JP6703939B2 - 研磨システム - Google Patents

研磨システム Download PDF

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Publication number
JP6703939B2
JP6703939B2 JP2016516918A JP2016516918A JP6703939B2 JP 6703939 B2 JP6703939 B2 JP 6703939B2 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 6703939 B2 JP6703939 B2 JP 6703939B2
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JP
Japan
Prior art keywords
polishing
pad
abrasive
layer
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016516918A
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English (en)
Japanese (ja)
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JP2016538139A (ja
JP2016538139A5 (https=
Inventor
ポール エス． ラグ，
ポール エス． ラグ，
デュイ ケー． レフー，
デュイ ケー． レフー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2016538139A publication Critical patent/JP2016538139A/ja
Publication of JP2016538139A5 publication Critical patent/JP2016538139A5/ja
Application granted granted Critical
Publication of JP6703939B2 publication Critical patent/JP6703939B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016516918A 2013-09-25 2014-09-23 研磨システム Active JP6703939B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US61/918,369 2013-12-19
US201462019068P 2014-06-30 2014-06-30
US62/019,068 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (3)

Publication Number Publication Date
JP2016538139A JP2016538139A (ja) 2016-12-08
JP2016538139A5 JP2016538139A5 (https=) 2017-11-02
JP6703939B2 true JP6703939B2 (ja) 2020-06-03

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016516918A Active JP6703939B2 (ja) 2013-09-25 2014-09-23 研磨システム

Country Status (8)

Country Link
US (1) US10071459B2 (https=)
EP (1) EP3050082B1 (https=)
JP (1) JP6703939B2 (https=)
KR (1) KR102252673B1 (https=)
CN (1) CN105579194B (https=)
SG (1) SG11201602207QA (https=)
TW (1) TWI699257B (https=)
WO (1) WO2015048011A1 (https=)

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TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
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CN109075057B (zh) 2016-03-09 2023-10-20 应用材料公司 垫结构及制造方法
JP6901297B2 (ja) * 2017-03-22 2021-07-14 株式会社フジミインコーポレーテッド 研磨用組成物
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JP7165719B2 (ja) * 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
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KR102803330B1 (ko) * 2019-09-04 2025-05-07 에스케이이노베이션 주식회사 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법
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CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
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Also Published As

Publication number Publication date
EP3050082A4 (en) 2017-05-17
SG11201602207QA (en) 2016-04-28
JP2016538139A (ja) 2016-12-08
KR20160060691A (ko) 2016-05-30
WO2015048011A1 (en) 2015-04-02
US20160229023A1 (en) 2016-08-11
CN105579194B (zh) 2019-04-26
KR102252673B1 (ko) 2021-05-18
EP3050082B1 (en) 2021-05-05
US10071459B2 (en) 2018-09-11
CN105579194A (zh) 2016-05-11
EP3050082A1 (en) 2016-08-03
TWI699257B (zh) 2020-07-21
TW201532731A (zh) 2015-09-01

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