JP2016119454A - 蛍光体層被覆光半導体素子およびその製造方法 - Google Patents

蛍光体層被覆光半導体素子およびその製造方法 Download PDF

Info

Publication number
JP2016119454A
JP2016119454A JP2015217792A JP2015217792A JP2016119454A JP 2016119454 A JP2016119454 A JP 2016119454A JP 2015217792 A JP2015217792 A JP 2015217792A JP 2015217792 A JP2015217792 A JP 2015217792A JP 2016119454 A JP2016119454 A JP 2016119454A
Authority
JP
Japan
Prior art keywords
phosphor layer
layer
transparent
phosphor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015217792A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016119454A5 (enrdf_load_stackoverflow
Inventor
広和 松田
Hirokazu Matsuda
広和 松田
誠 常
Cheng Chang
誠 常
吉田 直子
Naoko Yoshida
直子 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to TW109109349A priority Critical patent/TW202027302A/zh
Priority to TW104220246U priority patent/TWM537717U/zh
Priority to TW104142411A priority patent/TWI692126B/zh
Priority to PCT/JP2015/085268 priority patent/WO2016098825A1/ja
Priority to CN201521063247.4U priority patent/CN205609569U/zh
Priority to CN201620978690.2U priority patent/CN206003825U/zh
Priority to CN201510955211.5A priority patent/CN105720173A/zh
Priority to TW104142536A priority patent/TWI691102B/zh
Publication of JP2016119454A publication Critical patent/JP2016119454A/ja
Publication of JP2016119454A5 publication Critical patent/JP2016119454A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2015217792A 2014-12-17 2015-11-05 蛍光体層被覆光半導体素子およびその製造方法 Pending JP2016119454A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
TW109109349A TW202027302A (zh) 2014-12-17 2015-12-16 被覆有螢光體層之光半導體元件及其製造方法
TW104220246U TWM537717U (zh) 2014-12-17 2015-12-16 被覆有螢光體層之光半導體元件
TW104142411A TWI692126B (zh) 2014-12-17 2015-12-16 被覆有螢光體層之光半導體元件及其製造方法
PCT/JP2015/085268 WO2016098825A1 (ja) 2014-12-17 2015-12-16 被覆光半導体素子の製造方法
CN201521063247.4U CN205609569U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件
CN201620978690.2U CN206003825U (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件
CN201510955211.5A CN105720173A (zh) 2014-12-17 2015-12-17 覆有荧光体层的光半导体元件和其制造方法
TW104142536A TWI691102B (zh) 2014-12-17 2015-12-17 被覆光半導體元件之製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014255110 2014-12-17
JP2014255110 2014-12-17

Publications (2)

Publication Number Publication Date
JP2016119454A true JP2016119454A (ja) 2016-06-30
JP2016119454A5 JP2016119454A5 (enrdf_load_stackoverflow) 2018-12-20

Family

ID=56244436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015217792A Pending JP2016119454A (ja) 2014-12-17 2015-11-05 蛍光体層被覆光半導体素子およびその製造方法

Country Status (3)

Country Link
JP (1) JP2016119454A (enrdf_load_stackoverflow)
CN (2) CN205609569U (enrdf_load_stackoverflow)
TW (3) TW202027302A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105374A1 (ja) * 2016-12-09 2018-06-14 日本電気硝子株式会社 波長変換部材の製造方法、波長変換部材及び発光デバイス
JPWO2019021926A1 (ja) * 2017-07-28 2020-07-30 デュポン・東レ・スペシャルティ・マテリアル株式会社 光学部材用樹脂シート、それを備える光学部材、積層体又は発光デバイス、及び光学部材用樹脂シートの製造方法
CN112563382A (zh) * 2019-09-25 2021-03-26 昆山科技大学 白光发光二极管结构及其制造方法
JP2022162976A (ja) * 2021-04-13 2022-10-25 光感動股▲フェン▼有限公司 発光ダイオードパッケージ構造およびその製造方法
US11527686B2 (en) 2020-08-31 2022-12-13 Nichia Corporation Light emitting device, method of manufacturing light emitting device, planar light source, and liquid crystal display device
WO2025084096A1 (ja) * 2023-10-16 2025-04-24 信越ポリマー株式会社 一体型封止シートおよび発光型電子部品
WO2025084095A1 (ja) * 2023-10-16 2025-04-24 信越ポリマー株式会社 一体型封止シートおよび発光型電子部品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231785A (ja) * 2007-04-16 2009-10-08 Toyoda Gosei Co Ltd 発光装置及び発光体
WO2009145298A1 (ja) * 2008-05-30 2009-12-03 シャープ株式会社 発光装置、面光源、液晶表示装置および発光装置の製造方法
JP2010183035A (ja) * 2009-02-09 2010-08-19 Toyoda Gosei Co Ltd 発光装置
JP2013115088A (ja) * 2011-11-25 2013-06-10 Citizen Holdings Co Ltd 半導体発光装置
WO2014006539A1 (en) * 2012-07-05 2014-01-09 Koninklijke Philips N.V. Phosphor separated from led by transparent spacer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231785A (ja) * 2007-04-16 2009-10-08 Toyoda Gosei Co Ltd 発光装置及び発光体
WO2009145298A1 (ja) * 2008-05-30 2009-12-03 シャープ株式会社 発光装置、面光源、液晶表示装置および発光装置の製造方法
JP2010183035A (ja) * 2009-02-09 2010-08-19 Toyoda Gosei Co Ltd 発光装置
JP2013115088A (ja) * 2011-11-25 2013-06-10 Citizen Holdings Co Ltd 半導体発光装置
WO2014006539A1 (en) * 2012-07-05 2014-01-09 Koninklijke Philips N.V. Phosphor separated from led by transparent spacer

