JP2016538139A5 - - Google Patents

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Publication number
JP2016538139A5
JP2016538139A5 JP2016516918A JP2016516918A JP2016538139A5 JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5
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JP
Japan
Prior art keywords
polishing
substrate
polishing pad
main surface
base layer
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JP2016516918A
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English (en)
Japanese (ja)
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JP6703939B2 (ja
JP2016538139A (ja
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Priority claimed from PCT/US2014/056966 external-priority patent/WO2015048011A1/en
Publication of JP2016538139A publication Critical patent/JP2016538139A/ja
Publication of JP2016538139A5 publication Critical patent/JP2016538139A5/ja
Application granted granted Critical
Publication of JP6703939B2 publication Critical patent/JP6703939B2/ja
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JP2016516918A 2013-09-25 2014-09-23 研磨システム Active JP6703939B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US61/918,369 2013-12-19
US201462019068P 2014-06-30 2014-06-30
US62/019,068 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (3)

Publication Number Publication Date
JP2016538139A JP2016538139A (ja) 2016-12-08
JP2016538139A5 true JP2016538139A5 (https=) 2017-11-02
JP6703939B2 JP6703939B2 (ja) 2020-06-03

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Family Applications (1)

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JP2016516918A Active JP6703939B2 (ja) 2013-09-25 2014-09-23 研磨システム

Country Status (8)

Country Link
US (1) US10071459B2 (https=)
EP (1) EP3050082B1 (https=)
JP (1) JP6703939B2 (https=)
KR (1) KR102252673B1 (https=)
CN (1) CN105579194B (https=)
SG (1) SG11201602207QA (https=)
TW (1) TWI699257B (https=)
WO (1) WO2015048011A1 (https=)

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