JP2016058467A - 圧電素子、液体噴射ヘッド、及び、液体噴射装置 - Google Patents
圧電素子、液体噴射ヘッド、及び、液体噴射装置 Download PDFInfo
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- JP2016058467A JP2016058467A JP2014181910A JP2014181910A JP2016058467A JP 2016058467 A JP2016058467 A JP 2016058467A JP 2014181910 A JP2014181910 A JP 2014181910A JP 2014181910 A JP2014181910 A JP 2014181910A JP 2016058467 A JP2016058467 A JP 2016058467A
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- 238000005401 electroluminescence Methods 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
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- 239000010931 gold Substances 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 230000005684 electric field Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- -1 iridium (Ir) Chemical class 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
前記支持体の前記第1の領域上に第1の電極層、圧電体層、および第2の電極層がこの順に積層されてなる圧電素子本体と、
前記第2の電極層上に密着層を介して積層される金属層と、を備え、
前記圧電素子本体の一部は前記第2の領域まで延設され、
当該延設側の領域において、前記金属層が前記第1の領域に重なる位置から前記第2の領域に重なる位置に亘って形成されると共に、前記密着層が当該金属層と重なる位置を越えて前記第2の電極層の端部まで延設されたことを特徴とする。
Claims (3)
- 撓み変形が許容される第1の領域と、該第1の領域の外側であって撓み変形が阻害される第2の領域とからなる支持体と、
前記支持体の前記第1の領域上に第1の電極層、圧電体層、および第2の電極層がこの順に積層されてなる圧電素子本体と、
前記第2の電極層上に密着層を介して積層される金属層と、を備え、
前記圧電素子本体の一部は前記第2の領域まで延設され、
当該延設側の領域において、前記金属層が前記第1の領域に重なる位置から前記第2の領域に重なる位置に亘って形成されると共に、前記密着層が当該金属層と重なる位置を越えて前記第2の電極層の端部まで延設されたことを特徴とする圧電素子。 - 請求項1に記載の圧電素子を備えたことを特徴とする液体噴射ヘッド。
- 請求項2に記載の液体噴射ヘッドを備えたことを特徴とする液体噴射装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014181910A JP6402547B2 (ja) | 2014-09-08 | 2014-09-08 | 圧電素子、液体噴射ヘッド、及び、液体噴射装置 |
US14/845,567 US9393784B2 (en) | 2014-09-08 | 2015-09-04 | Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus |
Applications Claiming Priority (1)
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JP2014181910A JP6402547B2 (ja) | 2014-09-08 | 2014-09-08 | 圧電素子、液体噴射ヘッド、及び、液体噴射装置 |
Publications (2)
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JP2016058467A true JP2016058467A (ja) | 2016-04-21 |
JP6402547B2 JP6402547B2 (ja) | 2018-10-10 |
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JP2014181910A Active JP6402547B2 (ja) | 2014-09-08 | 2014-09-08 | 圧電素子、液体噴射ヘッド、及び、液体噴射装置 |
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JP (1) | JP6402547B2 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018056376A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、超音波探触子、超音波装置、電子機器、液体噴射ヘッド、及び液体噴射装置 |
EP3822082A1 (en) | 2019-11-18 | 2021-05-19 | Seiko Epson Corporation | Liquid discharging head and method of manufacturing liquid discharging head |
US11400713B2 (en) | 2019-09-30 | 2022-08-02 | Seiko Epson Corporation | Liquid ejecting head and liquid ejecting apparatus |
US11440319B2 (en) | 2019-07-31 | 2022-09-13 | Seiko Epson Corporation | Liquid discharge head, liquid discharge apparatus, and method of manufacturing liquid discharge head |
US11458730B2 (en) | 2020-03-02 | 2022-10-04 | Seiko Epson Corporation | Liquid ejecting head, actuator, liquid ejecting apparatus, and method for manufacturing liquid ejecting head |
US11577511B2 (en) | 2020-06-26 | 2023-02-14 | Seiko Epson Corporation | Liquid discharge head and liquid discharge apparatus |
US11613121B2 (en) | 2020-03-25 | 2023-03-28 | Seiko Epson Corporation | Liquid discharge head, liquid discharge apparatus, and actuator |
US11752766B2 (en) | 2020-03-06 | 2023-09-12 | Seiko Epson Corporation | Liquid discharging head, liquid discharging apparatus, and method of manufacturing liquid discharging head |
US11794474B2 (en) | 2020-12-22 | 2023-10-24 | Seiko Epson Corporation | Liquid ejecting head and liquid ejecting apparatus |
