JP2016105462A5 - - Google Patents

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Publication number
JP2016105462A5
JP2016105462A5 JP2015205576A JP2015205576A JP2016105462A5 JP 2016105462 A5 JP2016105462 A5 JP 2016105462A5 JP 2015205576 A JP2015205576 A JP 2015205576A JP 2015205576 A JP2015205576 A JP 2015205576A JP 2016105462 A5 JP2016105462 A5 JP 2016105462A5
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JP
Japan
Prior art keywords
semiconductor substrate
transfer module
vacuum transfer
vacuum
operable
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Pending
Application number
JP2015205576A
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English (en)
Japanese (ja)
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JP2016105462A (ja
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Publication date
Priority claimed from US14/522,338 external-priority patent/US9673071B2/en
Application filed filed Critical
Publication of JP2016105462A publication Critical patent/JP2016105462A/ja
Publication of JP2016105462A5 publication Critical patent/JP2016105462A5/ja
Pending legal-status Critical Current

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JP2015205576A 2014-10-23 2015-10-19 搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法 Pending JP2016105462A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/522,338 2014-10-23
US14/522,338 US9673071B2 (en) 2014-10-23 2014-10-23 Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates

Publications (2)

Publication Number Publication Date
JP2016105462A JP2016105462A (ja) 2016-06-09
JP2016105462A5 true JP2016105462A5 (https=) 2018-11-29

Family

ID=55792560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015205576A Pending JP2016105462A (ja) 2014-10-23 2015-10-19 搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法

Country Status (5)

Country Link
US (1) US9673071B2 (https=)
JP (1) JP2016105462A (https=)
KR (1) KR102534391B1 (https=)
CN (2) CN115020276A (https=)
TW (1) TWI713471B (https=)

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