JP2015519751A5 - - Google Patents

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Publication number
JP2015519751A5
JP2015519751A5 JP2015512608A JP2015512608A JP2015519751A5 JP 2015519751 A5 JP2015519751 A5 JP 2015519751A5 JP 2015512608 A JP2015512608 A JP 2015512608A JP 2015512608 A JP2015512608 A JP 2015512608A JP 2015519751 A5 JP2015519751 A5 JP 2015519751A5
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JP
Japan
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light
optical
light emitting
module
detection
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JP2015512608A
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English (en)
Japanese (ja)
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JP6151354B2 (ja
JP2015519751A (ja
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Priority claimed from PCT/SG2013/000194 external-priority patent/WO2013172786A1/en
Publication of JP2015519751A publication Critical patent/JP2015519751A/ja
Publication of JP2015519751A5 publication Critical patent/JP2015519751A5/ja
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Publication of JP6151354B2 publication Critical patent/JP6151354B2/ja
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JP2015512608A 2012-05-17 2013-05-15 ウエハスタックの組立 Active JP6151354B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261648178P 2012-05-17 2012-05-17
US61/648,178 2012-05-17
PCT/SG2013/000194 WO2013172786A1 (en) 2012-05-17 2013-05-15 Assembly of wafer stacks

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017102586A Division JP6437590B2 (ja) 2012-05-17 2017-05-24 ウエハスタックの組立

Publications (3)

Publication Number Publication Date
JP2015519751A JP2015519751A (ja) 2015-07-09
JP2015519751A5 true JP2015519751A5 (https=) 2016-04-28
JP6151354B2 JP6151354B2 (ja) 2017-06-21

Family

ID=49584061

Family Applications (2)

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JP2015512608A Active JP6151354B2 (ja) 2012-05-17 2013-05-15 ウエハスタックの組立
JP2017102586A Active JP6437590B2 (ja) 2012-05-17 2017-05-24 ウエハスタックの組立

Family Applications After (1)

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JP2017102586A Active JP6437590B2 (ja) 2012-05-17 2017-05-24 ウエハスタックの組立

Country Status (8)

