CN115020276A - 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法 - Google Patents

用于半导体衬底热控制的缓冲站及传送半导体衬底的方法 Download PDF

Info

Publication number
CN115020276A
CN115020276A CN202210407940.7A CN202210407940A CN115020276A CN 115020276 A CN115020276 A CN 115020276A CN 202210407940 A CN202210407940 A CN 202210407940A CN 115020276 A CN115020276 A CN 115020276A
Authority
CN
China
Prior art keywords
transfer module
semiconductor substrate
vacuum transfer
operable
buffer chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210407940.7A
Other languages
English (en)
Chinese (zh)
Inventor
凯斯·弗里曼·伍德
马修·乔纳森·罗德尼克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN115020276A publication Critical patent/CN115020276A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202210407940.7A 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法 Pending CN115020276A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/522,338 2014-10-23
US14/522,338 US9673071B2 (en) 2014-10-23 2014-10-23 Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
CN201510696876.9A CN105551998A (zh) 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201510696876.9A Division CN105551998A (zh) 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法

Publications (1)

Publication Number Publication Date
CN115020276A true CN115020276A (zh) 2022-09-06

Family

ID=55792560

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210407940.7A Pending CN115020276A (zh) 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法
CN201510696876.9A Pending CN105551998A (zh) 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201510696876.9A Pending CN105551998A (zh) 2014-10-23 2015-10-23 用于半导体衬底热控制的缓冲站及传送半导体衬底的方法

Country Status (5)

Country Link
US (1) US9673071B2 (https=)
JP (1) JP2016105462A (https=)
KR (1) KR102534391B1 (https=)
CN (2) CN115020276A (https=)
TW (1) TWI713471B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10747210B2 (en) * 2017-09-11 2020-08-18 Lam Research Corporation System and method for automating user interaction for semiconductor manufacturing equipment
TWI828710B (zh) * 2018-06-18 2024-01-11 美商蘭姆研究公司 基板處理系統及基板處理方法
KR102568797B1 (ko) * 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
US10692759B2 (en) * 2018-07-17 2020-06-23 Applied Materials, Inc. Methods for manufacturing an interconnect structure for semiconductor devices
WO2020023409A1 (en) * 2018-07-24 2020-01-30 Applied Materials, Inc. Optically transparent pedestal for fluidly supporting a substrate
US11061417B2 (en) * 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
WO2021044581A1 (ja) * 2019-09-05 2021-03-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
WO2021046208A1 (en) * 2019-09-06 2021-03-11 Applied Materials, Inc. Shutter disk
WO2021055197A1 (en) * 2019-09-17 2021-03-25 Lam Research Corporation Atomic layer etch and ion beam etch patterning
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
US12080571B2 (en) * 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11810805B2 (en) * 2020-07-09 2023-11-07 Applied Materials, Inc. Prevention of contamination of substrates during gas purging
US11706928B2 (en) * 2020-10-30 2023-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
US12382640B2 (en) * 2020-10-30 2025-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
CN113611633B (zh) * 2021-07-21 2023-01-17 北京北方华创微电子装备有限公司 晶圆烘烤腔室及其晶圆预清洁方法
KR102606707B1 (ko) 2021-10-14 2023-11-29 주식회사 저스템 웨이퍼 버퍼용 챔버장치
CN115020308B (zh) * 2022-08-08 2022-11-22 上海果纳半导体技术有限公司武汉分公司 晶圆传输装置、设备平台系统及其晶圆传输方法
JP2025018726A (ja) * 2023-07-27 2025-02-06 株式会社Ｓｃｒｅｅｎホールディングス 基板接合装置
CN121510908B (zh) * 2026-01-13 2026-04-10 上海微釜半导体设备有限公司 晶圆缓存设备、方法及立式批次型外延工艺设备

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917556A (en) 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3965343B2 (ja) * 1994-08-19 2007-08-29 東京エレクトロン株式会社 処理装置
US5609698A (en) 1995-01-23 1997-03-11 General Electric Company Processing of gamma titanium-aluminide alloy using a heat treatment prior to deformation processing
US5879461A (en) * 1997-04-21 1999-03-09 Brooks Automation, Inc. Metered gas control in a substrate processing apparatus
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
TW442891B (en) 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
US6920915B1 (en) * 1999-10-02 2005-07-26 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for cooling a semiconductor substrate
US6377437B1 (en) 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
US6977014B1 (en) 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6543981B1 (en) 2001-03-30 2003-04-08 Lam Research Corp. Apparatus and method for creating an ultra-clean mini-environment through localized air flow augmentation
JP2003059999A (ja) * 2001-08-14 2003-02-28 Tokyo Electron Ltd 処理システム
CN1996552B (zh) 2001-08-31 2012-09-05 克罗辛自动化公司 晶片机
US20030131458A1 (en) * 2002-01-15 2003-07-17 Applied Materials, Inc. Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
JP4153781B2 (ja) * 2002-01-31 2008-09-24 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US7309618B2 (en) 2002-06-28 2007-12-18 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP4348921B2 (ja) * 2002-09-25 2009-10-21 東京エレクトロン株式会社 被処理体の搬送方法
US7153388B2 (en) 2003-03-31 2006-12-26 Lam Research Corporation Chamber for high-pressure wafer processing and method for making the same
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8403613B2 (en) * 2003-11-10 2013-03-26 Brooks Automation, Inc. Bypass thermal adjuster for vacuum semiconductor processing
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US20050230350A1 (en) 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US7445015B2 (en) 2004-09-30 2008-11-04 Lam Research Corporation Cluster tool process chamber having integrated high pressure and vacuum chambers
US7680559B2 (en) 2005-02-08 2010-03-16 Lam Research Corporation Wafer movement control macros
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
US7604449B1 (en) 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
JP3124289U (ja) * 2006-06-02 2006-08-10 株式会社島津製作所 クラスタ型装置
US7560007B2 (en) 2006-09-11 2009-07-14 Lam Research Corporation In-situ wafer temperature measurement and control
JP2010524201A (ja) 2007-03-22 2010-07-15 クロッシング オートメイション， インコーポレイテッド モジュラクラスタツール
WO2008144670A1 (en) * 2007-05-18 2008-11-27 Brooks Automation, Inc. Load lock fast pump vent
TWI455861B (zh) * 2007-05-18 2014-10-11 Brooks Automation Inc 基板加工工具、半導體加工工具、及基板加工裝置
US7798388B2 (en) 2007-05-31 2010-09-21 Applied Materials, Inc. Method of diffusion bonding a fluid flow apparatus
US8225683B2 (en) 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
US8033769B2 (en) 2007-11-30 2011-10-11 Novellus Systems, Inc. Loadlock designs and methods for using same
US8060252B2 (en) 2007-11-30 2011-11-15 Novellus Systems, Inc. High throughput method of in transit wafer position correction in system using multiple robots
US8430620B1 (en) 2008-03-24 2013-04-30 Novellus Systems, Inc. Dedicated hot and cold end effectors for improved throughput
US8185242B2 (en) 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
US8317934B2 (en) 2009-05-13 2012-11-27 Lam Research Corporation Multi-stage substrate cleaning method and apparatus
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8616821B2 (en) 2010-08-26 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated apparatus to assure wafer quality and manufacturability
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
US9385019B2 (en) 2012-06-21 2016-07-05 Globalfoundries Inc. Overhead substrate handling and storage system
US9293317B2 (en) 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment
US9558974B2 (en) 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
JP6049394B2 (ja) 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
US20140119858A1 (en) 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
US9640416B2 (en) 2012-12-26 2017-05-02 Asm Ip Holding B.V. Single-and dual-chamber module-attachable wafer-handling chamber

Also Published As

Publication number Publication date
US9673071B2 (en) 2017-06-06
CN105551998A (zh) 2016-05-04
JP2016105462A (ja) 2016-06-09
TWI713471B (zh) 2020-12-21
US20160118280A1 (en) 2016-04-28
KR102534391B1 (ko) 2023-05-18
TW201628119A (zh) 2016-08-01
KR20160047994A (ko) 2016-05-03

Similar Documents

Publication Publication Date Title
KR102534391B1 (ko) 버퍼 스테이션을 통해 이송된 반도체 기판들의 열 제어를 위한 버퍼 스테이션 및 반도체 기판들을 이송하는 방법
US20230420218A1 (en) Apparatuses and methods for avoiding electrical breakdown from rf terminal to adjacent non-rf terminal
KR102533126B1 (ko) 최적화된 저 에너지/고 생산성 디포지션 시스템
US10262887B2 (en) Pin lifter assembly with small gap
TWI685909B (zh) 用以移動晶圓之設備前端模組及方法
US20200083071A1 (en) Reduced footprint platform architecture with linear vacuum transfer module
JP2016105462A5 (https=)
CN106611727A (zh) 在原位从半导体处理模块移除和更换消耗部件的系统
KR102521160B1 (ko) 할로겐 제거 모듈 및 연관된 시스템들 및 방법들
TWI668791B (zh) 基板處理設備及使用該基板處理設備的基板處理方法
CN115132558A (zh) 等离子体处理系统和环状部件的安装方法
US10559483B2 (en) Platform architecture to improve system productivity
US20220403506A1 (en) Automated cleaning of robot arms of substrate processing systems
JP2020194890A (ja) 基板処理システム及び基板処理システムの制御方法
US20210125854A1 (en) Substrate processing apparatus
KR100803562B1 (ko) 기판 처리 장치
CN118140297A (zh) 等离子体处理系统和等离子体处理装置
US20220238312A1 (en) Showerhead insert for uniformity tuning
TW202201463A (zh) 基板處理工具的線性配置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination