JP2016502280A - プリント回路基板の冷却装置 - Google Patents
プリント回路基板の冷却装置 Download PDFInfo
- Publication number
- JP2016502280A JP2016502280A JP2015548381A JP2015548381A JP2016502280A JP 2016502280 A JP2016502280 A JP 2016502280A JP 2015548381 A JP2015548381 A JP 2015548381A JP 2015548381 A JP2015548381 A JP 2015548381A JP 2016502280 A JP2016502280 A JP 2016502280A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- cooling device
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
- プリント回路基板用の冷却装置であって、
少なくとも1つの面または第1の面を有するプリント回路基板と、
前記プリント回路の前記少なくとも1つの面にろう付けされた少なくとも1つのヒートシンク要素(9)とを備え、
前記少なくとも1つのヒートシンク要素(9)は、冷媒流に配設されるのに適したものである冷却装置。 - 前記プリント回路基板は、2つの面を有する、請求項1に記載の冷却装置。
- 前記2つの面の一方から前記2つの面の他方へ前記プリント回路基板を貫通する少なくとも1つの孔を備え、前記1つのヒートシンク要素(9)は、前記少なくとも1つの貫通孔と対向して配設される、請求項2に記載の冷却装置。
- 前記少なくとも1つの貫通孔は、金属物質で覆われた内面を有する、請求項3に記載の冷却装置。
- 前記プリント回路基板を貫通する複数の孔を備える、請求項3と4のいずれか一項に記載の冷却装置。
- 前記プリント回路基板には、電子コンポーネント(19)が設けられる、請求項1から5のいずれか一項に記載の冷却装置。
- 前記電子コンポーネント(19)の外周部は、前記第1の面(16)に第1の占有域(30)の範囲を定め、前記複数の孔(18)は、前記第1の面(16)に第2の占有域(26)の範囲を定め、前記第1の占有域(30)および前記第2の占有域(26)は、ゼロ以外の距離だけ分離されている、請求項5に従属した請求項6に記載の冷却装置。
- 前記電子コンポーネント(19)の外周部は、前記第1の面(16)に第1の占有域(30)の範囲を定め、前記複数の孔(18)は、前記第1の面(16)に第2の占有域(26)の範囲を定め、前記第1の占有域(30)および前記第2の占有域(26)は、少なくとも部分的に重なり合う、請求項5から7のいずれか一項に記載の冷却装置。
- 前記少なくとも1つのヒートシンク要素(9)は、前記プリント回路基板(15)に対して支持当接部を形成するヘッド(31)を備える、請求項1から8のいずれか一項に記載の冷却装置。
- 空気流(29、30)を生成し、且つ、電気モータ(21)により駆動されることに適したプロペラ(22)と、請求項1から9のいずれか一項に記載の冷却装置と、を備える、自動車の車室内の通気設備の通気装置(19)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1262300A FR2999864A1 (fr) | 2012-12-19 | 2012-12-19 | Dispositif de refroidissement pour carte de circuit imprime |
FR1262300 | 2012-12-19 | ||
PCT/EP2013/076501 WO2014095610A1 (fr) | 2012-12-19 | 2013-12-13 | Dispositif de refroidissement pour carte de circuit imprime |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016502280A true JP2016502280A (ja) | 2016-01-21 |
Family
ID=48539251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015548381A Pending JP2016502280A (ja) | 2012-12-19 | 2013-12-13 | プリント回路基板の冷却装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160135283A1 (ja) |
EP (1) | EP2936955A1 (ja) |
JP (1) | JP2016502280A (ja) |
CN (1) | CN104956784A (ja) |
FR (1) | FR2999864A1 (ja) |
MX (1) | MX2015007953A (ja) |
WO (1) | WO2014095610A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6354279B2 (ja) * | 2014-04-18 | 2018-07-11 | ダイキン工業株式会社 | 空気調和装置 |
US10237967B2 (en) * | 2015-10-02 | 2019-03-19 | Analogic Corporation | Cooling assembly for electronics assembly of imaging system |
EP3488672B1 (en) * | 2016-07-20 | 2021-10-20 | Stackpole International Engineered Products, Ltd. | Pump assembly having integrated controller and motor with internal active cooling |
DE102017104386A1 (de) * | 2017-03-02 | 2018-09-06 | HELLA GmbH & Co. KGaA | Verfahren zur Herstellung einer elektrischen Baugruppe |
DE102018210256A1 (de) * | 2018-06-22 | 2019-12-24 | Robert Bosch Gmbh | Steuergerät mit Kühlkörper und Leiterplatte |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58175643U (ja) * | 1982-05-19 | 1983-11-24 | 富士通株式会社 | 印刷配線板搭載部品の放熱構造 |
JPS59123298A (ja) * | 1982-12-28 | 1984-07-17 | 富士通株式会社 | 半導体装置 |
JPH03204997A (ja) * | 1989-12-29 | 1991-09-06 | Hitachi Ltd | 多層プリント基板の冷却方式 |
US5113315A (en) * | 1990-08-07 | 1992-05-12 | Cirqon Technologies Corporation | Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
JPH06169189A (ja) * | 1992-11-30 | 1994-06-14 | Hitachi Ltd | チップ形発熱部品及びその実装方法 |
JP2001284748A (ja) * | 2000-03-29 | 2001-10-12 | Rohm Co Ltd | 放熱手段を有するプリント配線板およびその製造方法 |
JP2005168268A (ja) * | 2003-12-05 | 2005-06-23 | Asmo Co Ltd | モータの駆動回路装置、及びモータ |
JP2006100483A (ja) * | 2004-09-29 | 2006-04-13 | Matsushita Electric Works Ltd | プリント配線板の放熱構造 |
JP2007173341A (ja) * | 2005-12-20 | 2007-07-05 | Nissan Motor Co Ltd | 回路基板の実装構造およびその実装方法 |
US20110110059A1 (en) * | 2007-10-25 | 2011-05-12 | Zdenko Grajcar | Apparatus and methods for thermal management of electronic devices |
