JP2016012595A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2016012595A JP2016012595A JP2014132280A JP2014132280A JP2016012595A JP 2016012595 A JP2016012595 A JP 2016012595A JP 2014132280 A JP2014132280 A JP 2014132280A JP 2014132280 A JP2014132280 A JP 2014132280A JP 2016012595 A JP2016012595 A JP 2016012595A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- unit
- gettering
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims abstract description 25
- 238000005247 gettering Methods 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 18
- 239000010410 layer Substances 0.000 description 11
- 238000005498 polishing Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 230000032258 transport Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 208000032368 Device malfunction Diseases 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】被加工物(11)を保持する保持手段(22)と、保持手段に保持された被加工物を研削する研削手段(38a,38b)と、を備えた加工装置(2)であって、保持手段に保持された被加工物を研削手段で研削して生成した研削歪が十分なゲッタリング性を有するか否かを判定するゲッタリング性判定手段(50)を備える構成とした。
【選択図】図1
Description
本実験では、それぞれ異なる条件(条件1〜条件10)でゲッタリング層23を形成した被加工物11に対して、上述した減衰時間、金属汚染に対する耐性、及び抗折強度を確認した。被加工物11に照射したパルスレーザービームLの波長は、904nm、532nm、349nmの三種類である。
4 基台
4a,4b 開口
6 第1の搬送ユニット
8a,8b カセット
10a,10b 載置台
12 アライメント機構
14 仮置きテーブル
16 支持構造
18 第2の搬送ユニット
20 ターンテーブル
22 チャックテーブル(保持手段)
24 支持構造
26 昇降ユニット
28 昇降ガイドレール
30 昇降テーブル
32 昇降ボールネジ
34 昇降パルスモータ
36 固定具
38a,38b 研削ユニット(研削手段)
40 スピンドルハウジング
42 スピンドル
44 ホイールマウント
46a,46b 研削ホイール
48 研削歪除去ユニット(研削歪除去手段)
50 ゲッタリング性判定ユニット(ゲッタリング性判定手段)
52 洗浄ユニット
54 支持構造
56 水平移動ユニット
58 水平ガイドレール
60 水平移動テーブル
62 パルスモータ
64 鉛直移動ユニット
66 鉛直ガイドレール
68 鉛直移動テーブル
70 パルスモータ
72 スピンドルハウジング
74 スピンドル
76 ホイールマウント
78 研磨ホイール
78a ホイール基台
78b 研磨パッド
80 レーザービーム照射ユニット
82 マイクロ波送受信ユニット
R 回転方向
A 搬入搬出位置
B 粗研削位置
C 仕上げ研削位置
D 研削歪除去位置
11 被加工物
11a 表面
11b 裏面
11c 外周
13 デバイス領域
15 外周余剰領域
17 ストリート(分割予定ライン)
19 デバイス
21 保護部材
21a 表面
21b 裏面
23 ゲッタリング層
L パルスレーザービーム
M1 マイクロ波
M2 マイクロ波
Claims (2)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を研削する研削手段と、を備えた加工装置であって、
該保持手段に保持された被加工物を該研削手段で研削して生成した研削歪がゲッタリング性を有するか否かを判定するゲッタリング性判定手段を備えたことを特徴とする加工装置。 - 該研削手段で研削して生成した研削歪の一部を除去する研削歪除去手段を更に備えたことを特徴とする請求項1に記載の加工装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014132280A JP6366383B2 (ja) | 2014-06-27 | 2014-06-27 | 加工装置 |
TW104114460A TWI649158B (zh) | 2014-06-27 | 2015-05-06 | Processing device |
KR1020150075909A KR102194659B1 (ko) | 2014-06-27 | 2015-05-29 | 가공 장치 |
SG10201504537YA SG10201504537YA (en) | 2014-06-27 | 2015-06-09 | Processing apparatus |
CN201510333919.7A CN105215839B (zh) | 2014-06-27 | 2015-06-16 | 加工装置 |
DE102015211806.1A DE102015211806A1 (de) | 2014-06-27 | 2015-06-25 | Bearbeitungsvorrichtung |
US14/749,965 US20150380283A1 (en) | 2014-06-27 | 2015-06-25 | Processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014132280A JP6366383B2 (ja) | 2014-06-27 | 2014-06-27 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016012595A true JP2016012595A (ja) | 2016-01-21 |
JP6366383B2 JP6366383B2 (ja) | 2018-08-01 |
Family
ID=54840024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014132280A Active JP6366383B2 (ja) | 2014-06-27 | 2014-06-27 | 加工装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150380283A1 (ja) |
JP (1) | JP6366383B2 (ja) |
KR (1) | KR102194659B1 (ja) |
CN (1) | CN105215839B (ja) |
DE (1) | DE102015211806A1 (ja) |
SG (1) | SG10201504537YA (ja) |
TW (1) | TWI649158B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017181111A (ja) * | 2016-03-28 | 2017-10-05 | 株式会社ディスコ | 被加工物の評価方法 |
