KR102534391B1 - 버퍼 스테이션을 통해 이송된 반도체 기판들의 열 제어를 위한 버퍼 스테이션 및 반도체 기판들을 이송하는 방법 - Google Patents

버퍼 스테이션을 통해 이송된 반도체 기판들의 열 제어를 위한 버퍼 스테이션 및 반도체 기판들을 이송하는 방법 Download PDF

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KR102534391B1
KR102534391B1 KR1020150145946A KR20150145946A KR102534391B1 KR 102534391 B1 KR102534391 B1 KR 102534391B1 KR 1020150145946 A KR1020150145946 A KR 1020150145946A KR 20150145946 A KR20150145946 A KR 20150145946A KR 102534391 B1 KR102534391 B1 KR 102534391B1
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transfer module
vacuum transfer
semiconductor substrate
operable
lower pedestal
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KR20160047994A (ko
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키이스 프리만 우드
매튜 조나단 로드닉
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램 리써치 코포레이션
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    • H01L21/67703—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H01L21/67098—
    • H01L21/67739—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150145946A 2014-10-23 2015-10-20 버퍼 스테이션을 통해 이송된 반도체 기판들의 열 제어를 위한 버퍼 스테이션 및 반도체 기판들을 이송하는 방법 Active KR102534391B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/522,338 US9673071B2 (en) 2014-10-23 2014-10-23 Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US14/522,338 2014-10-23

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KR20160047994A KR20160047994A (ko) 2016-05-03
KR102534391B1 true KR102534391B1 (ko) 2023-05-18

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US (1) US9673071B2 (https=)
JP (1) JP2016105462A (https=)
KR (1) KR102534391B1 (https=)
CN (2) CN115020276A (https=)
TW (1) TWI713471B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10747210B2 (en) * 2017-09-11 2020-08-18 Lam Research Corporation System and method for automating user interaction for semiconductor manufacturing equipment
CN112335030B (zh) * 2018-06-18 2025-10-10 朗姆研究公司 占用面积减小的晶片搬运平台
KR102568797B1 (ko) * 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
US10692759B2 (en) * 2018-07-17 2020-06-23 Applied Materials, Inc. Methods for manufacturing an interconnect structure for semiconductor devices
WO2020023409A1 (en) * 2018-07-24 2020-01-30 Applied Materials, Inc. Optically transparent pedestal for fluidly supporting a substrate
US11061417B2 (en) * 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
US10886155B2 (en) 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
WO2021044581A1 (ja) * 2019-09-05 2021-03-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
US11171017B2 (en) 2019-09-06 2021-11-09 Applied Materials, Inc. Shutter disk
WO2021055197A1 (en) * 2019-09-17 2021-03-25 Lam Research Corporation Atomic layer etch and ion beam etch patterning
US11049740B1 (en) 2019-12-05 2021-06-29 Applied Materials, Inc. Reconfigurable mainframe with replaceable interface plate
US12080571B2 (en) * 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11810805B2 (en) * 2020-07-09 2023-11-07 Applied Materials, Inc. Prevention of contamination of substrates during gas purging
US11706928B2 (en) * 2020-10-30 2023-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
US12382640B2 (en) * 2020-10-30 2025-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
CN113611633B (zh) * 2021-07-21 2023-01-17 北京北方华创微电子装备有限公司 晶圆烘烤腔室及其晶圆预清洁方法
KR102606707B1 (ko) 2021-10-14 2023-11-29 주식회사 저스템 웨이퍼 버퍼용 챔버장치
CN115020308B (zh) * 2022-08-08 2022-11-22 上海果纳半导体技术有限公司武汉分公司 晶圆传输装置、设备平台系统及其晶圆传输方法
JP2025018726A (ja) * 2023-07-27 2025-02-06 株式会社Ｓｃｒｅｅｎホールディングス 基板接合装置
CN121510908B (zh) * 2026-01-13 2026-04-10 上海微釜半导体设备有限公司 晶圆缓存设备、方法及立式批次型外延工艺设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179120A (ja) * 1994-08-19 2003-06-27 Tokyo Electron Ltd 処理装置