Country Link
US (3) US9716081B2 (https=)
EP (1) EP2850654B1 (https=)
JP (2) JP6151354B2 (https=)
KR (2) KR102107575B1 (https=)
CN (2) CN104335340B (https=)
SG (2) SG10201701879RA (https=)
TW (1) TWI640080B (https=)
WO (1) WO2013172786A1 (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140160751A1 (en) * 2012-12-11 2014-06-12 Vixar Inc. Low cost optical package
US10193026B2 (en) 2013-10-08 2019-01-29 Heptagon Micro Optics Pte. Ltd. Partial spacers for wafer-level fabricated modules
KR101873132B1 (ko) * 2013-11-22 2018-06-29 헵타곤 마이크로 옵틱스 피티이. 리미티드 컴팩트 광전자 모듈들
US20160011054A1 (en) * 2014-07-11 2016-01-14 Omnivision Technologies, Inc. Thermal imaging systems with vacuum-sealing lens cap and associated wafer-level manufacturing methods
KR101785879B1 (ko) 2014-07-23 2017-10-16 헵타곤 마이크로 옵틱스 피티이. 리미티드 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들
FR3025359B1 (fr) * 2014-09-01 2016-11-04 Soc Francaise De Detecteurs Infrarouges - Sofradir Procede de positionnement d'elements, notamment optiques sur la face arriere d'un detecteur infrarouge de type hybride
DE102015002536B4 (de) 2015-02-28 2021-10-28 Schölly Fiberoptic GmbH Optikanordnung, Endoskop und korrespondierendes Verfahren zur Fertigung
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
TWI596985B (zh) * 2015-07-22 2017-08-21 億光電子工業股份有限公司 發光裝置
WO2017034483A1 (en) * 2015-08-27 2017-03-02 Heptagon Micro Optics Pte. Ltd. Optical assemblies including a spacer adhering directly to a substrate
EP3360157B1 (en) * 2015-10-07 2020-09-02 Heptagon Micro Optics Pte. Ltd. Molded circuit substrates
US20170219793A1 (en) * 2016-01-28 2017-08-03 AAC Technologies Pte. Ltd. Sealed module with glue guiding features and method for making same
EP3258493B1 (en) * 2016-06-16 2021-01-27 ams AG System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip camera
US10243111B2 (en) 2016-06-29 2019-03-26 Ams Sensors Singapore Pte. Ltd. Optoelectronic device subassemblies and methods of manufacturing the same
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
US10461066B2 (en) * 2016-06-29 2019-10-29 Maxim Integrated Products, Inc. Structure and method for hybrid optical package with glass top cover
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN110383446B (zh) * 2017-03-16 2024-07-16 Ev集团E·索尔纳有限责任公司 用于接合至少三个衬底的方法
CN107180843B (zh) * 2017-05-17 2020-02-18 京东方科技集团股份有限公司 一种封装面板、器件封装结构及其制备方法
JP2019046981A (ja) * 2017-09-01 2019-03-22 株式会社村田製作所 光センサ装置およびその製造方法
EP3682281B1 (en) * 2017-09-12 2024-03-20 AMS Sensors Singapore Pte. Ltd. Wafer-level manufacture of micro-devices and related two-piece devices, in particular micro-optical systems
JP6925216B2 (ja) * 2017-09-28 2021-08-25 アズビル株式会社 光電センサ
CN109841748B (zh) * 2017-11-28 2021-05-07 群创光电股份有限公司 显示设备
US10811400B2 (en) * 2018-09-28 2020-10-20 Apple Inc. Wafer level optical module
US10636829B1 (en) * 2018-10-24 2020-04-28 Himax Technologies Limited Wafer-level optical structure
CN109375331B (zh) * 2018-11-21 2023-07-04 中国科学院上海技术物理研究所 一种多透镜阵列光轴垂直固化装置
CN110494969B (zh) 2019-06-27 2020-08-25 长江存储科技有限责任公司 在形成三维存储器器件的阶梯结构中的标记图案
WO2021092777A1 (zh) * 2019-11-12 2021-05-20 深圳市汇顶科技股份有限公司 堆叠式的芯片、制造方法、图像传感器和电子设备
KR102387982B1 (ko) * 2020-03-05 2022-04-19 (주) 브로젠 라이다 모듈의 제조 방법
KR102312392B1 (ko) * 2020-03-05 2021-10-15 (주) 브로젠 라이다 모듈용 기판의 접합 방법
DE102020215033A1 (de) * 2020-11-30 2022-06-02 Robert Bosch Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
KR102896852B1 (ko) * 2021-01-28 2025-12-04 삼성전자주식회사 렌즈 어레이, 이를 포함한 이미지 장치 및 그 제조 방법
CN115728914B (zh) * 2022-11-18 2024-07-19 厦门力鼎光电股份有限公司 一种光学成像镜头

