JP2016146733A - 回路構成体 - Google Patents
回路構成体 Download PDFInfo
- Publication number
- JP2016146733A JP2016146733A JP2015170005A JP2015170005A JP2016146733A JP 2016146733 A JP2016146733 A JP 2016146733A JP 2015170005 A JP2015170005 A JP 2015170005A JP 2015170005 A JP2015170005 A JP 2015170005A JP 2016146733 A JP2016146733 A JP 2016146733A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- substrate
- conductive member
- connection portion
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000004048 modification Effects 0.000 description 16
- 238000012986 modification Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Connection Or Junction Boxes (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】一方の面10aに導電パターンが形成された基板と、基板の他方の面10bに固定された導電部材20と、複数の端子の一部である第一端子32、33が導電部材20に電気的に接続され、複数の端子の他の一部である第二端子34が基板10に形成された導電パターンに電気的に接続される電子部品30と、を備え、導電部材20は、電子部品30の第二端子34の少なくとも一部に重ならない形状である回路構成体1とする。
【選択図】図3
Description
10 基板
10a 一方の面
10b 他方の面
11 開口
12 第一端子接続部
13(13a) 第二端子接続部
101 導電パターン
20 導電部材
21 第一の部分
22 第二の部分
221 切欠き部
30 電子部品(トランジスタ)
31 本体部
32 ドレイン端子(第一端子)
33 ソース端子(第一端子)
34 ゲート端子(第二端子)
40 第一リード部材
50(50a) 第二リード部材
521(521a) 接触端子部
Claims (7)
- 一方の面に導電パターンが形成された基板と、
前記基板の他方の面に固定された導電部材と、
前記導電部材に電気的に接続される第一端子と、前記基板に形成された導電パターンに電気的に接続される第二端子と、を有する電子部品と、
を備え、
前記導電部材は、前記電子部品の前記第二端子の少なくとも一部に重ならない形状であることを特徴とする回路構成体。 - 前記基板の他方の面には、第一端子接続部が前記導電部材に重ならないように設けられており、
前記電子部品の前記第二端子は、前記第一端子接続部を介して前記導電パターンに電気的に接続されていることを特徴とする請求項1に記載の回路構成体。 - 前記電子部品の前記第二端子と前記第一端子接続部とを電気的に接続する第一リード部材を備えることを特徴とする請求項2に記載の回路構成体。
- 前記基板の一方の面と他方の面の間には、第二端子接続部が前記導電部材に重ならないように設けられており、
前記電子部品の前記第二端子は、前記第二端子接続部を介して前記導電パターンに電気的に接続されていることを特徴とする請求項1から請求項3のいずれか一項に記載の回路構成体。 - 前記電子部品の前記第二端子と前記第二端子接続部とを電気的に接続する第二リード部材を備えることを特徴とする請求項4に記載の回路構成体。
- 前記第二端子接続部は、前記基板に形成された貫通孔の内周面に沿って形成されており、
前記第二リード部材は、その一方側に、前記貫通孔に挿入されて前記第二端子接続部に接触する接触端子部を有することを特徴とする請求項5に記載の回路構成体。 - 前記基板には開口が形成されており、当該開口を通じて前記電子部品が前記導電部材上に載置されていることを特徴とする請求項1から請求項6のいずれか一項に記載の回路構成体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201680008114.8A CN107211533B (zh) | 2015-02-03 | 2016-01-13 | 电路结构体 |
DE112016000586.5T DE112016000586B4 (de) | 2015-02-03 | 2016-01-13 | Schaltungsanordnung |
PCT/JP2016/050752 WO2016125544A1 (ja) | 2015-02-03 | 2016-01-13 | 回路構成体 |
US15/545,092 US10251268B2 (en) | 2015-02-03 | 2016-01-13 | Circuit structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015019386 | 2015-02-03 | ||
JP2015019386 | 2015-02-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016146733A true JP2016146733A (ja) | 2016-08-12 |
JP6638262B2 JP6638262B2 (ja) | 2020-01-29 |
Family
ID=56685683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015170005A Active JP6638262B2 (ja) | 2015-02-03 | 2015-08-31 | 回路構成体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10251268B2 (ja) |
JP (1) | JP6638262B2 (ja) |
CN (1) | CN107211533B (ja) |
DE (1) | DE112016000586B4 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017059560A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2018110359A1 (ja) * | 2016-12-14 | 2018-06-21 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
KR20190076514A (ko) * | 2017-12-22 | 2019-07-02 | 주식회사 이지트로닉스 | 전력반도체 탑재 구조물 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020064941A (ja) * | 2018-10-16 | 2020-04-23 | 住友電装株式会社 | 回路構造体及び電気接続箱 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284821A (ja) * | 1997-04-01 | 1998-10-23 | Ibiden Co Ltd | プリント配線板 |
