B (zh) * 2010-05-11 2014-10-08 中国科学院深圳先进技术研究院 复合电介质材料及其制备方法
JP2012074668A (ja) * 2010-08-30 2012-04-12 Ist Corp 電波吸収体の製造方法、電波吸収体
EP2659757A2 (en) * 2010-12-28 2013-11-06 Saint-gobain Performance Plastics Corporation Polymers with metal filler for emi shielding
EP2774955A4 (en) * 2011-10-31 2015-06-24 Showa Denko Kk COMPOSITE, TRANSMISSION FILM, TRANSFER UNIT AND CONTACTLESS POWER TRANSMISSION SYSTEM THEREWITH
JP2013115004A (ja) * 2011-11-30 2013-06-10 Nippon Parkerizing Co Ltd 水系銅ペースト材料及び導電層の形成方法
JP2016509391A (ja) 2012-12-20 2016-03-24 スリーエム イノベイティブ プロパティズ カンパニー フローティングコネクタシールド

Similar Documents

Publication Publication Date Title
Tian et al. Application of nanomaterials in sample preparation
JP2017504177A5 (enExample)
WO2016156853A8 (en) Engineered polymer-based electronic materials
JP2015038961A5 (enExample)
JP2012064571A5 (enExample)
JP2015045858A5 (enExample)
JP2010059055A5 (enExample)
WO2014189549A3 (en) Carbon nanotube composite conductors
JP2015045857A5 (enExample)
WO2004077521A3 (en) Ceramic materials reinforced with single-wall carbon nanotubes as electrical conductors
JP2017520643A5 (enExample)
JP2008274047A5 (enExample)
JP2017522062A5 (enExample)
WO2014130431A3 (en) Polymer composites with electromagnetic interference mitigation properties
CN104975201A (zh) 纳米碳增强的铝复合材料及其制造方法
JP2017503880A5 (enExample)
JP2019001701A5 (enExample)
JP2015506061A5 (enExample)
JP2010037559A5 (enExample)
JP2015125302A5 (enExample)
JP2012052282A5 (enExample)
JP2016204203A5 (enExample)
WO2010003036A3 (en) Thixotropic conductive composition
JP2015029030A5 (enExample)
EP3404728A4 (en) COMPOSITION FOR A THERMOELECTRIC CONVERSION ELEMENT, METHOD FOR THE PRODUCTION OF CARBON NANOTONES CARRYING METALLIC NANOPARTICLES, THERMOELECTRIC CONVERSION MOLDING ELEMENTS, METHOD FOR THE MANUFACTURE THEREOF AND THERMOELECTRIC CONVERSION ELEMENT