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105374A1 (ja) * 2016-12-09 2018-06-14 日本電気硝子株式会社 波長変換部材の製造方法、波長変換部材及び発光デバイス
JP2018097060A (ja) * 2016-12-09 2018-06-21 日本電気硝子株式会社 波長変換部材の製造方法、波長変換部材及び発光デバイス
US10818825B2 (en) 2016-12-09 2020-10-27 Nippon Electric Glass Co., Ltd. Method for manufacturing wavelength conversion member, wavelength conversion member, and light-emitting device
JPWO2019021926A1 (ja) * 2017-07-28 2020-07-30 デュポン・東レ・スペシャルティ・マテリアル株式会社 光学部材用樹脂シート、それを備える光学部材、積層体又は発光デバイス、及び光学部材用樹脂シートの製造方法
JP7004721B2 (ja) 2017-07-28 2022-01-21 デュポン・東レ・スペシャルティ・マテリアル株式会社 光学部材用樹脂シート、それを備える光学部材、積層体又は発光デバイス、及び光学部材用樹脂シートの製造方法
US12060472B2 (en) 2017-07-28 2024-08-13 Dupont Toray Specialty Materials Kabushiki Kaisha Optical member resin sheet, optical member, layered body, or light-emitting device comprising optical member resin sheet, and method for manufacturing optical member resin sheet
CN112563382A (zh) * 2019-09-25 2021-03-26 昆山科技大学 白光发光二极管结构及其制造方法
US11527686B2 (en) 2020-08-31 2022-12-13 Nichia Corporation Light emitting device, method of manufacturing light emitting device, planar light source, and liquid crystal display device
US11769863B2 (en) 2020-08-31 2023-09-26 Nichia Corporation Light emitting device, method of manufacturing light emitting device, planar light source, and liquid crystal display device
JP2022162976A (ja) * 2021-04-13 2022-10-25 光感動股▲フェン▼有限公司 発光ダイオードパッケージ構造およびその製造方法
WO2025084096A1 (ja) * 2023-10-16 2025-04-24 信越ポリマー株式会社 一体型封止シートおよび発光型電子部品
WO2025084095A1 (ja) * 2023-10-16 2025-04-24 信越ポリマー株式会社 一体型封止シートおよび発光型電子部品

Also Published As

Publication number Publication date
TW201628219A (zh) 2016-08-01
CN205609569U (zh) 2016-09-28
CN206003825U (zh) 2017-03-08
TWI692126B (zh) 2020-04-21
TW202027302A (zh) 2020-07-16
TWM537717U (zh) 2017-03-01

Similar Documents

Publication Publication Date Title
JP5864367B2 (ja) 蛍光接着シート、蛍光体層付発光ダイオード素子、発光ダイオード装置およびそれらの製造方法
JP2016119454A (ja) 蛍光体層被覆光半導体素子およびその製造方法
CN103000792A (zh) 封装片、其制造方法、发光二级管装置及其制造方法
JP2013214716A (ja) 蛍光封止シート、発光ダイオード装置およびその製造方法
KR20130138685A (ko) 봉지 시트, 발광 다이오드 장치 및 그의 제조 방법
CN103311404A (zh) 封装片、发光二极管装置及其制造方法
WO2015033824A1 (ja) 波長変換シート、封止光半導体素子および光半導体素子装置
JP2014096491A (ja) 蛍光体層被覆半導体素子、その製造方法、半導体装置およびその製造方法
CN102738360A (zh) 密封片、发光二极管装置及其制造方法
JP2017163105A (ja) 光半導体素子被覆シート、密着層−被覆層付光半導体素子およびその製造方法、密着層付光半導体素子の製造方法
CN103915554A (zh) 封装层被覆光半导体元件、其制造方法和光半导体装置
KR20160052552A (ko) 광 반도체 소자 봉지 조성물, 광 반도체 소자 봉지 성형체, 광 반도체 소자 봉지 시트, 광 반도체 장치 및 봉지 광 반도체 소자
KR20150135286A (ko) 광 반도체 장치의 제조 방법
JP2016171314A (ja) 封止シート、封止光半導体素子の製造方法および光半導体装置の製造方法
JP2016048764A (ja) 光半導体素子封止組成物、光半導体素子封止成形体、光半導体素子封止シート、光半導体装置および封止光半導体素子
CN105720173A (zh) 覆有荧光体层的光半导体元件和其制造方法
WO2017221608A1 (ja) 蛍光体層シート、および、蛍光体層付光半導体素子の製造方法
JP2017163104A (ja) 被覆層付光半導体素子およびその製造方法
WO2016039443A1 (ja) 封止層被覆光半導体素子の製造方法および光半導体装置の製造方法
WO2016143627A1 (ja) 封止シート、封止光半導体素子の製造方法および光半導体装置の製造方法
JP2018041857A (ja) 蛍光体層光拡散層被覆光半導体素子
WO2016194948A1 (ja) 蛍光体樹脂シートの製造方法
WO2016143623A1 (ja) 貼着シート、貼着光半導体素子の製造方法および光半導体装置の製造方法
JP2017213641A (ja) 蛍光体樹脂シートの製造方法
JP2018041859A (ja) 積層体、積層体の製造方法および貼着光半導体素子の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20151124

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20171222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20171222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180329

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20180517

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181105

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191015

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200114

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20200310

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200708

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20200708

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20200729

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20200804

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20200904

C211 Notice of termination of reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C211

Effective date: 20200908

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20201215

C23 Notice of termination of proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C23

Effective date: 20210126

C03 Trial/appeal decision taken

Free format text: JAPANESE INTERMEDIATE CODE: C03

Effective date: 20210302

C30A Notification sent

Free format text: JAPANESE INTERMEDIATE CODE: C3012

Effective date: 20210302