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917556A (en) 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
US5609698A (en) 1995-01-23 1997-03-11 General Electric Company Processing of gamma titanium-aluminide alloy using a heat treatment prior to deformation processing
US5879461A (en) * 1997-04-21 1999-03-09 Brooks Automation, Inc. Metered gas control in a substrate processing apparatus
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
TW442891B (en) 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
US6920915B1 (en) * 1999-10-02 2005-07-26 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for cooling a semiconductor substrate
US6377437B1 (en) 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
US6977014B1 (en) 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6543981B1 (en) 2001-03-30 2003-04-08 Lam Research Corp. Apparatus and method for creating an ultra-clean mini-environment through localized air flow augmentation
JP2003059999A (ja) * 2001-08-14 2003-02-28 Tokyo Electron Ltd 処理システム
CN1996553A (zh) 2001-08-31 2007-07-11 阿赛斯特技术公司 用于半导体材料处理系统的一体化机架
US20030131458A1 (en) * 2002-01-15 2003-07-17 Applied Materials, Inc. Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
JP4153781B2 (ja) * 2002-01-31 2008-09-24 大日本スクリーン製造株式会社 熱処理装置および基板処理装置
US7309618B2 (en) 2002-06-28 2007-12-18 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP4348921B2 (ja) * 2002-09-25 2009-10-21 東京エレクトロン株式会社 被処理体の搬送方法
US7153388B2 (en) 2003-03-31 2006-12-26 Lam Research Corporation Chamber for high-pressure wafer processing and method for making the same
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US8403613B2 (en) * 2003-11-10 2013-03-26 Brooks Automation, Inc. Bypass thermal adjuster for vacuum semiconductor processing
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US20050230350A1 (en) 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US7445015B2 (en) 2004-09-30 2008-11-04 Lam Research Corporation Cluster tool process chamber having integrated high pressure and vacuum chambers
US7680559B2 (en) 2005-02-08 2010-03-16 Lam Research Corporation Wafer movement control macros
US7536538B1 (en) 2005-03-31 2009-05-19 Lam Research Corporation Cluster tools for processing substrates using at least a key file
US7604449B1 (en) 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
JP3124289U (ja) * 2006-06-02 2006-08-10 株式会社島津製作所 クラスタ型装置
US7560007B2 (en) 2006-09-11 2009-07-14 Lam Research Corporation In-situ wafer temperature measurement and control
US10163667B2 (en) 2007-03-22 2018-12-25 Brooks Automation, Inc. Linear wafer drive for handling wafers during semiconductor fabrication
TWI455861B (zh) * 2007-05-18 2014-10-11 Brooks Automation Inc 基板加工工具、半導體加工工具、及基板加工裝置
US8272825B2 (en) * 2007-05-18 2012-09-25 Brooks Automation, Inc. Load lock fast pump vent
US7798388B2 (en) 2007-05-31 2010-09-21 Applied Materials, Inc. Method of diffusion bonding a fluid flow apparatus
US8225683B2 (en) 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
US8060252B2 (en) 2007-11-30 2011-11-15 Novellus Systems, Inc. High throughput method of in transit wafer position correction in system using multiple robots
US8033769B2 (en) 2007-11-30 2011-10-11 Novellus Systems, Inc. Loadlock designs and methods for using same
US8430620B1 (en) 2008-03-24 2013-04-30 Novellus Systems, Inc. Dedicated hot and cold end effectors for improved throughput
US8185242B2 (en) 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
US8317934B2 (en) 2009-05-13 2012-11-27 Lam Research Corporation Multi-stage substrate cleaning method and apparatus
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8616821B2 (en) 2010-08-26 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated apparatus to assure wafer quality and manufacturability
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
US9385019B2 (en) 2012-06-21 2016-07-05 Globalfoundries Inc. Overhead substrate handling and storage system
US9293317B2 (en) 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment
US9558974B2 (en) 2012-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing station and method for processing semiconductor wafer
JP6049394B2 (ja) 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
US20140119858A1 (en) 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
US9640416B2 (en) 2012-12-26 2017-05-02 Asm Ip Holding B.V. Single-and dual-chamber module-attachable wafer-handling chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179120A (ja) * 1994-08-19 2003-06-27 Tokyo Electron Ltd 処理装置

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CN115020276A (zh) 2022-09-06
KR20160047994A (ko) 2016-05-03
US20160118280A1 (en) 2016-04-28
TW201628119A (zh) 2016-08-01
CN105551998A (zh) 2016-05-04
US9673071B2 (en) 2017-06-06
JP2016105462A (ja) 2016-06-09
TWI713471B (zh) 2020-12-21

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