JP2000151061A (ja) * | 1998-11-05 | 2000-05-30 | Lintec Corp | 電子回路用基板、電子回路およびその製造方法 |
JP2003152303A (ja) * | 2001-08-27 | 2003-05-23 | Ibiden Co Ltd | 配線板 |
JP2006060882A (ja) * | 2004-08-17 | 2006-03-02 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05327167A (ja) | 1992-05-18 | 1993-12-10 | Fujitsu Ltd | リード付部品の実装構造 |
CN1094717C (zh) | 1995-11-16 | 2002-11-20 | 松下电器产业株式会社 | 印刷电路板的安装体 |
JP4002427B2 (ja) | 2001-11-26 | 2007-10-31 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
JP4022440B2 (ja) * | 2002-07-01 | 2007-12-19 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
JP2004253759A (ja) | 2002-12-24 | 2004-09-09 | Auto Network Gijutsu Kenkyusho:Kk | 制御回路基板及び回路構成体 |
JP4076459B2 (ja) * | 2003-03-12 | 2008-04-16 | 株式会社オートネットワーク技術研究所 | バスバー構成板及びこれを用いた回路構成体の製造方法 |
JP4172334B2 (ja) * | 2003-06-13 | 2008-10-29 | 住友電装株式会社 | 電気接続箱 |
JP3956920B2 (ja) | 2003-08-26 | 2007-08-08 | 松下電工株式会社 | コネクタ |
JP4584600B2 (ja) * | 2004-02-06 | 2010-11-24 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
DE112005003267B4 (de) * | 2005-01-05 | 2017-01-05 | Autonetworks Technologies, Ltd. | Schaltkreisstruktur |
JP5014642B2 (ja) * | 2006-02-16 | 2012-08-29 | 株式会社トクヤマ | リード内蔵メタライズドセラミックス基板およびパッケージ |
JP4433058B2 (ja) | 2008-01-30 | 2010-03-17 | 株式会社デンソー | 電子装置及びその製造方法 |
US7863724B2 (en) * | 2008-02-12 | 2011-01-04 | International Business Machines Corporation | Circuit substrate having post-fed die side power supply connections |
JP2012228082A (ja) * | 2011-04-20 | 2012-11-15 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体及び電気接続箱 |
JP6256364B2 (ja) * | 2015-02-03 | 2018-01-10 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6488752B2 (ja) * | 2015-02-19 | 2019-03-27 | 株式会社オートネットワーク技術研究所 | 基板ユニット |
JP6634748B2 (ja) * | 2015-09-14 | 2020-01-22 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6504022B2 (ja) * | 2015-11-04 | 2019-04-24 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
-
2015
- 2015-08-31 JP JP2015170005A patent/JP6638262B2/ja active Active
-
2016
- 2016-01-13 CN CN201680008114.8A patent/CN107211533B/zh active Active
- 2016-01-13 DE DE112016000586.5T patent/DE112016000586B4/de active Active
- 2016-01-13 US US15/545,092 patent/US10251268B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10284821A (ja) * | 1997-04-01 | 1998-10-23 | Ibiden Co Ltd | プリント配線板 |
JP2000151061A (ja) * | 1998-11-05 | 2000-05-30 | Lintec Corp | 電子回路用基板、電子回路およびその製造方法 |
JP2003152303A (ja) * | 2001-08-27 | 2003-05-23 | Ibiden Co Ltd | 配線板 |
JP2006060882A (ja) * | 2004-08-17 | 2006-03-02 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017059560A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
WO2018110359A1 (ja) * | 2016-12-14 | 2018-06-21 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
CN110036700A (zh) * | 2016-12-14 | 2019-07-19 | 株式会社自动网络技术研究所 | 电路结构体 |
CN110036700B (zh) * | 2016-12-14 | 2021-12-31 | 株式会社自动网络技术研究所 | 电路结构体 |
KR20190076514A (ko) * | 2017-12-22 | 2019-07-02 | 주식회사 이지트로닉스 | 전력반도체 탑재 구조물 |
KR102415020B1 (ko) * | 2017-12-22 | 2022-07-01 | 주식회사 이지트로닉스 | 전력반도체 탑재 구조물 |
Also Published As
Publication number | Publication date |
---|---|
DE112016000586T5 (de) | 2017-12-21 |
US20180020542A1 (en) | 2018-01-18 |
CN107211533B (zh) | 2020-05-05 |
JP6638262B2 (ja) | 2020-01-29 |
US10251268B2 (en) | 2019-04-02 |
CN107211533A (zh) | 2017-09-26 |
DE112016000586B4 (de) | 2023-10-12 |
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