CN105579194B - 多层抛光垫 - Google Patents

多层抛光垫 Download PDF

Info

Publication number
CN105579194B
CN105579194B CN201480052077.1A CN201480052077A CN105579194B CN 105579194 B CN105579194 B CN 105579194B CN 201480052077 A CN201480052077 A CN 201480052077A CN 105579194 B CN105579194 B CN 105579194B
Authority
CN
China
Prior art keywords
polishing
substrate
abrasive
pad
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480052077.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN105579194A (zh
Inventor
P·S·拉格
D·K·勒胡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN105579194A publication Critical patent/CN105579194A/zh
Application granted granted Critical
Publication of CN105579194B publication Critical patent/CN105579194B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201480052077.1A 2013-09-25 2014-09-23 多层抛光垫 Active CN105579194B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US61/918,369 2013-12-19
US201462019068P 2014-06-30 2014-06-30
US62/019,068 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (2)

Publication Number Publication Date
CN105579194A CN105579194A (zh) 2016-05-11
CN105579194B true CN105579194B (zh) 2019-04-26

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480052077.1A Active CN105579194B (zh) 2013-09-25 2014-09-23 多层抛光垫

Country Status (8)

Country Link
US (1) US10071459B2 (https=)
EP (1) EP3050082B1 (https=)
JP (1) JP6703939B2 (https=)
KR (1) KR102252673B1 (https=)
CN (1) CN105579194B (https=)
SG (1) SG11201602207QA (https=)
TW (1) TWI699257B (https=)
WO (1) WO2015048011A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3049215B1 (en) * 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10556316B2 (en) * 2015-05-13 2020-02-11 3M Innovative Properties Company Polishing pads and systems for and methods of using same
CN106281219A (zh) * 2015-05-22 2017-01-04 江苏益林金刚石工具有限公司 一种水油双溶性金刚石复合研磨膏及其制备方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR102629800B1 (ko) 2016-01-19 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN108603076A (zh) * 2016-02-16 2018-09-28 3M创新有限公司 抛光系统以及制备和使用抛光系统的方法
KR102302564B1 (ko) 2016-03-09 2021-09-15 어플라이드 머티어리얼스, 인코포레이티드 패드 구조 및 제조 방법들
JP6901297B2 (ja) * 2017-03-22 2021-07-14 株式会社フジミインコーポレーテッド 研磨用組成物
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
EP3623402A4 (en) * 2017-05-12 2021-06-23 Kuraray Co., Ltd. CHAIN EXTENSION, POLYURETHANE AND MODIFICATION PROCESS FOR IT, POLISHING LAYER, POLISHING PAD AND POLISHING PROCESS
WO2019012388A1 (en) * 2017-07-11 2019-01-17 3M Innovative Properties Company ABRASIVE ARTICLES COMPRISING CONFORMABLE COATINGS AND POLISHING SYSTEM COMPRISING THE SAME
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
JP7165719B2 (ja) * 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US12048980B2 (en) 2017-08-25 2024-07-30 3M Innovative Properties Company Surface projection polishing pad
CN107639554B (zh) * 2017-11-10 2024-12-20 江苏瑞和磨料磨具有限公司 一种粗磨抛光一次完成的双面磨砂布
CN111684571A (zh) 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
EP3790706A4 (en) 2018-05-07 2022-02-16 Applied Materials, Inc. CHEMICAL MECHANICAL POLISHING PADS WITH ADJUSTABLE HYDROPHIL AND ZETA POTENTIAL
US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
EP3858546A4 (en) * 2018-09-28 2021-12-01 Fujimi Incorporated POLISHING PAD AND POLISHING PROCESS USING IT
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102803330B1 (ko) * 2019-09-04 2025-05-07 에스케이이노베이션 주식회사 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115157111B (zh) * 2022-07-13 2024-03-15 安徽禾臣新材料有限公司 一种玻璃加工用抛光垫及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
CN1359322A (zh) * 1999-07-09 2002-07-17 3M创新有限公司 含多孔陶瓷磨料复合物的金属粘结的磨料制品和用其磨制工件的方法
CN1099127C (zh) * 1995-09-22 2003-01-15 美国3M公司 半导体晶片暴露表面的修整方法
US6551366B1 (en) * 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
US20090103993A1 (en) * 2006-03-09 2009-04-23 Clifford Spiro Method of Polishing a Tungsten Carbide Surface

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB791580A (en) 1955-07-26 1958-03-05 British United Shoe Machinery Improvements in or relating to the cutting of sheet materials
US3036003A (en) 1957-08-07 1962-05-22 Sinclair Research Inc Lubricating oil composition
US3236770A (en) 1960-09-28 1966-02-22 Sinclair Research Inc Transaxle lubricant
NL296139A (https=) 1963-08-02
NL145565B (nl) 1965-01-28 1975-04-15 Shell Int Research Werkwijze ter bereiding van een smeermiddelcompositie.
US3414347A (en) 1965-03-30 1968-12-03 Edroy Products Company Inc Binocular with pivoted lens plate
US3574576A (en) 1965-08-23 1971-04-13 Chevron Res Distillate fuel compositions having a hydrocarbon substituted alkylene polyamine
US3539633A (en) 1965-10-22 1970-11-10 Standard Oil Co Di-hydroxybenzyl polyamines
US3461172A (en) 1966-11-22 1969-08-12 Consolidation Coal Co Hydrogenation of ortho-phenolic mannich bases
US3448047A (en) 1967-04-05 1969-06-03 Standard Oil Co Lube oil dispersants
US3586629A (en) 1968-09-16 1971-06-22 Mobil Oil Corp Metal salts as lubricant additives
US3725480A (en) 1968-11-08 1973-04-03 Standard Oil Co Ashless oil additives
US3726882A (en) 1968-11-08 1973-04-10 Standard Oil Co Ashless oil additives
US3634515A (en) 1968-11-08 1972-01-11 Standard Oil Co Alkylene polyamide formaldehyde
US3591598A (en) 1968-11-08 1971-07-06 Standard Oil Co Certain condensation products derived from mannich bases
US3980569A (en) 1974-03-15 1976-09-14 The Lubrizol Corporation Dispersants and process for their preparation
US4314827A (en) 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
IN172215B (https=) 1987-03-25 1993-05-08 Lubrizol Corp
US4881951A (en) 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
US5157088A (en) 1987-11-19 1992-10-20 Dishong Dennis M Nitrogen-containing esters of carboxy-containing interpolymers
KR0146707B1 (ko) 1988-10-24 1998-08-01 죤 제이.마혼 아미드 함유 마찰 개질제를 함유한 전동유체
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5378251A (en) 1991-02-06 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles and methods of making and using same
US5310455A (en) 1992-07-10 1994-05-10 Lsi Logic Corporation Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers
JP3239843B2 (ja) 1998-05-11 2001-12-17 関西日本電気株式会社 半導体装置の製造方法
US6036586A (en) 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US6183346B1 (en) 1998-08-05 2001-02-06 3M Innovative Properties Company Abrasive article with embossed isolation layer and methods of making and using
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US6306012B1 (en) 1999-07-20 2001-10-23 Micron Technology, Inc. Methods and apparatuses for planarizing microelectronic substrate assemblies
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6746311B1 (en) 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
KR100461885B1 (ko) 2000-01-25 2004-12-14 닛폰 에어로실 가부시키가이샤 산화물 분말과 그의 제조 방법, 및 상기 분말을 사용한 제품
US20020197935A1 (en) * 2000-02-14 2002-12-26 Mueller Brian L. Method of polishing a substrate
CA2408249A1 (en) 2000-05-09 2001-11-15 3M Innovative Properties Company Porous abrasive article having ceramic abrasive composites, methods of making, and methods of use
AU2002213054A1 (en) 2000-10-06 2002-04-15 3M Innovative Properties Company Ceramic aggregate particles
US6645624B2 (en) 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US20030134581A1 (en) 2002-01-11 2003-07-17 Wang Hsing Maw Device for chemical mechanical polishing
US6679758B2 (en) 2002-04-11 2004-01-20 Saint-Gobain Abrasives Technology Company Porous abrasive articles with agglomerated abrasives
JP3849593B2 (ja) * 2002-06-28 2006-11-22 Ｊｓｒ株式会社 研磨パッド及び複層型研磨パッド
EP1587502B2 (en) 2002-12-31 2025-05-21 BSN medical GmbH Wound dressing
WO2004062849A1 (en) 2003-01-10 2004-07-29 3M Innovative Properties Company Pad constructions for chemical mechanical planarization applications
JP2005146036A (ja) * 2003-11-12 2005-06-09 Sanwa Kenma Kogyo Kk 精密研磨剤
TWI227729B (en) 2003-12-19 2005-02-11 Eternal Chemical Co Ltd A slurry for color photoresist planarization
WO2005077602A1 (en) 2004-02-17 2005-08-25 Skc Co., Ltd. Base pad polishing pad and multi-layer pad comprising the same
JP4616571B2 (ja) * 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド
CN100588698C (zh) * 2005-01-26 2010-02-10 Lg化学株式会社 氧化铈研磨剂以及包含该研磨剂的浆料
US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7399330B2 (en) 2005-10-18 2008-07-15 3M Innovative Properties Company Agglomerate abrasive grains and methods of making the same
US7594845B2 (en) 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
EP1779971A1 (en) 2005-10-28 2007-05-02 Princo Corp. Pad conditioner for conditioning a CMP pad and method of making such a pad conditioner
US7226345B1 (en) 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
JP2011173958A (ja) 2010-02-23 2011-09-08 Tokyo Electron Ltd スラリー製造方法、スラリー、研磨方法及び研磨装置
EP3049215B1 (en) 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
US10252396B2 (en) * 2014-04-03 2019-04-09 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1099127C (zh) * 1995-09-22 2003-01-15 美国3M公司 半导体晶片暴露表面的修整方法
US6194317B1 (en) * 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
CN1359322A (zh) * 1999-07-09 2002-07-17 3M创新有限公司 含多孔陶瓷磨料复合物的金属粘结的磨料制品和用其磨制工件的方法
US6551366B1 (en) * 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
US20090103993A1 (en) * 2006-03-09 2009-04-23 Clifford Spiro Method of Polishing a Tungsten Carbide Surface

Also Published As

Publication number Publication date
TW201532731A (zh) 2015-09-01
US20160229023A1 (en) 2016-08-11
US10071459B2 (en) 2018-09-11
TWI699257B (zh) 2020-07-21
KR102252673B1 (ko) 2021-05-18
KR20160060691A (ko) 2016-05-30
CN105579194A (zh) 2016-05-11
SG11201602207QA (en) 2016-04-28
JP6703939B2 (ja) 2020-06-03
EP3050082A1 (en) 2016-08-03
WO2015048011A1 (en) 2015-04-02
JP2016538139A (ja) 2016-12-08
EP3050082A4 (en) 2017-05-17
EP3050082B1 (en) 2021-05-05

Similar Documents

Publication Publication Date Title
CN105579194B (zh) 多层抛光垫
KR102289629B1 (ko) 세라믹 연마 복합재 폴리싱 용액
JP6789982B2 (ja) 研磨パッド、並びに当該研磨パッドを使用するためのシステム及び方法
US20210189175A1 (en) Polishing systems and method of making and using same
KR101783406B1 (ko) 연마 패드 및 이의 제조방법
JP2017530210A (ja) 研磨液及びその使用方法
JP2017209772A (ja) 研磨システム、及び被加工物を研磨する方法
KR100502574B1 (ko) 연마공구 및 그의 제조방법
JPWO2020012977A1 (ja) 顆粒状研磨材、研磨工具及び研磨方法
WO2025197434A1 (ja) 研磨パッド及びその製造方法
JP2025152729A (ja) 大径気孔を有する超砥粒ビトリファイド砥石、その製造方法、及びカップ型砥石ホイール

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant