JP2015537372A5 - - Google Patents
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- Publication number
- JP2015537372A5 JP2015537372A5 JP2015535666A JP2015535666A JP2015537372A5 JP 2015537372 A5 JP2015537372 A5 JP 2015537372A5 JP 2015535666 A JP2015535666 A JP 2015535666A JP 2015535666 A JP2015535666 A JP 2015535666A JP 2015537372 A5 JP2015537372 A5 JP 2015537372A5
- Authority
- JP
- Japan
- Prior art keywords
- pretreatment
- substrate
- cleaning
- gas
- period
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 98
- 238000004140 cleaning Methods 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 41
- 239000007789 gas Substances 0.000 claims description 30
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 238000007781 pre-processing Methods 0.000 claims description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 7
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims description 2
- 150000003462 sulfoxides Chemical class 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims 11
- 239000007788 liquid Substances 0.000 claims 8
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 6
- 230000005855 radiation Effects 0.000 claims 4
- 230000001678 irradiating effect Effects 0.000 claims 3
- 239000008367 deionised water Substances 0.000 claims 2
- 229910021641 deionized water Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000003750 conditioning effect Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261710657P | 2012-10-05 | 2012-10-05 | |
| US61/710,657 | 2012-10-05 | ||
| US13/783,382 | 2013-03-03 | ||
| US13/783,382 US9966280B2 (en) | 2012-10-05 | 2013-03-03 | Process gas generation for cleaning of substrates |
| PCT/US2013/059601 WO2014055218A1 (en) | 2012-10-05 | 2013-09-13 | Process gas generation for cleaning of substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015537372A JP2015537372A (ja) | 2015-12-24 |
| JP2015537372A5 true JP2015537372A5 (enExample) | 2016-12-22 |
| JP6093446B2 JP6093446B2 (ja) | 2017-03-08 |
Family
ID=50431767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015535666A Active JP6093446B2 (ja) | 2012-10-05 | 2013-09-13 | 基板を清浄化するためのプロセスガスの生成 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9966280B2 (enExample) |
| JP (1) | JP6093446B2 (enExample) |
| KR (1) | KR101774122B1 (enExample) |
| CN (2) | CN110071035A (enExample) |
| TW (1) | TWI647756B (enExample) |
| WO (1) | WO2014055218A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10249509B2 (en) | 2012-11-09 | 2019-04-02 | Tokyo Electron Limited | Substrate cleaning method and system using atmospheric pressure atomic oxygen |
| JP6832108B2 (ja) * | 2016-09-28 | 2021-02-24 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| JP6770887B2 (ja) * | 2016-12-28 | 2020-10-21 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理システム |
| CN109092801B (zh) * | 2017-06-20 | 2022-03-18 | 蓝思科技（长沙）有限公司 | 一种蓝宝石晶片的清洗方法及其采用的设备 |
| US11027319B2 (en) * | 2018-03-31 | 2021-06-08 | Sensor Electronic Technology, Inc. | Illumination using multiple light sources |
| JP7525338B2 (ja) | 2020-08-31 | 2024-07-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP7567960B2 (ja) * | 2023-03-14 | 2024-10-16 | 株式会社明電舎 | 基板の洗浄装置，基板の洗浄方法，半導体装置の製造方法 |
| US20260003291A1 (en) * | 2024-06-28 | 2026-01-01 | Kla Corporation | Duv led array for an ultraviolet-ozone cleaning system |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109674A (ja) | 1991-10-18 | 1993-04-30 | Ushio Inc | レジスト膜の灰化方法と灰化装置 |
| JP2727481B2 (ja) * | 1992-02-07 | 1998-03-11 | キヤノン株式会社 | 液晶素子用ガラス基板の洗浄方法 |
| US6391117B2 (en) * | 1992-02-07 | 2002-05-21 | Canon Kabushiki Kaisha | Method of washing substrate with UV radiation and ultrasonic cleaning |
| US5709754A (en) | 1995-12-29 | 1998-01-20 | Micron Technology, Inc. | Method and apparatus for removing photoresist using UV and ozone/oxygen mixture |
| US5803975A (en) * | 1996-03-01 | 1998-09-08 | Canon Kabushiki Kaisha | Microwave plasma processing apparatus and method therefor |
| JP3167625B2 (ja) * | 1996-07-29 | 2001-05-21 | 島田理化工業株式会社 | 基板のウェット洗浄方法 |
| JPH1048586A (ja) * | 1996-08-02 | 1998-02-20 | Sharp Corp | 表示素子用基板およびその製造方法並びにその製造装置 |