US11872813B2 (en) | 2020-12-25 | 2024-01-16 | Seiko Epson Corporation | Liquid discharge head and actuator |
US11932017B2 (en) | 2020-10-26 | 2024-03-19 | Seiko Epson Corporation | Liquid discharge head, liquid discharge device, and actuator |
Citations (4)
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JP2011056913A (ja) * | 2009-09-14 | 2011-03-24 | Fujifilm Corp | 液体吐出ヘッド、その製造方法、並びに、その駆動方法、及び、画像記録装置 |
JP2012114346A (ja) * | 2010-11-26 | 2012-06-14 | Konica Minolta Holdings Inc | 圧電モジュール、圧電デバイスおよびその製造方法 |
JP2014117925A (ja) * | 2012-12-19 | 2014-06-30 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
JP2014121799A (ja) * | 2012-12-20 | 2014-07-03 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
Family Cites Families (2)
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JP5957914B2 (ja) | 2012-02-01 | 2016-07-27 | セイコーエプソン株式会社 | 液体噴射ヘッドおよび液体噴射装置 |
JP6123992B2 (ja) * | 2013-03-05 | 2017-05-10 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
-
2014
- 2014-09-08 JP JP2014181910A patent/JP6402547B2/ja active Active
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- 2015-09-04 US US14/845,567 patent/US9393784B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011056913A (ja) * | 2009-09-14 | 2011-03-24 | Fujifilm Corp | 液体吐出ヘッド、その製造方法、並びに、その駆動方法、及び、画像記録装置 |
JP2012114346A (ja) * | 2010-11-26 | 2012-06-14 | Konica Minolta Holdings Inc | 圧電モジュール、圧電デバイスおよびその製造方法 |
JP2014117925A (ja) * | 2012-12-19 | 2014-06-30 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
JP2014121799A (ja) * | 2012-12-20 | 2014-07-03 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018056376A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、超音波探触子、超音波装置、電子機器、液体噴射ヘッド、及び液体噴射装置 |
US11440319B2 (en) | 2019-07-31 | 2022-09-13 | Seiko Epson Corporation | Liquid discharge head, liquid discharge apparatus, and method of manufacturing liquid discharge head |
US11400713B2 (en) | 2019-09-30 | 2022-08-02 | Seiko Epson Corporation | Liquid ejecting head and liquid ejecting apparatus |
EP3822082A1 (en) | 2019-11-18 | 2021-05-19 | Seiko Epson Corporation | Liquid discharging head and method of manufacturing liquid discharging head |
US11446928B2 (en) | 2019-11-18 | 2022-09-20 | Seiko Epson Corporation | Liquid discharging head and method of manufacturing liquid discharging head |
US11458730B2 (en) | 2020-03-02 | 2022-10-04 | Seiko Epson Corporation | Liquid ejecting head, actuator, liquid ejecting apparatus, and method for manufacturing liquid ejecting head |
US11752766B2 (en) | 2020-03-06 | 2023-09-12 | Seiko Epson Corporation | Liquid discharging head, liquid discharging apparatus, and method of manufacturing liquid discharging head |
US11613121B2 (en) | 2020-03-25 | 2023-03-28 | Seiko Epson Corporation | Liquid discharge head, liquid discharge apparatus, and actuator |
US11577511B2 (en) | 2020-06-26 | 2023-02-14 | Seiko Epson Corporation | Liquid discharge head and liquid discharge apparatus |
US11932017B2 (en) | 2020-10-26 | 2024-03-19 | Seiko Epson Corporation | Liquid discharge head, liquid discharge device, and actuator |
US11794474B2 (en) | 2020-12-22 | 2023-10-24 | Seiko Epson Corporation | Liquid ejecting head and liquid ejecting apparatus |
US11872813B2 (en) | 2020-12-25 | 2024-01-16 | Seiko Epson Corporation | Liquid discharge head and actuator |
Also Published As
Publication number | Publication date |
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US20160067967A1 (en) | 2016-03-10 |
JP6402547B2 (ja) | 2018-10-10 |
US9393784B2 (en) | 2016-07-19 |
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