JP2016038468A - 感光性樹脂層のパターニング方法 - Google Patents

感光性樹脂層のパターニング方法 Download PDF

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Publication number
JP2016038468A
JP2016038468A JP2014161635A JP2014161635A JP2016038468A JP 2016038468 A JP2016038468 A JP 2016038468A JP 2014161635 A JP2014161635 A JP 2014161635A JP 2014161635 A JP2014161635 A JP 2014161635A JP 2016038468 A JP2016038468 A JP 2016038468A
Authority
JP
Japan
Prior art keywords
photosensitive resin
resin layer
patterning
group
atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014161635A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016038468A5 (enExample
Inventor
健 池亀
Takeshi Ikegame
健 池亀
美穂 石井
Yoshio Ishii
美穂 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014161635A priority Critical patent/JP2016038468A/ja
Priority to US14/817,022 priority patent/US20160041469A1/en
Publication of JP2016038468A publication Critical patent/JP2016038468A/ja
Publication of JP2016038468A5 publication Critical patent/JP2016038468A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2035—Exposure; Apparatus therefor simultaneous coating and exposure; using a belt mask, e.g. endless
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Silicon Polymers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2014161635A 2014-08-07 2014-08-07 感光性樹脂層のパターニング方法 Pending JP2016038468A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014161635A JP2016038468A (ja) 2014-08-07 2014-08-07 感光性樹脂層のパターニング方法
US14/817,022 US20160041469A1 (en) 2014-08-07 2015-08-03 Method for patterning photosensitive resin layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014161635A JP2016038468A (ja) 2014-08-07 2014-08-07 感光性樹脂層のパターニング方法

Publications (2)

Publication Number Publication Date
JP2016038468A true JP2016038468A (ja) 2016-03-22
JP2016038468A5 JP2016038468A5 (enExample) 2017-09-07

Family

ID=55267329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014161635A Pending JP2016038468A (ja) 2014-08-07 2014-08-07 感光性樹脂層のパターニング方法

Country Status (2)

Country Link
US (1) US20160041469A1 (enExample)
JP (1) JP2016038468A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021518575A (ja) * 2018-03-19 2021-08-02 東京エレクトロン株式会社 較正されたトリム量を用いて限界寸法を補正するための方法
JP2023034044A (ja) * 2021-08-30 2023-03-13 東京応化工業株式会社 積層体の製造方法、硬化パターン形成方法、積層体及び感光性組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10599034B2 (en) 2017-08-21 2020-03-24 Funai Electric Co., Ltd. Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326515A (ja) * 1999-03-15 2000-11-28 Canon Inc インクジェット記録ヘッド及びその製造方法
JP2013237259A (ja) * 2012-04-18 2013-11-28 Canon Inc インクジェット記録ヘッド及びその製造方法
JP2014073679A (ja) * 2012-09-11 2014-04-24 Canon Inc 液体吐出ヘッドの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5473645B2 (ja) * 2010-02-05 2014-04-16 キヤノン株式会社 感光性樹脂組成物及び液体吐出ヘッド
JP5967969B2 (ja) * 2012-02-17 2016-08-10 キヤノン株式会社 撥液膜及びその製造方法、並びにこの撥液膜を用いた微細構造体及びその製造方法
JP6053580B2 (ja) * 2013-03-13 2016-12-27 キヤノン株式会社 微細パターン表面の撥水処理方法
JP6207212B2 (ja) * 2013-04-23 2017-10-04 キヤノン株式会社 液体吐出ヘッドの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326515A (ja) * 1999-03-15 2000-11-28 Canon Inc インクジェット記録ヘッド及びその製造方法
JP2013237259A (ja) * 2012-04-18 2013-11-28 Canon Inc インクジェット記録ヘッド及びその製造方法
JP2014073679A (ja) * 2012-09-11 2014-04-24 Canon Inc 液体吐出ヘッドの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021518575A (ja) * 2018-03-19 2021-08-02 東京エレクトロン株式会社 較正されたトリム量を用いて限界寸法を補正するための方法
JP7348456B2 (ja) 2018-03-19 2023-09-21 東京エレクトロン株式会社 較正されたトリム量を用いて限界寸法を補正するための方法
JP2023034044A (ja) * 2021-08-30 2023-03-13 東京応化工業株式会社 積層体の製造方法、硬化パターン形成方法、積層体及び感光性組成物

Also Published As

Publication number Publication date
US20160041469A1 (en) 2016-02-11

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