JPWO2021177093A1 - - Google Patents
Info
- Publication number
- JPWO2021177093A1 JPWO2021177093A1 JP2022505136A JP2022505136A JPWO2021177093A1 JP WO2021177093 A1 JPWO2021177093 A1 JP WO2021177093A1 JP 2022505136 A JP2022505136 A JP 2022505136A JP 2022505136 A JP2022505136 A JP 2022505136A JP WO2021177093 A1 JPWO2021177093 A1 JP WO2021177093A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020038794 | 2020-03-06 | ||
| PCT/JP2021/006809 WO2021177093A1 (ja) | 2020-03-06 | 2021-02-24 | 放熱構造体及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021177093A1 true JPWO2021177093A1 (https=) | 2021-09-10 |
| JPWO2021177093A5 JPWO2021177093A5 (https=) | 2022-05-13 |
Family
ID=77613578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022505136A Pending JPWO2021177093A1 (https=) | 2020-03-06 | 2021-02-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021177093A1 (https=) |
| CN (1) | CN218730889U (https=) |
| WO (1) | WO2021177093A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121694066A (zh) * | 2023-07-26 | 2026-03-17 | 长江存储科技有限责任公司 | 芯片封装结构、半导体结构及其制作方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186847A (ja) * | 2009-02-12 | 2010-08-26 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法、並びに電子装置 |
| JP2016092300A (ja) * | 2014-11-07 | 2016-05-23 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2017139278A (ja) * | 2016-02-02 | 2017-08-10 | Ｔｏｗａ株式会社 | 電子部品の製造装置及び製造方法並びに電子部品 |
| JP2018056285A (ja) * | 2016-09-28 | 2018-04-05 | 富士通株式会社 | 電子装置、電子装置の製造方法及び電子機器 |
-
2021
- 2021-02-24 JP JP2022505136A patent/JPWO2021177093A1/ja active Pending
- 2021-02-24 CN CN202190000302.2U patent/CN218730889U/zh active Active
- 2021-02-24 WO PCT/JP2021/006809 patent/WO2021177093A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010186847A (ja) * | 2009-02-12 | 2010-08-26 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法、並びに電子装置 |
| JP2016092300A (ja) * | 2014-11-07 | 2016-05-23 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2017139278A (ja) * | 2016-02-02 | 2017-08-10 | Ｔｏｗａ株式会社 | 電子部品の製造装置及び製造方法並びに電子部品 |
| JP2018056285A (ja) * | 2016-09-28 | 2018-04-05 | 富士通株式会社 | 電子装置、電子装置の製造方法及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021177093A1 (ja) | 2021-09-10 |
| CN218730889U (zh) | 2023-03-24 |
Similar Documents
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