JP2016225429A - 熱処理装置 - Google Patents
熱処理装置 Download PDFInfo
- Publication number
- JP2016225429A JP2016225429A JP2015109385A JP2015109385A JP2016225429A JP 2016225429 A JP2016225429 A JP 2016225429A JP 2015109385 A JP2015109385 A JP 2015109385A JP 2015109385 A JP2015109385 A JP 2015109385A JP 2016225429 A JP2016225429 A JP 2016225429A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- susceptor
- heat treatment
- chamber
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/12—Arrangement of elements for electric heating in or on furnaces with electromagnetic fields acting directly on the material being heated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
3 制御部
4 ハロゲン加熱部
5 フラッシュ加熱部
6 チャンバー
7 保持部
10 移載機構
65 熱処理空間
73 集光レンズ
74 サセプター
75 支持ピン
HL ハロゲンランプ
FL フラッシュランプ
W 半導体ウェハー
Claims (5)
- 基板に光を照射することによって該基板を加熱する熱処理装置であって、
基板を収容するチャンバーと、
前記チャンバー内にて、上面に立設された複数の支持ピンを介して基板を支持する石英の平板形状のサセプターと、
前記サセプターに支持された基板に前記サセプターを透過して光を照射する光照射部と、
前記光照射部から出射された光の一部を前記支持ピンと基板との接触部位に集光する集光レンズと、
を備えることを特徴とする熱処理装置。 - 請求項1記載の熱処理装置において、
前記集光レンズは前記サセプターに付設されることを特徴とする熱処理装置。 - 請求項1記載の熱処理装置において、
前記集光レンズは前記サセプターから分離して前記チャンバー内に設置されることを特徴とする熱処理装置。 - 請求項1から請求項3のいずれかに記載の熱処理装置において、
前記集光レンズは凸レンズであることを特徴とする熱処理装置。 - 請求項1から請求項4のいずれかに記載の熱処理装置において、
前記サセプターに支持された基板にフラッシュ光を照射するフラッシュランプをさらに備えることを特徴とする熱処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015109385A JP6554328B2 (ja) | 2015-05-29 | 2015-05-29 | 熱処理装置 |
TW105114019A TWI618151B (zh) | 2015-05-29 | 2016-05-05 | 熱處理裝置 |
US15/150,540 US10153184B2 (en) | 2015-05-29 | 2016-05-10 | Light irradiation type heat treatment apparatus |
CN201610348854.8A CN106206366B (zh) | 2015-05-29 | 2016-05-24 | 热处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015109385A JP6554328B2 (ja) | 2015-05-29 | 2015-05-29 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016225429A true JP2016225429A (ja) | 2016-12-28 |
JP6554328B2 JP6554328B2 (ja) | 2019-07-31 |
Family
ID=57399762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015109385A Active JP6554328B2 (ja) | 2015-05-29 | 2015-05-29 | 熱処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10153184B2 (ja) |
JP (1) | JP6554328B2 (ja) |
CN (1) | CN106206366B (ja) |
TW (1) | TWI618151B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200123256A (ko) * | 2018-03-20 | 2020-10-28 | 매슨 테크놀로지 인크 | 열처리 시스템에서의 국부적인 가열을 위한 지지 플레이트 |
JP2021518548A (ja) * | 2018-03-20 | 2021-08-02 | パテック フィリップ ソシエテ アノニム ジュネーブ | シリコン時計製造用構成要素の製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108140603B (zh) * | 2015-10-04 | 2023-02-28 | 应用材料公司 | 基板支撑件和挡板设备 |
US20170358446A1 (en) * | 2016-06-13 | 2017-12-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer processing apparatus and wafer processing method using the same |
JP6847610B2 (ja) * | 2016-09-14 | 2021-03-24 | 株式会社Screenホールディングス | 熱処理装置 |
JP7326167B2 (ja) | 2017-06-29 | 2023-08-15 | スリーエム イノベイティブ プロパティズ カンパニー | 物品及びその製造方法 |
CN107818930A (zh) * | 2017-09-26 | 2018-03-20 | 合肥新汇成微电子有限公司 | 一种半导体晶圆uv固化方法 |
CN117373949A (zh) | 2017-10-30 | 2024-01-09 | 应用材料公司 | Epi中的多区域点加热 |
JP7080145B2 (ja) * | 2018-09-20 | 2022-06-03 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
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2015
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2016
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- 2016-05-10 US US15/150,540 patent/US10153184B2/en active Active
- 2016-05-24 CN CN201610348854.8A patent/CN106206366B/zh active Active
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Also Published As
Publication number | Publication date |
---|---|
JP6554328B2 (ja) | 2019-07-31 |
TW201642349A (zh) | 2016-12-01 |
CN106206366A (zh) | 2016-12-07 |
TWI618151B (zh) | 2018-03-11 |
US10153184B2 (en) | 2018-12-11 |
US20160351424A1 (en) | 2016-12-01 |
CN106206366B (zh) | 2019-01-18 |
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