| JPH11323576A (ja) | 1998-05-08 | 1999-11-26 | Sumitomo Precision Prod Co Ltd | ウエットエッチング方法 |
| JP4088810B2 (ja) | 1998-09-01 | 2008-05-21 | リアライズ・アドバンストテクノロジ株式会社 | 基板洗浄装置及び基板洗浄方法 |
| US6143477A (en) * | 1998-09-08 | 2000-11-07 | Amtech Systems, Inc. | Dual wavelength UV lamp reactor and method for cleaning/ashing semiconductor wafers |
| US6503464B1 (en) | 1999-08-12 | 2003-01-07 | Sipec Corporation | Ultraviolet processing apparatus and ultraviolet processing method |
| US6503693B1 (en) | 1999-12-02 | 2003-01-07 | Axcelis Technologies, Inc. | UV assisted chemical modification of photoresist |
| US6524936B2 (en) | 2000-12-22 | 2003-02-25 | Axcelis Technologies, Inc. | Process for removal of photoresist after post ion implantation |
| US6848455B1 (en) * | 2002-04-22 | 2005-02-01 | Novellus Systems, Inc. | Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species |
| AU2003245677A1 (en) | 2002-06-23 | 2004-01-06 | Aviza Technology, Inc. | Method and system for atomic layer removal and atomic layer exchange |
| US6715498B1 (en) * | 2002-09-06 | 2004-04-06 | Novellus Systems, Inc. | Method and apparatus for radiation enhanced supercritical fluid processing |
| JP2005129733A (ja) | 2003-10-23 | 2005-05-19 | Sumitomo Precision Prod Co Ltd | 表面改質方法及び表面改質装置 |
| US20050279453A1 (en) * | 2004-06-17 | 2005-12-22 | Uvtech Systems, Inc. | System and methods for surface cleaning |
| US7837821B2 (en) | 2004-10-13 | 2010-11-23 | Rheonix, Inc. | Laminated microfluidic structures and method for making |
| US7335980B2 (en) | 2004-11-04 | 2008-02-26 | International Business Machines Corporation | Hardmask for reliability of silicon based dielectrics |
| US7642205B2 (en) * | 2005-04-08 | 2010-01-05 | Mattson Technology, Inc. | Rapid thermal processing using energy transfer layers |
| US8795769B2 (en) * | 2005-08-02 | 2014-08-05 | New Way Machine Components, Inc. | Method and a device for depositing a film of material or otherwise processing or inspecting, a substrate as it passes through a vacuum environment guided by a plurality of opposing and balanced air bearing lands and sealed by differentially pumped groves and sealing lands in a non-contact manner |
| US7527695B2 (en) * | 2006-06-21 | 2009-05-05 | Asahi Glass Company, Limited | Apparatus and method for cleaning substrate |
| US8168548B2 (en) * | 2006-09-29 | 2012-05-01 | Tokyo Electron Limited | UV-assisted dielectric formation for devices with strained germanium-containing layers |
| TW200832495A (en) | 2007-01-19 | 2008-08-01 | Kismart Corp | Light module |
| US20080268214A1 (en) * | 2007-04-30 | 2008-10-30 | Richard Allen Hayes | Decorative safety glass |
| JP5224167B2 (ja) | 2007-10-23 | 2013-07-03 | 株式会社湯山製作所 | 薬剤払出装置、並びに、薬剤払出システム |
| JP4640421B2 (ja) * | 2008-02-29 | 2011-03-02 | 凸版印刷株式会社 | 紫外線照射装置 |
| US20090293907A1 (en) * | 2008-05-28 | 2009-12-03 | Nancy Fung | Method of substrate polymer removal |
| EP2166564B1 (en) * | 2008-09-19 | 2017-04-12 | Imec | Method for removing a hardened photoresist from a semiconductor substrate |
| US8492736B2 (en) * | 2010-06-09 | 2013-07-23 | Lam Research Corporation | Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates |
| US8772170B2 (en) | 2010-09-01 | 2014-07-08 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Enhanced stripping of implanted resists |
| US8501630B2 (en) | 2010-09-28 | 2013-08-06 | Tokyo Electron Limited | Selective etch process for silicon nitride |
| JP5481366B2 (ja) | 2010-12-22 | 2014-04-23 | 東京エレクトロン株式会社 | 液処理方法および液処理装置 |
| US20130330920A1 (en) * | 2012-06-06 | 2013-12-12 | Applied Materials, Inc. | Method and apparatus for substrate preclean with hydrogen containing high frequency rf plasma |
-
2013
- 2013-03-03 US US13/783,382 patent/US9966280B2/en active Active
- 2013-09-13 JP JP2015535666A patent/JP6093446B2/ja active Active
- 2013-09-13 CN CN201910122153.6A patent/CN110071035A/zh active Pending
- 2013-09-13 WO PCT/US2013/059601 patent/WO2014055218A1/en not_active Ceased
- 2013-09-13 KR KR1020157011733A patent/KR101774122B1/ko active Active
- 2013-09-13 CN CN201380063928.8A patent/CN104903014A/zh active Pending
- 2013-10-04 TW TW102135907A patent/TWI647756B/zh active
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