JP2015533258A5 - - Google Patents
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- JP2015533258A5 JP2015533258A5 JP2015523103A JP2015523103A JP2015533258A5 JP 2015533258 A5 JP2015533258 A5 JP 2015533258A5 JP 2015523103 A JP2015523103 A JP 2015523103A JP 2015523103 A JP2015523103 A JP 2015523103A JP 2015533258 A5 JP2015533258 A5 JP 2015533258A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- patent document
- wire
- ball
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261672449P | 2012-07-17 | 2012-07-17 | |
| US61/672,449 | 2012-07-17 | ||
| PCT/US2013/048860 WO2014014643A1 (en) | 2012-07-17 | 2013-07-01 | Methods of forming wire interconnect structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015533258A JP2015533258A (ja) | 2015-11-19 |
| JP2015533258A5 true JP2015533258A5 (cg-RX-API-DMAC7.html) | 2016-06-16 |
| JP6297553B2 JP6297553B2 (ja) | 2018-03-20 |
Family
ID=49949169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015523103A Active JP6297553B2 (ja) | 2012-07-17 | 2013-07-01 | ワイヤ配線構造を形成する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9502371B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6297553B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102094563B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN104471693B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI531015B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014014643A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9502371B2 (en) * | 2012-07-17 | 2016-11-22 | Kulicke And Soffa Industries, Inc. | Methods of forming wire interconnect structures |
| US9870946B2 (en) * | 2013-12-31 | 2018-01-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer level package structure and method of forming same |
| JP5686912B1 (ja) * | 2014-02-20 | 2015-03-18 | 株式会社新川 | バンプ形成方法、バンプ形成装置及び半導体装置の製造方法 |
| BR112015021244A2 (en) * | 2014-10-03 | 2018-05-08 | Intel Coproration | stacked stacked matrix package with vertical columns |
| US11145620B2 (en) | 2019-03-05 | 2021-10-12 | Asm Technology Singapore Pte Ltd | Formation of bonding wire vertical interconnects |
| US11543362B2 (en) * | 2019-05-02 | 2023-01-03 | Asmpt Singapore Pte. Ltd. | Method for measuring the heights of wire interconnections |
| JP2022033633A (ja) | 2020-08-17 | 2022-03-02 | キオクシア株式会社 | 半導体装置 |
| KR20220045684A (ko) | 2020-10-06 | 2022-04-13 | 에스케이하이닉스 주식회사 | 지그재그 모양의 와이어를 포함하는 반도체 패키지 |
| KR102866415B1 (ko) | 2020-11-25 | 2025-09-29 | 가부시키가이샤 신가와 | 반도체 장치의 제조 방법 및 반도체 장치의 제조 장치 |
| US12057431B2 (en) * | 2020-12-18 | 2024-08-06 | Kulicke And Soffa Industries, Inc. | Methods of forming wire interconnect structures and related wire bonding tools |
| US20240379613A1 (en) | 2021-09-16 | 2024-11-14 | Shinkawa Ltd. | Pin wire forming method, wire bonding apparatus, and bonding tool |
| JP7741745B2 (ja) | 2022-02-15 | 2025-09-18 | キオクシア株式会社 | 半導体装置およびその製造方法 |
| CN118696408A (zh) | 2022-02-15 | 2024-09-24 | 库利克和索夫工业公司 | 确定用于产生与工件相关的多个引线弧的顺序的方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4213556A (en) * | 1978-10-02 | 1980-07-22 | General Motors Corporation | Method and apparatus to detect automatic wire bonder failure |
| DE3536908A1 (de) * | 1984-10-18 | 1986-04-24 | Sanyo Electric Co., Ltd., Moriguchi, Osaka | Induktivitaetselement und verfahren zur herstellung desselben |
