JP2016063226A5 - - Google Patents

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Publication number
JP2016063226A5
JP2016063226A5 JP2015178095A JP2015178095A JP2016063226A5 JP 2016063226 A5 JP2016063226 A5 JP 2016063226A5 JP 2015178095 A JP2015178095 A JP 2015178095A JP 2015178095 A JP2015178095 A JP 2015178095A JP 2016063226 A5 JP2016063226 A5 JP 2016063226A5
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JP
Japan
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component
applying
material deposited
hno3
components
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JP2015178095A
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English (en)
Japanese (ja)
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JP2016063226A (ja
JP6584249B2 (ja
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Priority claimed from US14/525,118 external-priority patent/US9406534B2/en
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Publication of JP2016063226A5 publication Critical patent/JP2016063226A5/ja
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JP2015178095A 2014-09-17 2015-09-10 プラズマ処理チャンバの構成部品を洗浄する湿式洗浄工程 Active JP6584249B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462051920P 2014-09-17 2014-09-17
US62/051,920 2014-09-17
US14/525,118 US9406534B2 (en) 2014-09-17 2014-10-27 Wet clean process for cleaning plasma processing chamber components
US14/525,118 2014-10-27

Publications (3)

Publication Number Publication Date
JP2016063226A JP2016063226A (ja) 2016-04-25
JP2016063226A5 true JP2016063226A5 (enExample) 2018-10-18
JP6584249B2 JP6584249B2 (ja) 2019-10-02

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ID=55455446

Family Applications (1)

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JP2015178095A Active JP6584249B2 (ja) 2014-09-17 2015-09-10 プラズマ処理チャンバの構成部品を洗浄する湿式洗浄工程

Country Status (5)

Country Link
US (1) US9406534B2 (enExample)
JP (1) JP6584249B2 (enExample)
KR (1) KR20160033056A (enExample)
CN (1) CN105428210B (enExample)
TW (1) TWI693651B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190070639A1 (en) * 2017-09-07 2019-03-07 Applied Materials, Inc. Automatic cleaning machine for cleaning process kits
KR102461911B1 (ko) * 2018-07-13 2022-10-31 삼성전자주식회사 플라즈마 제네레이터, 이를 포함하는 세정수 처리 장치, 반도체 세정 장치 및 세정수 처리 방법
US11488848B2 (en) * 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
US12060636B2 (en) * 2018-09-21 2024-08-13 Lam Research Corporation Method for conditioning a plasma processing chamber
KR102156980B1 (ko) * 2018-11-28 2020-09-16 배기백 차량의 크롬몰딩 복원방법
KR102024757B1 (ko) * 2019-02-15 2019-09-24 (주)에이텍솔루션 이온 소스의 세정 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102027183B1 (ko) * 2019-03-08 2019-10-01 (주)에이텍솔루션 이온 소스의 세정 방법 및 이를 이용한 반도체 소자의 제조 방법
US20230023764A1 (en) * 2019-12-17 2023-01-26 Applied Materials, Inc. Surface profiling and texturing of chamber components
CN111534825B (zh) * 2020-05-14 2022-05-31 富乐德科技发展(大连)有限公司 去除半导体设备不锈钢部件钛及氮化钛沉积膜的工艺
US20210391150A1 (en) * 2020-06-10 2021-12-16 Plasma-Therm Llc Plasma Source Configuration
US12237186B2 (en) * 2022-09-15 2025-02-25 Applied Materials, Inc. On-board cleaning of tooling parts in hybrid bonding tool

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265289B1 (ko) * 1998-01-26 2000-09-15 윤종용 플라즈마식각장치의 캐소우드 제조방법 및 이에 따라 제조되는 캐소우드
KR100445273B1 (ko) * 2001-10-26 2004-08-21 손정하 세라믹 절연체의 세정방법
ATE472172T1 (de) * 2002-04-17 2010-07-15 Lam Res Corp Verfahren zur herstellung einer silizium- elektrode für plasma-reaktionskammer
US6902628B2 (en) * 2002-11-25 2005-06-07 Applied Materials, Inc. Method of cleaning a coated process chamber component
US7045072B2 (en) * 2003-07-24 2006-05-16 Tan Samantha S H Cleaning process and apparatus for silicate materials
US7077918B2 (en) * 2004-01-29 2006-07-18 Unaxis Balzers Ltd. Stripping apparatus and method for removal of coatings on metal surfaces
US20090142247A1 (en) * 2007-12-03 2009-06-04 Applied Materials, Inc. Chemical treatment to reduce machining-induced sub-surface damage in semiconductor processing components comprising silicon carbide
MX347701B (es) * 2008-05-02 2017-05-09 Oerlikon Surface Solutions Ag Pfäffikon Procedimiento para decapar piezas de trabajo y solucion de decapado.
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8734586B2 (en) * 2012-02-02 2014-05-27 Sematech, Inc. Process for cleaning shield surfaces in deposition systems

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