KR20210071827A (ko) | 2019-12-06 | 2021-06-16 | 가부시기가이샤 디스코 | 게터링성 평가 장치 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6856335B2 (ja) * | 2016-09-06 | 2021-04-07 | 株式会社ディスコ | 加工装置 |
CN106425744A (zh) * | 2016-10-13 | 2017-02-22 | 成都格瑞思文化传播有限公司 | 自动化单晶硅片倒角装置 |
JP6707291B2 (ja) * | 2016-10-14 | 2020-06-10 | 株式会社ディスコ | ウェーハの加工方法 |
JP6754272B2 (ja) * | 2016-10-24 | 2020-09-09 | 株式会社ディスコ | 研削装置 |
JP2018085411A (ja) * | 2016-11-22 | 2018-05-31 | 株式会社ディスコ | ウエーハの加工方法 |
JP2018094596A (ja) * | 2016-12-13 | 2018-06-21 | 株式会社ディスコ | レーザー加工装置 |
CN110270918B (zh) * | 2019-07-26 | 2020-11-06 | 浙江浦江三菱制锁有限公司 | 一种智能锁外壳抛光设备 |
Citations (8)
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JPS63268252A (ja) * | 1987-04-25 | 1988-11-04 | Mitsubishi Metal Corp | 歪付けウエハのゲツタリング能力の評価方法 |
JPH03278442A (ja) * | 1990-03-27 | 1991-12-10 | Dainippon Screen Mfg Co Ltd | 半導体基板の表面状態評価方法およびその装置 |
JPH05335411A (ja) * | 1992-06-02 | 1993-12-17 | Toshiba Corp | ペレットの製造方法 |
JPH11297779A (ja) * | 1998-04-10 | 1999-10-29 | Sony Corp | 半導体装置の欠陥検出方法およびその製造方法 |
JP2011101913A (ja) * | 2009-11-10 | 2011-05-26 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
JP2012049299A (ja) * | 2010-08-26 | 2012-03-08 | Tokyo Electron Ltd | プラズマ処理装置及び光学モニタ装置 |
JP2013219320A (ja) * | 2012-03-15 | 2013-10-24 | Ricoh Co Ltd | 成膜方法及び面発光レーザの製造方法 |
JP2016012594A (ja) * | 2014-06-27 | 2016-01-21 | 株式会社ディスコ | デバイスウェーハの評価方法 |
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US8367517B2 (en) * | 2010-01-26 | 2013-02-05 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
-
2014
- 2014-06-27 JP JP2014132280A patent/JP6366383B2/ja active Active
-
2015
- 2015-05-06 TW TW104114460A patent/TWI649158B/zh active
- 2015-05-29 KR KR1020150075909A patent/KR102194659B1/ko active IP Right Grant
- 2015-06-09 SG SG10201504537YA patent/SG10201504537YA/en unknown
- 2015-06-16 CN CN201510333919.7A patent/CN105215839B/zh active Active
- 2015-06-25 DE DE102015211806.1A patent/DE102015211806A1/de active Pending
- 2015-06-25 US US14/749,965 patent/US20150380283A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63268252A (ja) * | 1987-04-25 | 1988-11-04 | Mitsubishi Metal Corp | 歪付けウエハのゲツタリング能力の評価方法 |
JPH03278442A (ja) * | 1990-03-27 | 1991-12-10 | Dainippon Screen Mfg Co Ltd | 半導体基板の表面状態評価方法およびその装置 |
JPH05335411A (ja) * | 1992-06-02 | 1993-12-17 | Toshiba Corp | ペレットの製造方法 |
JPH11297779A (ja) * | 1998-04-10 | 1999-10-29 | Sony Corp | 半導体装置の欠陥検出方法およびその製造方法 |
JP2011101913A (ja) * | 2009-11-10 | 2011-05-26 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
JP2012049299A (ja) * | 2010-08-26 | 2012-03-08 | Tokyo Electron Ltd | プラズマ処理装置及び光学モニタ装置 |
JP2013219320A (ja) * | 2012-03-15 | 2013-10-24 | Ricoh Co Ltd | 成膜方法及び面発光レーザの製造方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017181111A (ja) * | 2016-03-28 | 2017-10-05 | 株式会社ディスコ | 被加工物の評価方法 |
KR20170113216A (ko) * | 2016-03-28 | 2017-10-12 | 가부시기가이샤 디스코 | 피가공물의 평가 방법 |
KR102235432B1 (ko) * | 2016-03-28 | 2021-04-01 | 가부시기가이샤 디스코 | 피가공물의 평가 방법 |
KR20210071827A (ko) | 2019-12-06 | 2021-06-16 | 가부시기가이샤 디스코 | 게터링성 평가 장치 |
US11557488B2 (en) | 2019-12-06 | 2023-01-17 | Disco Corporation | Gettering property evaluation apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20150380283A1 (en) | 2015-12-31 |
SG10201504537YA (en) | 2016-01-28 |
KR20160001627A (ko) | 2016-01-06 |
CN105215839B (zh) | 2019-02-15 |
DE102015211806A1 (de) | 2015-12-31 |
JP6366383B2 (ja) | 2018-08-01 |
TWI649158B (zh) | 2019-02-01 |
TW201603950A (zh) | 2016-02-01 |
KR102194659B1 (ko) | 2020-12-23 |
CN105215839A (zh) | 2016-01-06 |
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