JPWO2021177093A5 - - Google Patents
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- Publication number
- JPWO2021177093A5 JPWO2021177093A5 JP2022505136A JP2022505136A JPWO2021177093A5 JP WO2021177093 A5 JPWO2021177093 A5 JP WO2021177093A5 JP 2022505136 A JP2022505136 A JP 2022505136A JP 2022505136 A JP2022505136 A JP 2022505136A JP WO2021177093 A5 JPWO2021177093 A5 JP WO2021177093A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- structure according
- transfer member
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 8
- 239000003566 sealing material Substances 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020038794 | 2020-03-06 | ||
| PCT/JP2021/006809 WO2021177093A1 (ja) | 2020-03-06 | 2021-02-24 | 放熱構造体及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021177093A1 JPWO2021177093A1 (https=) | 2021-09-10 |
| JPWO2021177093A5 true JPWO2021177093A5 (https=) | 2022-05-13 |
Family
ID=77613578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022505136A Pending JPWO2021177093A1 (https=) | 2020-03-06 | 2021-02-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021177093A1 (https=) |
| CN (1) | CN218730889U (https=) |
| WO (1) | WO2021177093A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121694066A (zh) * | 2023-07-26 | 2026-03-17 | 长江存储科技有限责任公司 | 芯片封装结构、半导体结构及其制作方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5193898B2 (ja) * | 2009-02-12 | 2013-05-08 | 新光電気工業株式会社 | 半導体装置及び電子装置 |
| JP2016092300A (ja) * | 2014-11-07 | 2016-05-23 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6639931B2 (ja) * | 2016-02-02 | 2020-02-05 | Ｔｏｗａ株式会社 | 電子部品の製造装置及び製造方法並びに電子部品 |
| JP2018056285A (ja) * | 2016-09-28 | 2018-04-05 | 富士通株式会社 | 電子装置、電子装置の製造方法及び電子機器 |
-
2021
- 2021-02-24 JP JP2022505136A patent/JPWO2021177093A1/ja active Pending
- 2021-02-24 CN CN202190000302.2U patent/CN218730889U/zh active Active
- 2021-02-24 WO PCT/JP2021/006809 patent/WO2021177093A1/ja not_active Ceased
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