JP2016503461A5 - - Google Patents

Download PDF

Info

Publication number
JP2016503461A5
JP2016503461A5 JP2015543389A JP2015543389A JP2016503461A5 JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5 JP 2015543389 A JP2015543389 A JP 2015543389A JP 2015543389 A JP2015543389 A JP 2015543389A JP 2016503461 A5 JP2016503461 A5 JP 2016503461A5
Authority
JP
Japan
Prior art keywords
general formula
iii
ureylene
polymers according
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015543389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016503461A (ja
JP6279598B2 (ja
Filing date
Publication date
Priority claimed from EP12194261.9A external-priority patent/EP2735627A1/en
Application filed filed Critical
Publication of JP2016503461A publication Critical patent/JP2016503461A/ja
Publication of JP2016503461A5 publication Critical patent/JP2016503461A5/ja
Application granted granted Critical
Publication of JP6279598B2 publication Critical patent/JP6279598B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015543389A 2012-11-26 2013-11-12 銅めっき浴組成物 Active JP6279598B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12194261.9A EP2735627A1 (en) 2012-11-26 2012-11-26 Copper plating bath composition
EP12194261.9 2012-11-26
PCT/EP2013/073629 WO2014079737A2 (en) 2012-11-26 2013-11-12 Copper plating bath composition

Publications (3)

Publication Number Publication Date
JP2016503461A JP2016503461A (ja) 2016-02-04
JP2016503461A5 true JP2016503461A5 (https=) 2016-11-04
JP6279598B2 JP6279598B2 (ja) 2018-02-14

Family

ID=47226032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015543389A Active JP6279598B2 (ja) 2012-11-26 2013-11-12 銅めっき浴組成物

Country Status (8)

Country Link
US (1) US9551080B2 (https=)
EP (2) EP2735627A1 (https=)
JP (1) JP6279598B2 (https=)
KR (1) KR102193485B1 (https=)
CN (1) CN104854265B (https=)
PH (1) PH12015501137B1 (https=)
TW (1) TWI600802B (https=)
WO (1) WO2014079737A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
ES2639300T3 (es) * 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
KR102426521B1 (ko) * 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3344800B1 (en) * 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
JP6926120B2 (ja) 2016-05-04 2021-08-25 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 基板表面の活性化を含む基板表面に金属または金属合金を析出させるための方法
US11035051B2 (en) 2016-08-15 2021-06-15 Atotech Deutschland Gmbh Acidic aqueous composition for electrolytic copper plating
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
ES2881029T3 (es) 2018-01-09 2021-11-26 Atotech Deutschland Gmbh Aditivo de ureileno, su uso y un método para su preparación
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112899736A (zh) * 2021-01-15 2021-06-04 深圳中科利尔科技有限公司 一种pcb高纵横通孔电镀铜添加剂及其制备方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
EP4063533A1 (en) 2021-03-25 2022-09-28 Atotech Deutschland GmbH & Co. KG A process for electrochemical deposition of copper with different current densities
KR102339862B1 (ko) * 2021-07-06 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 회로패턴 형성용 전기도금 조성물
KR102339861B1 (ko) * 2021-07-26 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 금속박 형성용 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN118812171A (zh) * 2023-04-17 2024-10-22 财团法人工业技术研究院 贯穿玻璃的通孔的铜金属化方法和由此制造的玻璃制品

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
DE4126502C1 (https=) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US6387229B1 (en) * 1999-05-07 2002-05-14 Enthone, Inc. Alloy plating
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP4392168B2 (ja) 2001-05-09 2009-12-24 荏原ユージライト株式会社 銅めっき浴およびこれを用いる基板のめっき方法
CN1410601A (zh) * 2001-09-27 2003-04-16 长春石油化学股份有限公司 用于铜集成电路内连线的铜电镀液组合物
EP1607495A4 (en) * 2002-12-25 2006-07-12 Nikko Materials Co Ltd COPPER ELECTROLYTE SOLUTION CONTAINS A QUINTERNATIVE AMINO-BONDED POLYMER COMPRISING A PARTICULAR SCAFFOLD AND ORGANIC SULFUR COMPOUND AS ADDITIONS AND ELECTROLYTIC COPPER FOIL MANUFACTURED THEREWITH
CN1806067B (zh) * 2003-07-29 2010-06-16 日矿金属株式会社 含有具有特定骨架的含二烷基氨基的聚合物和有机硫化合物作为添加剂的铜电解液以及由该电解液制造的电解铜箔
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
DE102005060030A1 (de) * 2005-12-15 2007-06-21 Coventya Gmbh Quervernetzte Polymere, diese enthaltende Galvanisierungsbäder sowie deren Verwendung
EP2292679B1 (de) * 2009-09-08 2020-03-11 ATOTECH Deutschland GmbH Polymere mit Aminoendgruppen und deren Verwendung als Additive für galvanische Zink- und Zinklegierungsbäder
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method

Similar Documents

Publication Publication Date Title
JP2016503461A5 (https=)
BR112015027321A2 (pt) composições e métodos
ATE547129T1 (de) Multimodale formgedächtnis-polymere
MX392371B (es) Polimeros con procesabilidad mejorado para aplicaciones de tuberias.
JP2015158628A5 (https=)
JP2016536436A5 (https=)
JP2015530475A5 (https=)
CN109641831A (zh) 单体、聚合物、制备方法及其用途
JP2015063604A5 (https=)
JP2015193834A5 (https=)
JP2008308572A5 (https=)
JP2016094578A5 (https=)
EP4281503C0 (de) Erbsenstärkehaltige polymerzusammensetzung
JP2015030781A5 (https=)
JP2013122051A5 (https=)
JP2017115098A5 (https=)
JP2015044795A5 (ja) トリフルオロフェニル誘導体
TH124514B (th) คลิปหนีบ
TH140448S (th) อุปกรณ์ยึดขั้นบันได
TH163113A (th) พอลิเมอร์ที่ดัดแปรด้วยอะมิโนซิเลน
AR094303A1 (es) Composicion polimerica y su uso, proceso de polimerizacion y producto
TH140440S (th) อุปกรณ์ยึดขั้นบันได
TH47997S1 (th) อุปกรณ์ล็อค
TH91399B (th) โต๊ะนักเรียน
TH139774S (th) ข้อต่อท่อ