JP2016074086A5 - - Google Patents

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Publication number
JP2016074086A5
JP2016074086A5 JP2016014125A JP2016014125A JP2016074086A5 JP 2016074086 A5 JP2016074086 A5 JP 2016074086A5 JP 2016014125 A JP2016014125 A JP 2016014125A JP 2016014125 A JP2016014125 A JP 2016014125A JP 2016074086 A5 JP2016074086 A5 JP 2016074086A5
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JP
Japan
Prior art keywords
polishing
layer
polishing pad
surface layer
pad
Prior art date
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Application number
JP2016014125A
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English (en)
Japanese (ja)
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JP2016074086A (ja
JP6209628B2 (ja
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Priority claimed from US13/488,149 external-priority patent/US9597769B2/en
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Publication of JP2016074086A publication Critical patent/JP2016074086A/ja
Publication of JP2016074086A5 publication Critical patent/JP2016074086A5/ja
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Publication of JP6209628B2 publication Critical patent/JP6209628B2/ja
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JP2016014125A 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド Active JP6209628B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/488,149 2012-06-04
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015515155A Division JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Publications (3)

Publication Number Publication Date
JP2016074086A JP2016074086A (ja) 2016-05-12
JP2016074086A5 true JP2016074086A5 (https=) 2016-11-24
JP6209628B2 JP6209628B2 (ja) 2017-10-04

Family

ID=48607367

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015515155A Active JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド
JP2016014125A Active JP6209628B2 (ja) 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2015515155A Active JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Country Status (8)

Country Link
US (1) US9597769B2 (https=)
EP (1) EP2872291B1 (https=)
JP (2) JP5908169B2 (https=)
KR (3) KR101729610B1 (https=)
CN (1) CN104520068B (https=)
SG (2) SG11201407839PA (https=)
TW (2) TWI554364B (https=)
WO (1) WO2013184465A1 (https=)

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KR102248338B1 (ko) * 2019-10-01 2021-05-06 (주)앰스코 연마 대상물의 요철부에 삽입 가능한 연마부재
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CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
USD1022364S1 (en) 2022-06-03 2024-04-09 Entegris, Inc. Polyvinyl alcohol pad
EP4533529A1 (en) * 2022-06-03 2025-04-09 Entegris, Inc. Devices for cleaning substrates and related methods
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