JP2015520519A - 積層基板を成形するためのフィクスチャ - Google Patents
積層基板を成形するためのフィクスチャ Download PDFInfo
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- JP2015520519A JP2015520519A JP2015516032A JP2015516032A JP2015520519A JP 2015520519 A JP2015520519 A JP 2015520519A JP 2015516032 A JP2015516032 A JP 2015516032A JP 2015516032 A JP2015516032 A JP 2015516032A JP 2015520519 A JP2015520519 A JP 2015520519A
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- fixture
- laminated substrate
- base plate
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
- H01L2224/75982—Shape
- H01L2224/75983—Shape of the mounting surface
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
- H01L2224/75986—Auxiliary members on the pressing surface
- H01L2224/75987—Shape of the auxiliary member
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/81024—Applying flux to the bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81053—Bonding environment
- H01L2224/81054—Composition of the atmosphere
- H01L2224/81075—Composition of the atmosphere being inert
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8121—Applying energy for connecting using a reflow oven
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- H—ELECTRICITY
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81909—Post-treatment of the bump connector or bonding area
- H01L2224/8191—Cleaning, e.g. oxide removal step, desmearing
- H01L2224/81912—Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow
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- H—ELECTRICITY
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L23/562—Protection against mechanical damage
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Switches With Compound Operations (AREA)
- Chair Legs, Seat Parts, And Backrests (AREA)
- Vehicle Step Arrangements And Article Storage (AREA)
Abstract
Description
15:チップ・サイト
20:キャパシタ・プレソルダ・バンプ
25:チップ
30:C4はんだボール(C4バンプ)
40、50:ベース・プレート
42、52:凹部
45、55、62、65:開口部
46:位置合わせ穴
53:キャビティ
60:トラップ・リング
70:中央ボタン
71、80:平坦な上部
72:リング状上部
73:階段状構造部
74:円形の領域
81:ねじ切られた構造部
82:リング状上部
86、200:フィクスチャ
90:位置決め構造部
92:脚部
95:ポケット
96:積み重ね可能トレイ
97:シム
98:フラックス
99:4アップ・フィクスチャ構成
Claims (25)
- トラップ・リング(60)と、
積層基板(10)を収容するように適合された凹部(42)を有し、開口部(45)を含むベース・プレート(40)と、
前記開口部(45)内に配置された中央ボタン(70)と、
を含むフィクスチャ。 - 前記中央ボタン(70)は調整可能である、請求項1に記載のフィクスチャ。
- 前記中央ボタン(70)は固定される、請求項1に記載のフィクスチャ。
- 前記中央ボタン(70)は階段状ボタン(73)を含む、請求項1に記載のフィクスチャ。
- 前記階段状ボタン(73)は、平坦な上部(71)及び円形の上部(74)のうちの1つを含む、請求項4に記載のフィクスチャ。
- 前記中央ボタン(70)は、ねじ切られたボタン(81)を含む、請求項1に記載のフィクスチャ。
- 前記ねじ切られたボタン(81)は、平坦な上部(80)及び円形の上部(74)のうちの1つを含む、請求項6に記載のフィクスチャ。
- 前記ねじ切られたボタン(81)は、リング状上部(82)及び矩形上部(84)のうちの1つを含む、請求項7に記載のフィクスチャ。
- 前記トラップ・リング(60)は複数の開口部(62)を含む、請求項1に記載のフィクスチャ。
- 前記ベース・プレート(40)は複数の位置合わせ穴(46)を含む、請求項9に記載のフィクスチャ。
- 前記トラップ・リング(60)は、位置決め構造部(90)によって、前記ベース・プレート(40)に位置合わせされる、請求項10に記載のフィクスチャ。
- 前記位置決め構造部(90)はピンを含む、請求項11に記載のフィクスチャ。
- フィクスチャポケット(95)のアレイをさらに含む、請求項1に記載のフィクスチャ。
- 前記トラップ・リング(60)は、金属及びポリマーのうちの1つを含む、請求項1に記載のフィクスチャ。
- 前記ベース・プレート(40)は複合物から構成される、請求項1に記載のフィクスチャ。
- 前記中央ボタン(70)は金属を含む、請求項1に記載のフィクスチャ。
- 前記ベース・プレート(40)は積み重ね可能である、請求項1に記載のフィクスチャ。
- トラップ・リング(60)と、
積層基板(10)を収容するように適合された凹部(42)を有し、開口部(45)を含むベース・プレート(40)と、
前記凹部(42)内に形成された複数のキャビティ(53)と、
前記開口部(45)内に配置された高さ調整可能な中央ボタン(70)と、
を含むフィクスチャ。 - 前記高さ調整可能な中央ボタン(70)はねじ切られたボタン(81)を含む、請求項18に記載のフィクスチャ。
- 前記ねじ切られたボタン(81)は、平坦な上部(80)及びリング状上部(82)のうちの1つを含む、請求項19に記載のフィクスチャ。
- 前記複数のキャビティ(53)は、前記積層基板(10)上のプレソルダのための隙間をもたらす、請求項18に記載のフィクスチャ。
- 前記トラップ・リング(60)は複数の開口部(62)を含む、請求項18に記載のフィクスチャ。
- 前記ベース・プレート(40)は複数の位置合わせ穴(46)を含む、請求項22に記載のフィクスチャ。
- 前記トラップ・リング(60)は、位置決め構造部(90)によって、前記ベース・プレートに位置合わせされる、請求項23に記載のフィクスチャ。
- 前記位置決め構造部(90)はピンを含む、請求項24に記載のフィクスチャ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/488,693 US9059240B2 (en) | 2012-06-05 | 2012-06-05 | Fixture for shaping a laminate substrate |
US13/488,693 | 2012-06-05 | ||
PCT/US2013/041486 WO2013184324A1 (en) | 2012-06-05 | 2013-05-17 | Fixture for shaping a laminate substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015520519A true JP2015520519A (ja) | 2015-07-16 |
Family
ID=49670557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015516032A Pending JP2015520519A (ja) | 2012-06-05 | 2013-05-17 | 積層基板を成形するためのフィクスチャ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9059240B2 (ja) |
JP (1) | JP2015520519A (ja) |
GB (1) | GB2518087A (ja) |
WO (1) | WO2013184324A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2017069102A1 (ja) * | 2015-10-19 | 2017-04-27 | デクセリアルズ株式会社 | 保護テープ、及び半導体装置の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9059240B2 (en) | 2012-06-05 | 2015-06-16 | International Business Machines Corporation | Fixture for shaping a laminate substrate |
US9048245B2 (en) | 2012-06-05 | 2015-06-02 | International Business Machines Corporation | Method for shaping a laminate substrate |
US20140239569A1 (en) | 2013-02-26 | 2014-08-28 | International Business Machines Corporation | Universal clamping fixture to maintain laminate flatness during chip join |
US10068787B2 (en) * | 2016-12-30 | 2018-09-04 | Sunpower Corporation | Bowing semiconductor wafers |
US11304290B2 (en) * | 2017-04-07 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structures and methods |
CN112292019B (zh) * | 2020-10-23 | 2022-04-12 | 湖南大学 | 一种smd物料供给装置及smd贴装系统 |
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Also Published As
Publication number | Publication date |
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US9059240B2 (en) | 2015-06-16 |
GB2518087A (en) | 2015-03-11 |
US20130323345A1 (en) | 2013-12-05 |
WO2013184324A1 (en) | 2013-12-12 |
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