JP6488752B2 - 基板ユニット - Google Patents
基板ユニット Download PDFInfo
- Publication number
- JP6488752B2 JP6488752B2 JP2015030795A JP2015030795A JP6488752B2 JP 6488752 B2 JP6488752 B2 JP 6488752B2 JP 2015030795 A JP2015030795 A JP 2015030795A JP 2015030795 A JP2015030795 A JP 2015030795A JP 6488752 B2 JP6488752 B2 JP 6488752B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- substrate
- conductive
- main body
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
10 基板
10a 一方の面
10b 他方の面
11 開口
20 導電部材
21 本体部
211 (導電部材に形成される)凹部
22 延設部
221 基端部
222 先端部
30 電子部品
40 放熱部材
401 絶縁材料
42 (放熱部材に形成される)凹部
51 第一ケース体
511 土台部
512 雄ねじ部
60 絶縁部材
61 第一の部分
62 第二の部分
Claims (5)
- 一方の面に導電パターンが形成されるとともに、開口が形成された基板と、
本体部が前記基板の他方の面に固定された部材であって、前記基板に形成された開口を通じて電子部品の一部の端子が電気的に接続される導電部材と、
前記導電部材における前記基板側の反対側の面に固定される放熱部材と、
を備え、
外部機器が電気的に接続される部分であって、前記導電部材の本体部から延びた延設部が、前記放熱部材に沿う平面と交差するように設けられており、
前記延設部は、前記導電部材の本体部側の部分であって前記平面と交差する基端部、および当該基端部の先端から屈曲して前記平面と平行に延びる先端部を有することを特徴とする基板ユニット。 - 前記導電部材の前記延設部と前記放熱部材の端面との間には、絶縁部材が介在されていることを特徴とする請求項1に記載の基板ユニット。
- 前記絶縁部材は、
前記導電部材の前記本体部と前記放熱部材との間に位置する第一の部分と、
前記導電部材の前記延設部と前記放熱部材の端面との間に位置する第二の部分と、
を有することを特徴とする請求項2に記載の基板ユニット。 - 前記放熱部材には、前記絶縁部材の前記第一の部分が嵌まり込む凹部が形成されていることを特徴とする請求項3に記載の基板ユニット。
- 前記導電部材には、前記絶縁部材の前記第一の部分が嵌まり込む凹部が形成されていることを特徴とする請求項3に記載の基板ユニット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015030795A JP6488752B2 (ja) | 2015-02-19 | 2015-02-19 | 基板ユニット |
CN201680009991.7A CN107251670B (zh) | 2015-02-19 | 2016-01-29 | 基板单元 |
PCT/JP2016/052575 WO2016132852A1 (ja) | 2015-02-19 | 2016-01-29 | 基板ユニット |
DE112016000817.1T DE112016000817T5 (de) | 2015-02-19 | 2016-01-29 | Substrateinheit |
US15/549,243 US10062633B2 (en) | 2015-02-19 | 2016-01-29 | Substrate unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015030795A JP6488752B2 (ja) | 2015-02-19 | 2015-02-19 | 基板ユニット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016152399A JP2016152399A (ja) | 2016-08-22 |
JP2016152399A5 JP2016152399A5 (ja) | 2017-07-13 |
JP6488752B2 true JP6488752B2 (ja) | 2019-03-27 |
Family
ID=56692165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015030795A Active JP6488752B2 (ja) | 2015-02-19 | 2015-02-19 | 基板ユニット |
Country Status (5)
Country | Link |
---|---|
US (1) | US10062633B2 (ja) |
JP (1) | JP6488752B2 (ja) |
CN (1) | CN107251670B (ja) |
DE (1) | DE112016000817T5 (ja) |
WO (1) | WO2016132852A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6638262B2 (ja) * | 2015-02-03 | 2020-01-29 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6587213B2 (ja) * | 2016-05-12 | 2019-10-09 | 株式会社オートネットワーク技術研究所 | 配電基板 |
DE102018216143B3 (de) * | 2018-09-21 | 2020-03-19 | Continental Automotive Gmbh | Kontaktanordnung und Vorrichtung mit einer Grundplatte und einer darauf angeordneten Kontaktanordnung |
JP2020064941A (ja) * | 2018-10-16 | 2020-04-23 | 住友電装株式会社 | 回路構造体及び電気接続箱 |