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149984A (ja) 1984-01-17 1985-08-07 Nissan Motor Co Ltd 距離測定装置
JPH05165037A (ja) * 1991-12-12 1993-06-29 Matsushita Electric Ind Co Ltd 液晶パネルの製造方法
US5368683A (en) 1993-11-02 1994-11-29 Xerox Corporation Method of fabricating ink jet printheads
US6096155A (en) 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US6078379A (en) * 1997-06-13 2000-06-20 Sharp Kabushiki Kaisha Liquid crystal display device provided with seal material and spacer made of resist
AU8592098A (en) * 1998-07-27 2000-02-21 Reveo, Inc. Three-dimensional packaging technology for multi-layered integrated circuits
DE19908214B4 (de) 1999-02-25 2006-08-31 Siemens Ag Strahlungsemittierende Vorrichtung und Verfahren zum Erfassen eines Objektes oder einer Person in Innenraum eines Fahrzeugs
JP3697926B2 (ja) * 1999-03-05 2005-09-21 セイコーエプソン株式会社 半導体装置の製造方法
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
JP2001252618A (ja) 2000-03-09 2001-09-18 Ricoh Co Ltd 部品締結方法
JP2002110852A (ja) 2000-10-03 2002-04-12 Ibiden Co Ltd 半導体パッケージ、及び半導体チップの接続構造
JP4618859B2 (ja) * 2000-10-10 2011-01-26 東レエンジニアリング株式会社 積層ウエハーのアライメント方法
US6458623B1 (en) * 2001-01-17 2002-10-01 International Business Machines Corporation Conductive adhesive interconnection with insulating polymer carrier
US20040012698A1 (en) * 2001-03-05 2004-01-22 Yasuo Suda Image pickup model and image pickup device
JP2002290842A (ja) * 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
WO2004027880A2 (en) 2002-09-17 2004-04-01 Koninklijke Philips Electronics N.V. Camera device, method of manufacturing a camera device, wafer scale package
JP2004207644A (ja) * 2002-12-26 2004-07-22 Toto Ltd 静電チャック及びこれを用いた貼合わせ基板製造装置
JP2005026587A (ja) 2003-07-04 2005-01-27 Fujikura Ltd 多層基板用基材、多層基板およびその製造方法
JP4551638B2 (ja) * 2003-08-01 2010-09-29 富士フイルム株式会社 固体撮像装置の製造方法
EP1683344A1 (en) * 2003-10-27 2006-07-26 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
JP2006224193A (ja) 2005-02-15 2006-08-31 Olympus Corp 電子装置及び電子装置の製造方法
US7378724B2 (en) 2005-03-24 2008-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Cavity structure for semiconductor structures
JP2007184680A (ja) 2006-01-04 2007-07-19 Fujifilm Corp 固体撮像装置及びその製造方法
US20070284758A1 (en) * 2006-05-22 2007-12-13 General Electric Company Electronics package and associated method
WO2008045968A2 (en) * 2006-10-10 2008-04-17 Adco Products, Inc. Radiation curable sealant composition
JP2009016534A (ja) * 2007-07-04 2009-01-22 Tokyo Electron Ltd 貼り合せ方法及び貼り合せ用基板
KR100959922B1 (ko) * 2007-11-20 2010-05-26 삼성전자주식회사 카메라 모듈 및 그 제조방법
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
KR100969987B1 (ko) * 2008-01-10 2010-07-15 연세대학교 산학협력단 광학패키지 웨이퍼스케일 어레이 및 그 제조방법
SG189800A1 (en) 2008-04-17 2013-05-31 Shilat Optronics Ltd Intrusion warning system
US8866920B2 (en) * 2008-05-20 2014-10-21 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
US8828174B2 (en) 2008-08-20 2014-09-09 Heptagon Micro Optics Pte. Ltd. Method of manufacturing a plurality of optical devices
JP4768060B2 (ja) * 2008-09-25 2011-09-07 シャープ株式会社 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
JP4816704B2 (ja) * 2008-09-25 2011-11-16 富士ゼロックス株式会社 指示システム、指示プログラム
JP4764942B2 (ja) * 2008-09-25 2011-09-07 シャープ株式会社 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
JP4764941B2 (ja) 2008-09-25 2011-09-07 シャープ株式会社 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
TW201015727A (en) * 2008-10-07 2010-04-16 Nexpower Technology Corp Thin-film solar cell
JP4832500B2 (ja) * 2008-12-01 2011-12-07 シャープ株式会社 電子素子ウエハモジュールの製造方法および光学素子ウエハモジュールの製造方法
EP2264898B1 (en) 2009-06-17 2013-05-22 OSRAM Opto Semiconductors GmbH Optical proximity sensor
KR101648540B1 (ko) * 2009-08-13 2016-08-16 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치
JP2011113075A (ja) * 2009-11-30 2011-06-09 Fujifilm Corp ウェハレベルレンズの製造方法
WO2011156928A2 (en) * 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras
JP5533339B2 (ja) 2010-06-28 2014-06-25 ソニー株式会社 光電変換装置とそのパッケージ構造、並びに光電変換装置の製造方法
US8805302B2 (en) 2011-05-19 2014-08-12 Apple Inc. Proximity and ambient light sensor with improved smudge rejection
US8611095B2 (en) 2011-08-31 2013-12-17 Apple Inc. Integration of sensors and other electronic components
US9595553B2 (en) * 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules

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