JP2016105462A - 搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法 - Google Patents

搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法 Download PDF

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Publication number
JP2016105462A
JP2016105462A JP2015205576A JP2015205576A JP2016105462A JP 2016105462 A JP2016105462 A JP 2016105462A JP 2015205576 A JP2015205576 A JP 2015205576A JP 2015205576 A JP2015205576 A JP 2015205576A JP 2016105462 A JP2016105462 A JP 2016105462A
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semiconductor substrate
vacuum transfer
transfer module
vacuum
operable
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JP2015205576A
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Japanese (ja)
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JP2016105462A5 (https=
Inventor
キース・フリーマン・ウッド
Freeman Wood Keith
マシュー・ジョナサン・ロドニック
Jonathon Rodnick Matthew
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015205576A 2014-10-23 2015-10-19 搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法 Pending JP2016105462A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/522,338 2014-10-23
US14/522,338 US9673071B2 (en) 2014-10-23 2014-10-23 Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates

Publications (2)

Publication Number Publication Date
JP2016105462A true JP2016105462A (ja) 2016-06-09
JP2016105462A5 JP2016105462A5 (https=) 2018-11-29

Family

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Family Applications (1)

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JP2015205576A Pending JP2016105462A (ja) 2014-10-23 2015-10-19 搬送される半導体基板の熱制御のためのバッファステーションおよび半導体基板の搬送方法

Country Status (5)

Country Link
US (1) US9673071B2 (https=)
JP (1) JP2016105462A (https=)
KR (1) KR102534391B1 (https=)
CN (2) CN115020276A (https=)
TW (1) TWI713471B (https=)

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JPWO2021044581A1 (https=) * 2019-09-05 2021-03-11
JP2022547953A (ja) * 2019-09-17 2022-11-16 ラム リサーチ コーポレーション 原子層エッチングおよびイオンビームエッチングのパターニング
JP2023523663A (ja) * 2019-09-06 2023-06-07 アプライド マテリアルズ インコーポレイテッド シャッターディスク
JP2024075581A (ja) * 2019-01-16 2024-06-04 アプライド マテリアルズ インコーポレイテッド 光学積層体の堆積及び装置内計測

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KR102568797B1 (ko) * 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
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US11061417B2 (en) * 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
US12080571B2 (en) * 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11810805B2 (en) * 2020-07-09 2023-11-07 Applied Materials, Inc. Prevention of contamination of substrates during gas purging
US11706928B2 (en) * 2020-10-30 2023-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
US12382640B2 (en) * 2020-10-30 2025-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
CN113611633B (zh) * 2021-07-21 2023-01-17 北京北方华创微电子装备有限公司 晶圆烘烤腔室及其晶圆预清洁方法
KR102606707B1 (ko) 2021-10-14 2023-11-29 주식회사 저스템 웨이퍼 버퍼용 챔버장치
CN115020308B (zh) * 2022-08-08 2022-11-22 上海果纳半导体技术有限公司武汉分公司 晶圆传输装置、设备平台系统及其晶圆传输方法
JP2025018726A (ja) * 2023-07-27 2025-02-06 株式会社Ｓｃｒｅｅｎホールディングス 基板接合装置
CN121510908B (zh) * 2026-01-13 2026-04-10 上海微釜半导体设备有限公司 晶圆缓存设备、方法及立式批次型外延工艺设备

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Also Published As

Publication number Publication date
US9673071B2 (en) 2017-06-06
CN115020276A (zh) 2022-09-06
CN105551998A (zh) 2016-05-04
TWI713471B (zh) 2020-12-21
US20160118280A1 (en) 2016-04-28
KR102534391B1 (ko) 2023-05-18
TW201628119A (zh) 2016-08-01
KR20160047994A (ko) 2016-05-03

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