JP2016021560A - 剥離装置 - Google Patents

剥離装置 Download PDF

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Publication number
JP2016021560A
JP2016021560A JP2015120790A JP2015120790A JP2016021560A JP 2016021560 A JP2016021560 A JP 2016021560A JP 2015120790 A JP2015120790 A JP 2015120790A JP 2015120790 A JP2015120790 A JP 2015120790A JP 2016021560 A JP2016021560 A JP 2016021560A
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JP
Japan
Prior art keywords
support
layer
light
peeling
substrate
Prior art date
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Withdrawn
Application number
JP2015120790A
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English (en)
Japanese (ja)
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JP2016021560A5 (https=
Inventor
広樹 安達
Hiroki Adachi
広樹 安達
早紀 尾花
Saki Obana
早紀 尾花
正勝 大野
Masakatsu Ono
正勝 大野
順平 谷中
Jumpei Yanaka
順平 谷中
平形　吉晴
Yoshiharu Hirakata
吉晴 平形
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2015120790A priority Critical patent/JP2016021560A/ja
Publication of JP2016021560A publication Critical patent/JP2016021560A/ja
Publication of JP2016021560A5 publication Critical patent/JP2016021560A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/187—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only the layers being placed in a carrier before going through the lamination process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7426—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
JP2015120790A 2014-06-20 2015-06-16 剥離装置 Withdrawn JP2016021560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015120790A JP2016021560A (ja) 2014-06-20 2015-06-16 剥離装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014127355 2014-06-20
JP2014127355 2014-06-20
JP2015120790A JP2016021560A (ja) 2014-06-20 2015-06-16 剥離装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019144640A Division JP2020004979A (ja) 2014-06-20 2019-08-06 剥離装置

Publications (2)

Publication Number Publication Date
JP2016021560A true JP2016021560A (ja) 2016-02-04
JP2016021560A5 JP2016021560A5 (https=) 2018-07-19

Family

ID=54868882

Family Applications (2)

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JP2015120790A Withdrawn JP2016021560A (ja) 2014-06-20 2015-06-16 剥離装置
JP2019144640A Withdrawn JP2020004979A (ja) 2014-06-20 2019-08-06 剥離装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019144640A Withdrawn JP2020004979A (ja) 2014-06-20 2019-08-06 剥離装置

Country Status (2)

Country Link
US (1) US9676175B2 (https=)
JP (2) JP2016021560A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107104291A (zh) * 2016-02-23 2017-08-29 泰连德国有限公司 手动工具、接地触头安装套件和端子到触头的安装方法
JP2018006610A (ja) * 2016-07-04 2018-01-11 東京応化工業株式会社 基板洗浄装置、基板洗浄方法、搬送装置、及び、基板処理システム
JP2018091986A (ja) * 2016-12-02 2018-06-14 凸版印刷株式会社 調光フィルム
JP2023178740A (ja) * 2022-06-06 2023-12-18 富士フイルム株式会社 転写方法及び転写装置

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US8137417B2 (en) * 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
KR102309244B1 (ko) 2013-02-20 2021-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI671141B (zh) 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
JP6815096B2 (ja) 2015-05-27 2021-01-20 株式会社半導体エネルギー研究所 剥離装置
JP6363309B2 (ja) * 2015-12-29 2018-07-25 鴻海精密工業股▲ふん▼有限公司 樹脂フィルムの剥離方法、フレキシブル基板を有する電子デバイスの製造方法および有機ｅｌ表示装置の製造方法ならびに樹脂フィルムの剥離装置
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
US10759157B2 (en) 2016-06-15 2020-09-01 Nanomedical Diagnostics, Inc. Systems and methods for transferring graphene
JP2018005004A (ja) * 2016-07-04 2018-01-11 株式会社ジャパンディスプレイ 表示装置
JP6731301B2 (ja) * 2016-07-21 2020-07-29 株式会社沖データ 剥離装置
IT201600105300A1 (it) * 2016-10-19 2018-04-19 Manz Italy Srl Metodo e apparato di lavorazione
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
KR102373995B1 (ko) * 2017-10-30 2022-03-11 엘지디스플레이 주식회사 터치 스크린 일체형 표시 장치
EP3506340B1 (en) * 2017-12-28 2020-10-21 Nexperia B.V. Bonding and indexing apparatus
NL2020362B1 (en) * 2018-01-31 2019-08-07 Airborne Int B V Manufacturing layered products
NL2020361B1 (en) 2018-01-31 2019-08-07 Airborne Int B V Tape sectioning system and method of sectioning tape
NL2020364B1 (en) 2018-01-31 2019-08-07 Airborne Int B V Device and method for handling sheets of fiber reinforced material
CN109334204A (zh) * 2018-09-30 2019-02-15 成都领益科技有限公司 石墨片滚贴机
US11430677B2 (en) 2018-10-30 2022-08-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer taping apparatus and method
CN110561864B (zh) * 2019-08-23 2021-03-30 威海市鲁威塑业有限公司 一种畜牧养殖专用墙板的聚氨酯纤维板粘合装置
JP7057337B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板剥離装置、基板処理装置、及び基板剥離方法
TWI708536B (zh) * 2019-11-25 2020-10-21 欣興電子股份有限公司 移除局部蓋體的裝置及移除局部蓋體的方法
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
JP2023048802A (ja) * 2021-09-28 2023-04-07 株式会社東京精密 シート剥離装置
CN119734905B (zh) * 2025-03-04 2025-05-13 成都敏匠智能科技有限公司 一种可调节式的模块化片料底膜剥离结构

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JPH08122521A (ja) * 1994-10-24 1996-05-17 Dainippon Printing Co Ltd 転写装置
JP2003324142A (ja) * 2002-04-30 2003-11-14 Lintec Corp 半導体ウエハの処理方法およびそのための半導体ウエハの転写装置
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JP2006108077A (ja) * 2004-09-10 2006-04-20 Semiconductor Energy Lab Co Ltd 表示装置およびその作製方法並びにその製造装置
JP2008109124A (ja) * 2006-09-29 2008-05-08 Semiconductor Energy Lab Co Ltd 剥離装置および半導体装置の製造装置
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TWI671141B (zh) 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
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KR102462742B1 (ko) 2013-12-02 2022-11-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제조방법
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Publication number Priority date Publication date Assignee Title
JPH08122521A (ja) * 1994-10-24 1996-05-17 Dainippon Printing Co Ltd 転写装置
JP2003324142A (ja) * 2002-04-30 2003-11-14 Lintec Corp 半導体ウエハの処理方法およびそのための半導体ウエハの転写装置
JP2006066899A (ja) * 2004-07-30 2006-03-09 Semiconductor Energy Lab Co Ltd 剥離および封止可能な装置、ｉｃシート、ｉｃシートの巻物およびｉｃチップの作製方法
JP2006108077A (ja) * 2004-09-10 2006-04-20 Semiconductor Energy Lab Co Ltd 表示装置およびその作製方法並びにその製造装置
JP2008109124A (ja) * 2006-09-29 2008-05-08 Semiconductor Energy Lab Co Ltd 剥離装置および半導体装置の製造装置
JP2010157543A (ja) * 2008-12-26 2010-07-15 Nitto Denko Corp 保護テープ剥離装置
JP2011208287A (ja) * 2010-03-26 2011-10-20 Nk Works Kk 捺染処理装置

Cited By (4)

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