JP2012231061A (ja) * | 2011-04-27 | 2012-11-22 | Global Micronics Corp | 電子部品モジュール及び電子部品モジュールの製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2625038B1 (fr) * | 1987-12-22 | 1990-08-17 | Cit Alcatel | Procede et dispositif de refroidissement d'un boitier de circuit integre |
US5043845A (en) * | 1989-10-16 | 1991-08-27 | Eastman Kodak Company | High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
US5258887A (en) * | 1992-06-15 | 1993-11-02 | Eaton Corporation | Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
WO1994029900A1 (en) * | 1993-06-09 | 1994-12-22 | Lykat Corporation | Heat dissipative means for integrated circuit chip package |
JP3269397B2 (ja) * | 1995-09-19 | 2002-03-25 | 株式会社デンソー | プリント配線基板 |
DE19842590A1 (de) * | 1998-09-17 | 2000-04-13 | Daimler Chrysler Ag | Verfahren zur Herstellung von Schaltungsanordnungen |
US6477054B1 (en) * | 2000-08-10 | 2002-11-05 | Tektronix, Inc. | Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via |
US6605778B2 (en) * | 2000-10-02 | 2003-08-12 | Siemens Aktiengesellschaft | Circuit carrier, in particular printed circuit board |
US7265983B2 (en) * | 2003-10-13 | 2007-09-04 | Tyco Electronics Raychem Gmbh | Power unit comprising a heat sink, and assembly method |
JP2006024755A (ja) * | 2004-07-08 | 2006-01-26 | Fujitsu Ltd | 回路基板 |
US7269017B2 (en) * | 2004-11-19 | 2007-09-11 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices on laminate ceramic substrate |
US7808788B2 (en) * | 2007-06-29 | 2010-10-05 | Delphi Technologies, Inc. | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly |
DE202007009288U1 (de) * | 2007-07-03 | 2007-08-30 | Osram Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares Leuchtdiodenbauelement mit einer Wärmesenke |
WO2010146652A1 (ja) * | 2009-06-15 | 2010-12-23 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
WO2011097462A2 (en) * | 2010-02-05 | 2011-08-11 | Kodadek Iii Robert E | Thermal management system for electrical components and method of producing same |
-
2012
- 2012-12-19 FR FR1262300A patent/FR2999864A1/fr not_active Withdrawn
-
2013
- 2013-12-13 MX MX2015007953A patent/MX2015007953A/es unknown
- 2013-12-13 JP JP2015548381A patent/JP2016502280A/ja active Pending
- 2013-12-13 US US14/653,522 patent/US20160135283A1/en not_active Abandoned
- 2013-12-13 EP EP13805864.9A patent/EP2936955A1/fr not_active Withdrawn
- 2013-12-13 CN CN201380071775.1A patent/CN104956784A/zh active Pending
- 2013-12-13 WO PCT/EP2013/076501 patent/WO2014095610A1/fr active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58175643U (ja) * | 1982-05-19 | 1983-11-24 | 富士通株式会社 | 印刷配線板搭載部品の放熱構造 |
JPS59123298A (ja) * | 1982-12-28 | 1984-07-17 | 富士通株式会社 | 半導体装置 |
JPH03204997A (ja) * | 1989-12-29 | 1991-09-06 | Hitachi Ltd | 多層プリント基板の冷却方式 |
US5113315A (en) * | 1990-08-07 | 1992-05-12 | Cirqon Technologies Corporation | Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
JPH06169189A (ja) * | 1992-11-30 | 1994-06-14 | Hitachi Ltd | チップ形発熱部品及びその実装方法 |
JP2001284748A (ja) * | 2000-03-29 | 2001-10-12 | Rohm Co Ltd | 放熱手段を有するプリント配線板およびその製造方法 |
JP2005168268A (ja) * | 2003-12-05 | 2005-06-23 | Asmo Co Ltd | モータの駆動回路装置、及びモータ |
JP2006100483A (ja) * | 2004-09-29 | 2006-04-13 | Matsushita Electric Works Ltd | プリント配線板の放熱構造 |
JP2007173341A (ja) * | 2005-12-20 | 2007-07-05 | Nissan Motor Co Ltd | 回路基板の実装構造およびその実装方法 |
US20110110059A1 (en) * | 2007-10-25 | 2011-05-12 | Zdenko Grajcar | Apparatus and methods for thermal management of electronic devices |
JP2012231061A (ja) * | 2011-04-27 | 2012-11-22 | Global Micronics Corp | 電子部品モジュール及び電子部品モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2014095610A1 (fr) | 2014-06-26 |
FR2999864A1 (fr) | 2014-06-20 |
MX2015007953A (es) | 2016-02-19 |
EP2936955A1 (fr) | 2015-10-28 |
CN104956784A (zh) | 2015-09-30 |
US20160135283A1 (en) | 2016-05-12 |
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