JP2015524358A5 - - Google Patents

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Publication number
JP2015524358A5
JP2015524358A5 JP2015525533A JP2015525533A JP2015524358A5 JP 2015524358 A5 JP2015524358 A5 JP 2015524358A5 JP 2015525533 A JP2015525533 A JP 2015525533A JP 2015525533 A JP2015525533 A JP 2015525533A JP 2015524358 A5 JP2015524358 A5 JP 2015524358A5
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polishing
main surface
diamond
abrasive
major surface
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JP2015525533A
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JP6715006B2 (ja
JP2015524358A (ja
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Priority claimed from PCT/US2013/052834 external-priority patent/WO2014022465A1/en
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JP2015525533A 2012-08-02 2013-07-31 精密に成形された構造部を有する研磨物品及びその作製方法 Active JP6715006B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261678666P 2012-08-02 2012-08-02
US61/678,666 2012-08-02
PCT/US2013/052834 WO2014022465A1 (en) 2012-08-02 2013-07-31 Abrasive articles with precisely shaped features and method of making thereof

Publications (3)

Publication Number Publication Date
JP2015524358A JP2015524358A (ja) 2015-08-24
JP2015524358A5 true JP2015524358A5 (https=) 2016-09-23
JP6715006B2 JP6715006B2 (ja) 2020-07-01

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JP2015525533A Active JP6715006B2 (ja) 2012-08-02 2013-07-31 精密に成形された構造部を有する研磨物品及びその作製方法

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US (2) US10710211B2 (https=)
EP (1) EP2879838B1 (https=)
JP (1) JP6715006B2 (https=)
KR (1) KR102089383B1 (https=)
CN (1) CN104736299A (https=)
SG (1) SG11201500802TA (https=)
TW (1) TWI695756B (https=)
WO (1) WO2014022465A1 (https=)

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TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
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