JP2016004833A5 - - Google Patents

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Publication number
JP2016004833A5
JP2016004833A5 JP2014122705A JP2014122705A JP2016004833A5 JP 2016004833 A5 JP2016004833 A5 JP 2016004833A5 JP 2014122705 A JP2014122705 A JP 2014122705A JP 2014122705 A JP2014122705 A JP 2014122705A JP 2016004833 A5 JP2016004833 A5 JP 2016004833A5
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JP
Japan
Prior art keywords
layer
metal plating
plating layer
width
seed layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014122705A
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English (en)
Japanese (ja)
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JP2016004833A (ja
JP6332680B2 (ja
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Application filed filed Critical
Priority to JP2014122705A priority Critical patent/JP6332680B2/ja
Priority claimed from JP2014122705A external-priority patent/JP6332680B2/ja
Priority to US14/734,395 priority patent/US9412687B2/en
Publication of JP2016004833A publication Critical patent/JP2016004833A/ja
Priority to US15/170,313 priority patent/US9646926B2/en
Publication of JP2016004833A5 publication Critical patent/JP2016004833A5/ja
Application granted granted Critical
Publication of JP6332680B2 publication Critical patent/JP6332680B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014122705A 2014-06-13 2014-06-13 配線基板及びその製造方法 Active JP6332680B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014122705A JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法
US14/734,395 US9412687B2 (en) 2014-06-13 2015-06-09 Wiring substrate and method of manufacturing the same
US15/170,313 US9646926B2 (en) 2014-06-13 2016-06-01 Wiring substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014122705A JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2016004833A JP2016004833A (ja) 2016-01-12
JP2016004833A5 true JP2016004833A5 (OSRAM) 2017-02-09
JP6332680B2 JP6332680B2 (ja) 2018-05-30

Family

ID=54836784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014122705A Active JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法

Country Status (2)

Country Link
US (2) US9412687B2 (OSRAM)
JP (1) JP6332680B2 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341714B2 (ja) * 2014-03-25 2018-06-13 新光電気工業株式会社 配線基板及びその製造方法
JP6527420B2 (ja) * 2015-07-31 2019-06-05 ルネサスエレクトロニクス株式会社 半導体装置
EP3430646B1 (en) * 2016-03-16 2021-11-10 INTEL Corporation Stairstep interposers with integrated shielding for electronics packages
US20180096938A1 (en) * 2016-09-30 2018-04-05 Advanced Micro Devices, Inc. Circuit board with multiple density regions
JP2019062092A (ja) * 2017-09-27 2019-04-18 イビデン株式会社 プリント配線板
CN110504275B (zh) * 2018-05-17 2021-11-12 京东方科技集团股份有限公司 阵列基板及其制作方法、显示面板和显示装置
US10888001B2 (en) 2018-06-08 2021-01-05 Unimicron Technology Corp. Circuit carrier board structure and manufacturing method thereof
US11032917B2 (en) * 2018-06-08 2021-06-08 Unimicron Technology Corp. Circuit carrier board and manufacturing method thereof
TWI734945B (zh) * 2018-12-12 2021-08-01 欣興電子股份有限公司 複合基板結構及其製作方法
US10825782B2 (en) * 2018-12-27 2020-11-03 Micron Technology, Inc. Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact
CN119252812A (zh) * 2019-05-20 2025-01-03 三井金属矿业株式会社 带载体的金属箔以及其使用方法和制造方法
US11113443B1 (en) * 2020-06-12 2021-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit with thicker metal lines on lower metallization layer
KR20220001568A (ko) * 2020-06-30 2022-01-06 삼성전기주식회사 인쇄회로기판
US12266611B2 (en) * 2020-08-12 2025-04-01 Advanced Micro Devices, Inc. Mixed density interconnect architectures using hybrid fan-out
WO2022264378A1 (ja) * 2021-06-17 2022-12-22 昭和電工マテリアルズ株式会社 配線基板の製造方法及び積層板
US20230073823A1 (en) * 2021-09-09 2023-03-09 Qualcomm Incorporated Package comprising a substrate with high-density interconnects
US20230420366A1 (en) * 2022-06-22 2023-12-28 International Business Machines Corporation Power planes and pass-through vias
JP2025173999A (ja) * 2024-05-16 2025-11-28 Ｆｉｃｔ株式会社 回路基板及び回路基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2998237B2 (ja) * 1991-03-07 2000-01-11 ソニー株式会社 ブラインド孔の加工方法
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
US5635761A (en) * 1994-12-14 1997-06-03 International Business Machines, Inc. Internal resistor termination in multi-chip module environments
JP3199592B2 (ja) * 1995-01-27 2001-08-20 株式会社日立製作所 多層印刷回路基板
JP2001203470A (ja) * 2000-01-21 2001-07-27 Toshiba Corp 配線基板、半導体パッケージ、および半導体装置
JP3582460B2 (ja) * 2000-06-20 2004-10-27 株式会社村田製作所 高周波モジュール
JP5191074B2 (ja) 2001-07-10 2013-04-24 イビデン株式会社 多層プリント配線板
JP2003023252A (ja) 2001-07-10 2003-01-24 Ibiden Co Ltd 多層プリント配線板
JP2002329976A (ja) * 2001-04-26 2002-11-15 Kyocera Corp 多層配線基板
JP4195883B2 (ja) * 2004-02-04 2008-12-17 インターナショナル・ビジネス・マシーンズ・コーポレーション 多層モジュール
JP2007165642A (ja) * 2005-12-14 2007-06-28 Mitsubishi Electric Corp 部品実装用基板
US7820233B2 (en) * 2006-09-27 2010-10-26 Unimicron Technology Corp. Method for fabricating a flip chip substrate structure
JP4978269B2 (ja) * 2007-03-27 2012-07-18 日本電気株式会社 多層配線基板
JP5649490B2 (ja) * 2011-03-16 2015-01-07 新光電気工業株式会社 配線基板及びその製造方法
US10187971B2 (en) * 2012-08-31 2019-01-22 Sony Corporation Wiring board and method of manufacturing wiring board
JP6013960B2 (ja) * 2013-03-28 2016-10-25 京セラ株式会社 配線基板
JP2014229698A (ja) * 2013-05-21 2014-12-08 イビデン株式会社 配線板及び配線板の製造方法

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