JP2013506271A5 - - Google Patents

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JP2013506271A5
JP2013506271A5 JP2012524781A JP2012524781A JP2013506271A5 JP 2013506271 A5 JP2013506271 A5 JP 2013506271A5 JP 2012524781 A JP2012524781 A JP 2012524781A JP 2012524781 A JP2012524781 A JP 2012524781A JP 2013506271 A5 JP2013506271 A5 JP 2013506271A5
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JP
Japan
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patent document
pat
application publication
ultrasonic
wire
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JP2012524781A
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Japanese (ja)
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JP6180736B2 (ja
JP2013506271A (ja
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Priority claimed from PCT/US2010/044976 external-priority patent/WO2011019692A2/en
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JP2012524781A 2009-08-12 2010-08-10 ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法 Active JP6180736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23323709P 2009-08-12 2009-08-12
US61/233,237 2009-08-12
PCT/US2010/044976 WO2011019692A2 (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers

Publications (3)

Publication Number Publication Date
JP2013506271A JP2013506271A (ja) 2013-02-21
JP2013506271A5 true JP2013506271A5 (cg-RX-API-DMAC7.html) 2013-09-26
JP6180736B2 JP6180736B2 (ja) 2017-08-23

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JP2012524781A Active JP6180736B2 (ja) 2009-08-12 2010-08-10 ワイヤーボンディング用の超音波トランスデューサ、ならびに超音波トランスデューサを使ってワイヤーボンドを形成する方法

Country Status (6)

Country Link
US (2) US8251275B2 (cg-RX-API-DMAC7.html)
JP (1) JP6180736B2 (cg-RX-API-DMAC7.html)
CN (2) CN102473658B (cg-RX-API-DMAC7.html)
SG (2) SG177745A1 (cg-RX-API-DMAC7.html)
TW (1) TWI531434B (cg-RX-API-DMAC7.html)
WO (1) WO2011019692A2 (cg-RX-API-DMAC7.html)

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