JP2016092300A - 半導体装置及び半導体装置の製造方法 - Google Patents

半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
JP2016092300A
JP2016092300A JP2014227144A JP2014227144A JP2016092300A JP 2016092300 A JP2016092300 A JP 2016092300A JP 2014227144 A JP2014227144 A JP 2014227144A JP 2014227144 A JP2014227144 A JP 2014227144A JP 2016092300 A JP2016092300 A JP 2016092300A
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JP
Japan
Prior art keywords
main body
semiconductor device
semiconductor element
wiring board
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014227144A
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English (en)
Japanese (ja)
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JP2016092300A5 (https=
Inventor
小澤　隆史
Takashi Ozawa
隆史 小澤
一貴 徳永
Kazuki Tokunaga
一貴 徳永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014227144A priority Critical patent/JP2016092300A/ja
Priority to US14/886,312 priority patent/US9666506B2/en
Publication of JP2016092300A publication Critical patent/JP2016092300A/ja
Publication of JP2016092300A5 publication Critical patent/JP2016092300A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014227144A 2014-11-07 2014-11-07 半導体装置及び半導体装置の製造方法 Pending JP2016092300A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014227144A JP2016092300A (ja) 2014-11-07 2014-11-07 半導体装置及び半導体装置の製造方法
US14/886,312 US9666506B2 (en) 2014-11-07 2015-10-19 Heat spreader with wiring substrate for reduced thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014227144A JP2016092300A (ja) 2014-11-07 2014-11-07 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2016092300A true JP2016092300A (ja) 2016-05-23
JP2016092300A5 JP2016092300A5 (https=) 2017-07-20

Family

ID=55912832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014227144A Pending JP2016092300A (ja) 2014-11-07 2014-11-07 半導体装置及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US9666506B2 (https=)
JP (1) JP2016092300A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018064060A (ja) * 2016-10-14 2018-04-19 オムロン株式会社 電子装置およびその製造方法
JP2018176356A (ja) * 2017-04-13 2018-11-15 ファナック株式会社 制御装置及び機械学習装置
JP2020145270A (ja) * 2019-03-05 2020-09-10 住友ベークライト株式会社 電子装置
WO2021177093A1 (ja) * 2020-03-06 2021-09-10 株式会社村田製作所 放熱構造体及び電子機器
CN113614898A (zh) * 2019-01-22 2021-11-05 德克萨斯仪器股份有限公司 带有暴露的夹的电子器件倒装芯片封装

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575676B (zh) * 2014-11-17 2017-03-21 矽品精密工業股份有限公司 電子封裝結構及其製法
FR3053526B1 (fr) 2016-07-01 2018-11-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication collective de dispositifs electroniques et dispositif electronique
US12108569B2 (en) * 2020-05-06 2024-10-01 Asia Vital Components Co., Ltd. Heat dissipation connection structure of handheld device
CN111769085A (zh) * 2020-07-20 2020-10-13 杰华特微电子（杭州）有限公司 一种半导体散热片装置、封装方法及封装结构
US11482482B2 (en) * 2020-09-11 2022-10-25 Advanced Semiconductor Engineering, Inc. Substrate structures, methods for forming the same and semiconductor device structures comprising the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006501677A (ja) * 2002-09-30 2006-01-12 アドバンスド インターコネクト テクノロジーズ リミテッド ブロック成形集成体用の耐熱強化パッケージ
EP2709144A2 (en) * 2012-09-14 2014-03-19 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW510158B (en) * 1999-05-14 2002-11-11 Siliconware Precision Industries Co Ltd Heat dissipation structure for semiconductor device
JP2001210761A (ja) * 2000-01-24 2001-08-03 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP3817453B2 (ja) * 2001-09-25 2006-09-06 新光電気工業株式会社 半導体装置
US7109520B2 (en) * 2003-10-10 2006-09-19 E. I. Du Pont De Nemours And Company Heat sinks
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
JP2006332436A (ja) * 2005-05-27 2006-12-07 Shinko Electric Ind Co Ltd 半導体モジュールおよび半導体モジュール用放熱板
JP2009302556A (ja) 2009-08-31 2009-12-24 Renesas Technology Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006501677A (ja) * 2002-09-30 2006-01-12 アドバンスド インターコネクト テクノロジーズ リミテッド ブロック成形集成体用の耐熱強化パッケージ
EP2709144A2 (en) * 2012-09-14 2014-03-19 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018064060A (ja) * 2016-10-14 2018-04-19 オムロン株式会社 電子装置およびその製造方法
JP2018176356A (ja) * 2017-04-13 2018-11-15 ファナック株式会社 制御装置及び機械学習装置
US10549423B2 (en) 2017-04-13 2020-02-04 Fanuc Corporation Controller and machine learning device
CN113614898A (zh) * 2019-01-22 2021-11-05 德克萨斯仪器股份有限公司 带有暴露的夹的电子器件倒装芯片封装
JP2022523671A (ja) * 2019-01-22 2022-04-26 テキサス インスツルメンツ インコーポレイテッド 露出したクリップを備える電子デバイスフリップチップパッケージ
JP7601773B2 (ja) 2019-01-22 2024-12-17 テキサス インスツルメンツ インコーポレイテッド 露出したクリップを備える電子デバイスフリップチップパッケージ
JP2025029152A (ja) * 2019-01-22 2025-03-05 テキサス インスツルメンツ インコーポレイテッド 露出したクリップを備える電子デバイスフリップチップパッケージ
JP2020145270A (ja) * 2019-03-05 2020-09-10 住友ベークライト株式会社 電子装置
WO2021177093A1 (ja) * 2020-03-06 2021-09-10 株式会社村田製作所 放熱構造体及び電子機器
JPWO2021177093A1 (https=) * 2020-03-06 2021-09-10

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US9666506B2 (en) 2017-05-30
US20160133541A1 (en) 2016-05-12

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