JP2016044988A5 - - Google Patents

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Publication number
JP2016044988A5
JP2016044988A5 JP2014167171A JP2014167171A JP2016044988A5 JP 2016044988 A5 JP2016044988 A5 JP 2016044988A5 JP 2014167171 A JP2014167171 A JP 2014167171A JP 2014167171 A JP2014167171 A JP 2014167171A JP 2016044988 A5 JP2016044988 A5 JP 2016044988A5
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JP
Japan
Prior art keywords
analysis
nozzle
local
liquid
nebulizer
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JP2014167171A
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English (en)
Japanese (ja)
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JP5971289B2 (ja
JP2016044988A (ja
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Priority claimed from JP2014167171A external-priority patent/JP5971289B2/ja
Priority to JP2014167171A priority Critical patent/JP5971289B2/ja
Priority to EP15833717.0A priority patent/EP3184985B1/en
Priority to PCT/JP2015/070681 priority patent/WO2016027607A1/ja
Priority to KR1020177003062A priority patent/KR101921840B1/ko
Priority to US15/322,389 priority patent/US10151727B2/en
Priority to CN201580038916.9A priority patent/CN106662507B/zh
Priority to TW104125770A priority patent/TWI677681B/zh
Publication of JP2016044988A publication Critical patent/JP2016044988A/ja
Publication of JP2016044988A5 publication Critical patent/JP2016044988A5/ja
Publication of JP5971289B2 publication Critical patent/JP5971289B2/ja
Application granted granted Critical
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JP2014167171A 2014-08-20 2014-08-20 基板局所の自動分析装置及び分析方法 Active JP5971289B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014167171A JP5971289B2 (ja) 2014-08-20 2014-08-20 基板局所の自動分析装置及び分析方法
US15/322,389 US10151727B2 (en) 2014-08-20 2015-07-21 Automatic localized substrate analysis device and analysis method
PCT/JP2015/070681 WO2016027607A1 (ja) 2014-08-20 2015-07-21 基板局所の自動分析装置及び分析方法
KR1020177003062A KR101921840B1 (ko) 2014-08-20 2015-07-21 기판 국소의 자동 분석장치 및 분석방법
EP15833717.0A EP3184985B1 (en) 2014-08-20 2015-07-21 Automatic localized substrate analysis device and analysis method
CN201580038916.9A CN106662507B (zh) 2014-08-20 2015-07-21 基板局部的自动分析装置及分析方法
TW104125770A TWI677681B (zh) 2014-08-20 2015-08-07 基板局部的自動分析裝置及分析方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014167171A JP5971289B2 (ja) 2014-08-20 2014-08-20 基板局所の自動分析装置及び分析方法

Publications (3)

Publication Number Publication Date
JP2016044988A JP2016044988A (ja) 2016-04-04
JP2016044988A5 true JP2016044988A5 (enExample) 2016-05-19
JP5971289B2 JP5971289B2 (ja) 2016-08-17

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ID=55350553

Family Applications (1)

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JP2014167171A Active JP5971289B2 (ja) 2014-08-20 2014-08-20 基板局所の自動分析装置及び分析方法

Country Status (7)

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US (1) US10151727B2 (enExample)
EP (1) EP3184985B1 (enExample)
JP (1) JP5971289B2 (enExample)
KR (1) KR101921840B1 (enExample)
CN (1) CN106662507B (enExample)
TW (1) TWI677681B (enExample)
WO (1) WO2016027607A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP6108367B1 (ja) * 2015-12-22 2017-04-05 株式会社 イアス シリコン基板用分析装置
JP7128810B2 (ja) * 2016-10-14 2022-08-31 ディーエイチ テクノロジーズ デベロップメント プライベート リミテッド 化学的分析のためのシステムおよび方法
EP3457109B1 (en) * 2017-07-18 2021-09-01 Ias Inc. Nozzle for substrate analysis and substrate analysis method
CN107505382A (zh) * 2017-09-19 2017-12-22 同方威视技术股份有限公司 自动标定装置和离子迁移谱仪
US11244841B2 (en) * 2017-12-01 2022-02-08 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer
CN108181374A (zh) * 2018-02-08 2018-06-19 聚光科技(杭州)股份有限公司 等离子体-质谱分析系统的工作方法
WO2019212624A1 (en) * 2018-05-04 2019-11-07 Applied Materials, Inc. Nanoparticle measurement for processing chamber
US11211272B2 (en) 2019-09-25 2021-12-28 Micron Technology, Inc. Contaminant detection tools and related methods
US12152966B2 (en) 2020-04-16 2024-11-26 Elemental Scientific, Inc. Systems for integrated decomposition and scanning of a semiconducting wafer
KR102223660B1 (ko) * 2020-10-06 2021-03-05 주식회사 위드텍 웨이퍼 표면의 오염물 샘플링 노즐 및 샘플링 방법.

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JPH05283498A (ja) * 1991-11-12 1993-10-29 Matsushita Electric Ind Co Ltd 半導体基板表面不純物回収装置およびその使用方法
JP3179175B2 (ja) * 1992-03-12 2001-06-25 株式会社ピュアレックス 分析前処理方法
US5783939A (en) * 1996-07-26 1998-07-21 Delco Electronics Corporation Stepper motor gauge calibration by AC feedback
US5783938A (en) * 1997-02-24 1998-07-21 Contamination Studies Laboratories, Inc. Method and apparatus for the quantitative measurement of the corrosivity effect of residues present on the surface of electronic circuit assemblies
US6420275B1 (en) 1999-08-30 2002-07-16 Micron Technology, Inc. System and method for analyzing a semiconductor surface
JP2002039927A (ja) 2000-07-19 2002-02-06 Toshiba Ceramics Co Ltd シリコンウェーハ表層の部分分析方法
GB0104675D0 (en) * 2001-02-24 2001-04-11 Dyson Ltd A tool for a vacuum cleaner
JP3800996B2 (ja) 2001-06-29 2006-07-26 株式会社三井化学分析センター 基板表面の局所分析方法
US6803566B2 (en) 2002-04-16 2004-10-12 Ut-Battelle, Llc Sampling probe for microarray read out using electrospray mass spectrometry
CN1278403C (zh) * 2003-04-08 2006-10-04 力晶半导体股份有限公司 晶圆表面离子取样系统及方法
JP4496202B2 (ja) 2006-11-27 2010-07-07 株式会社 イアス ノズルおよび液体回収方法
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TWI529833B (zh) * 2009-12-18 2016-04-11 埃耶士股份有限公司 基板分析裝置及基板分析方法
JP2011232182A (ja) 2010-04-28 2011-11-17 Ias Inc 基板分析装置及び基板分析方法
JP4897870B2 (ja) * 2009-12-18 2012-03-14 株式会社 イアス 基板分析用ノズル及び基板分析方法
EP2567395B1 (en) * 2010-05-07 2019-12-18 UT-Battelle, LLC System and method for extracting a sample from a surface
US8486703B2 (en) * 2010-09-30 2013-07-16 Ut-Battelle, Llc Surface sampling concentration and reaction probe
US8519330B2 (en) * 2010-10-01 2013-08-27 Ut-Battelle, Llc Systems and methods for laser assisted sample transfer to solution for chemical analysis
JP5442589B2 (ja) 2010-12-22 2014-03-12 ジルトロニック アクチエンゲゼルシャフト シリコンウェハの金属不純物分析方法
CN102194726A (zh) * 2011-05-23 2011-09-21 叶伟清 晶圆表面局部定位采样方法
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US9176028B2 (en) * 2012-10-04 2015-11-03 Ut-Battelle, Llc Ball assisted device for analytical surface sampling

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