CN218730889U - 散热构造体以及电子设备 - Google Patents

散热构造体以及电子设备 Download PDF

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Publication number
CN218730889U
CN218730889U CN202190000302.2U CN202190000302U CN218730889U CN 218730889 U CN218730889 U CN 218730889U CN 202190000302 U CN202190000302 U CN 202190000302U CN 218730889 U CN218730889 U CN 218730889U
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China
Prior art keywords
heat dissipation
heat
dissipation structure
electronic component
substrate
Prior art date
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Active
Application number
CN202190000302.2U
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English (en)
Chinese (zh)
Inventor
玉山孟明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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Publication of CN218730889U publication Critical patent/CN218730889U/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202190000302.2U 2020-03-06 2021-02-24 散热构造体以及电子设备 Active CN218730889U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-038794 2020-03-06
JP2020038794 2020-03-06
PCT/JP2021/006809 WO2021177093A1 (ja) 2020-03-06 2021-02-24 放熱構造体及び電子機器

Publications (1)

Publication Number Publication Date
CN218730889U true CN218730889U (zh) 2023-03-24

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ID=77613578

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202190000302.2U Active CN218730889U (zh) 2020-03-06 2021-02-24 散热构造体以及电子设备

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JP (1) JPWO2021177093A1 (https=)
CN (1) CN218730889U (https=)
WO (1) WO2021177093A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121694066A (zh) * 2023-07-26 2026-03-17 长江存储科技有限责任公司 芯片封装结构、半导体结构及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5193898B2 (ja) * 2009-02-12 2013-05-08 新光電気工業株式会社 半導体装置及び電子装置
JP2016092300A (ja) * 2014-11-07 2016-05-23 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP6639931B2 (ja) * 2016-02-02 2020-02-05 Ｔｏｗａ株式会社 電子部品の製造装置及び製造方法並びに電子部品
JP2018056285A (ja) * 2016-09-28 2018-04-05 富士通株式会社 電子装置、電子装置の製造方法及び電子機器

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Publication number Publication date
JPWO2021177093A1 (https=) 2021-09-10
WO2021177093A1 (ja) 2021-09-10

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