TWI647756B - 清潔基板用之處理氣體產生 - Google Patents

清潔基板用之處理氣體產生 Download PDF

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Publication number
TWI647756B
TWI647756B TW102135907A TW102135907A TWI647756B TW I647756 B TWI647756 B TW I647756B TW 102135907 A TW102135907 A TW 102135907A TW 102135907 A TW102135907 A TW 102135907A TW I647756 B TWI647756 B TW I647756B
Authority
TW
Taiwan
Prior art keywords
cleaning
pretreatment
substrate
item
cleaning system
Prior art date
Application number
TW102135907A
Other languages
English (en)
Chinese (zh)
Other versions
TW201428846A (zh
Inventor
Ian J. Brown
意恩Ｊ 布朗
Original Assignee
Tokyo Electron Limited
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited, 東京威力科創股份有限公司 filed Critical Tokyo Electron Limited
Publication of TW201428846A publication Critical patent/TW201428846A/zh
Application granted granted Critical
Publication of TWI647756B publication Critical patent/TWI647756B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H10P72/0406—
    • H10P72/0414—
    • H10P72/0604—
    • H10P74/23—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H10P70/23—
    • H10P74/203—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW102135907A 2012-10-05 2013-10-04 清潔基板用之處理氣體產生 TWI647756B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261710657P 2012-10-05 2012-10-05
US61/710,657 2012-10-05
US13/783,382 2013-03-03
US13/783,382 US9966280B2 (en) 2012-10-05 2013-03-03 Process gas generation for cleaning of substrates

Publications (2)

Publication Number Publication Date
TW201428846A TW201428846A (zh) 2014-07-16
TWI647756B true TWI647756B (zh) 2019-01-11

Family

ID=50431767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102135907A TWI647756B (zh) 2012-10-05 2013-10-04 清潔基板用之處理氣體產生

Country Status (6)

Country Link
US (1) US9966280B2 (enExample)
JP (1) JP6093446B2 (enExample)
KR (1) KR101774122B1 (enExample)
CN (2) CN110071035A (enExample)
TW (1) TWI647756B (enExample)
WO (1) WO2014055218A1 (enExample)

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US10249509B2 (en) 2012-11-09 2019-04-02 Tokyo Electron Limited Substrate cleaning method and system using atmospheric pressure atomic oxygen
JP6832108B2 (ja) * 2016-09-28 2021-02-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6770887B2 (ja) * 2016-12-28 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理システム
CN109092801B (zh) * 2017-06-20 2022-03-18 蓝思科技（长沙）有限公司 一种蓝宝石晶片的清洗方法及其采用的设备
US11027319B2 (en) * 2018-03-31 2021-06-08 Sensor Electronic Technology, Inc. Illumination using multiple light sources
JP7525338B2 (ja) 2020-08-31 2024-07-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7567960B2 (ja) * 2023-03-14 2024-10-16 株式会社明電舎 基板の洗浄装置，基板の洗浄方法，半導体装置の製造方法
US20260003291A1 (en) * 2024-06-28 2026-01-01 Kla Corporation Duv led array for an ultraviolet-ozone cleaning system

Citations (8)

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US20010017142A1 (en) * 1992-02-07 2001-08-30 Masaaki Suzuki Method of washing substrate with UV radiation and ultrasonic cleaning
US6715498B1 (en) * 2002-09-06 2004-04-06 Novellus Systems, Inc. Method and apparatus for radiation enhanced supercritical fluid processing
US20050279380A1 (en) * 2004-06-17 2005-12-22 Uvtech Systems, Inc. Method for surface cleaning
CN1783479A (zh) * 2004-11-04 2006-06-07 国际商业机器公司 互连结构及其形成方法
TW200832495A (en) * 2007-01-19 2008-08-01 Kismart Corp Light module
US20080268214A1 (en) * 2007-04-30 2008-10-30 Richard Allen Hayes Decorative safety glass
US20100282271A1 (en) * 2005-08-02 2010-11-11 New Way Machine Components, Inc. Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
US20110306213A1 (en) * 2010-06-09 2011-12-15 Lam Research Corporation Ozone plenum as uv shutter or tunable uv filter for cleaning semiconductor substrates

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JP2727481B2 (ja) * 1992-02-07 1998-03-11 キヤノン株式会社 液晶素子用ガラス基板の洗浄方法
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US5803975A (en) * 1996-03-01 1998-09-08 Canon Kabushiki Kaisha Microwave plasma processing apparatus and method therefor
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JP4088810B2 (ja) 1998-09-01 2008-05-21 リアライズ・アドバンストテクノロジ株式会社 基板洗浄装置及び基板洗浄方法
US6143477A (en) * 1998-09-08 2000-11-07 Amtech Systems, Inc. Dual wavelength UV lamp reactor and method for cleaning/ashing semiconductor wafers
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US8772170B2 (en) 2010-09-01 2014-07-08 Arizona Board Of Regents On Behalf Of The University Of Arizona Enhanced stripping of implanted resists
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010017142A1 (en) * 1992-02-07 2001-08-30 Masaaki Suzuki Method of washing substrate with UV radiation and ultrasonic cleaning
US6715498B1 (en) * 2002-09-06 2004-04-06 Novellus Systems, Inc. Method and apparatus for radiation enhanced supercritical fluid processing
US20050279380A1 (en) * 2004-06-17 2005-12-22 Uvtech Systems, Inc. Method for surface cleaning
CN1783479A (zh) * 2004-11-04 2006-06-07 国际商业机器公司 互连结构及其形成方法
US20100282271A1 (en) * 2005-08-02 2010-11-11 New Way Machine Components, Inc. Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
TW200832495A (en) * 2007-01-19 2008-08-01 Kismart Corp Light module
US20080268214A1 (en) * 2007-04-30 2008-10-30 Richard Allen Hayes Decorative safety glass
US20110306213A1 (en) * 2010-06-09 2011-12-15 Lam Research Corporation Ozone plenum as uv shutter or tunable uv filter for cleaning semiconductor substrates

Also Published As

Publication number Publication date
TW201428846A (zh) 2014-07-16
WO2014055218A1 (en) 2014-04-10
JP2015537372A (ja) 2015-12-24
KR20150079680A (ko) 2015-07-08
JP6093446B2 (ja) 2017-03-08
US9966280B2 (en) 2018-05-08
US20140096792A1 (en) 2014-04-10
KR101774122B1 (ko) 2017-09-12
CN104903014A (zh) 2015-09-09
CN110071035A (zh) 2019-07-30

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