| US5045975A (en) * | 1987-05-21 | 1991-09-03 | Cray Computer Corporation | Three dimensionally interconnected module assembly |
| US5195237A (en) * | 1987-05-21 | 1993-03-23 | Cray Computer Corporation | Flying leads for integrated circuits |
| US5172851A (en) * | 1990-09-20 | 1992-12-22 | Matsushita Electronics Corporation | Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device |
| US6295729B1 (en) * | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
| US6836962B2 (en) * | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
| US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| US5421503A (en) * | 1994-08-24 | 1995-06-06 | Kulicke And Soffa Investments, Inc. | Fine pitch capillary bonding tool |
| JPH09289276A (ja) | 1996-04-23 | 1997-11-04 | Hitachi Ltd | リードフレームおよびそれを用いた半導体装置 |
| DE69729759T2 (de) * | 1996-10-01 | 2005-07-07 | Matsushita Electric Industrial Co., Ltd., Kadoma | Integrierte Schaltung oder Platine mit einer Höckerelektrode und Verfahren zu Ihrer Herstellung |
| JPH10135220A (ja) * | 1996-10-29 | 1998-05-22 | Taiyo Yuden Co Ltd | バンプ形成方法 |
| JPH10135219A (ja) * | 1996-10-29 | 1998-05-22 | Taiyo Yuden Co Ltd | バンプ形成方法 |
| JP3189115B2 (ja) * | 1996-12-27 | 2001-07-16 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
| US7032311B2 (en) * | 2002-06-25 | 2006-04-25 | Eli Razon | Stabilized wire bonded electrical connections and method of making same |
| US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
| JP3854232B2 (ja) * | 2003-02-17 | 2006-12-06 | 株式会社新川 | バンプ形成方法及びワイヤボンディング方法 |
| US6815836B2 (en) * | 2003-03-24 | 2004-11-09 | Texas Instruments Incorporated | Wire bonding for thin semiconductor package |
| US7227095B2 (en) * | 2003-08-06 | 2007-06-05 | Micron Technology, Inc. | Wire bonders and methods of wire-bonding |
| WO2006013751A1 (ja) * | 2004-08-05 | 2006-02-09 | Seiko Epson Corporation | ボンディング構造、ワイヤボンディング方法、アクチュエータ装置、及び液体噴射ヘッド |
| JP4298665B2 (ja) | 2005-02-08 | 2009-07-22 | 株式会社新川 | ワイヤボンディング方法 |
| US7255538B2 (en) * | 2005-02-09 | 2007-08-14 | Hamilton Sundstrand Corporation | Shrink-fit stress coupling for a shaft of differing materials |
| JP4744238B2 (ja) | 2005-08-29 | 2011-08-10 | 田中電子工業株式会社 | ワイヤの切断方法 |
| JP4530975B2 (ja) * | 2005-11-14 | 2010-08-25 | 株式会社新川 | ワイヤボンディング方法 |
| JP4509043B2 (ja) * | 2006-02-14 | 2010-07-21 | 株式会社新川 | スタッドバンプの形成方法 |
| US8183684B2 (en) * | 2007-03-23 | 2012-05-22 | Semiconductor Components Industries, Llc | Semiconductor device and method of manufacturing the same |
| US9502371B2 (en) * | 2012-07-17 | 2016-11-22 | Kulicke And Soffa Industries, Inc. | Methods of forming wire interconnect structures |
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2013
- 2013-07-01 US US14/413,475 patent/US9502371B2/en active Active
- 2013-07-01 KR KR1020157000968A patent/KR102094563B1/ko active Active
- 2013-07-01 CN CN201380037938.4A patent/CN104471693B/zh active Active
- 2013-07-01 JP JP2015523103A patent/JP6297553B2/ja active Active
- 2013-07-01 WO PCT/US2013/048860 patent/WO2014014643A1/en not_active Ceased
- 2013-07-12 TW TW102125018A patent/TWI531015B/zh active
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2016
- 2016-10-20 US US15/298,406 patent/US9865560B2/en active Active
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2017
- 2017-08-16 US US15/678,619 patent/US10153247B2/en active Active