JP7192918B1 (ja) * | 2021-06-14 | 2022-12-20 | 株式会社明電舎 | バスバー放熱構造及びインバータ装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002051431A (ja) * | 2000-08-02 | 2002-02-15 | Auto Network Gijutsu Kenkyusho:Kk | 車両用配電器及びその製造方法 |
JP3927017B2 (ja) | 2001-11-26 | 2007-06-06 | 株式会社オートネットワーク技術研究所 | 回路構成体及びその製造方法 |
DE10254910B4 (de) | 2001-11-26 | 2008-12-24 | AutoNetworks Technologies, Ltd., Nagoya | Schaltkreisbildende Einheit und Verfahren zu deren Herstellung |
JP2005268648A (ja) * | 2004-03-19 | 2005-09-29 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
JP4732789B2 (ja) * | 2005-04-28 | 2011-07-27 | 株式会社オートネットワーク技術研究所 | スイッチングユニット |
JP4585980B2 (ja) * | 2005-10-14 | 2010-11-24 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US7576429B2 (en) * | 2005-12-30 | 2009-08-18 | Fairchild Semiconductor Corporation | Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
JP2009200416A (ja) * | 2008-02-25 | 2009-09-03 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
WO2009113631A1 (ja) * | 2008-03-12 | 2009-09-17 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP4968316B2 (ja) * | 2009-12-14 | 2012-07-04 | アンデン株式会社 | 電子回路装置 |
-
2015
- 2015-02-19 JP JP2015030795A patent/JP6488752B2/ja active Active
-
2016
- 2016-01-29 DE DE112016000817.1T patent/DE112016000817T5/de not_active Ceased
- 2016-01-29 WO PCT/JP2016/052575 patent/WO2016132852A1/ja active Application Filing
- 2016-01-29 US US15/549,243 patent/US10062633B2/en active Active
- 2016-01-29 CN CN201680009991.7A patent/CN107251670B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2016132852A1 (ja) | 2016-08-25 |
US10062633B2 (en) | 2018-08-28 |
DE112016000817T5 (de) | 2017-10-26 |
CN107251670B (zh) | 2019-06-18 |
CN107251670A (zh) | 2017-10-13 |
US20180033714A1 (en) | 2018-02-01 |
JP2016152399A (ja) | 2016-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6488752B2 (ja) | 基板ユニット | |
JP6330690B2 (ja) | 基板ユニット | |
US10652994B2 (en) | Circuit assembly with increased mounting area | |
CN108781511B (zh) | 电路结构体 | |
JP2017060256A (ja) | 回路構成体および電気接続箱 | |
CN107210592B (zh) | 电路结构体 | |
JP2016152399A5 (ja) | ||
JP2015176916A (ja) | 半導体装置およびモジュール | |
US11043443B2 (en) | Electric device and heat radiator | |
JP2010086071A (ja) | 電子機器 | |
JP6362800B2 (ja) | 半導体装置 | |
JP6872976B2 (ja) | 電力半導体装置、及び電力変換装置 | |
JP7444007B2 (ja) | 基板ユニット | |
JP6198068B2 (ja) | 電子装置 | |
JP2018006765A (ja) | 電子装置 | |
JP7060426B2 (ja) | 基板の伝熱構造 | |
JP6732583B2 (ja) | 端子取付基板 | |
WO2017077878A1 (ja) | 回路構成体 | |
JP2010135394A (ja) | 電子装置および電子装置の製造方法 | |
JP4543330B2 (ja) | 電気接続箱 | |
JP2007214195A (ja) | ヒートシンク |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170602 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170725 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180824 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190129 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190211 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6488752 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |