AU8592098A - Three-dimensional packaging technology for multi-layered integrated circuits - Google Patents

Three-dimensional packaging technology for multi-layered integrated circuits

Info

Publication number
AU8592098A
AU8592098A AU85920/98A AU8592098A AU8592098A AU 8592098 A AU8592098 A AU 8592098A AU 85920/98 A AU85920/98 A AU 85920/98A AU 8592098 A AU8592098 A AU 8592098A AU 8592098 A AU8592098 A AU 8592098A
Authority
AU
Australia
Prior art keywords
integrated circuits
packaging technology
dimensional packaging
layered integrated
layered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU85920/98A
Inventor
Sadeg M Faris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reveo Inc
Original Assignee
Reveo Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reveo Inc filed Critical Reveo Inc
Publication of AU8592098A publication Critical patent/AU8592098A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
AU85920/98A 1998-07-27 1998-07-27 Three-dimensional packaging technology for multi-layered integrated circuits Abandoned AU8592098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1998/015477 WO2000007240A1 (en) 1998-07-27 1998-07-27 Three-dimensional packaging technology for multi-layered integrated circuits

Publications (1)

Publication Number Publication Date
AU8592098A true AU8592098A (en) 2000-02-21

Family

ID=22267555

Family Applications (1)

Application Number Title Priority Date Filing Date
AU85920/98A Abandoned AU8592098A (en) 1998-07-27 1998-07-27 Three-dimensional packaging technology for multi-layered integrated circuits

Country Status (6)

Country Link
EP (1) EP1135802A4 (en)
JP (1) JP2002521844A (en)
KR (1) KR20010106420A (en)
AU (1) AU8592098A (en)
CA (1) CA2338335A1 (en)
WO (1) WO2000007240A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7968374B2 (en) * 2009-02-06 2011-06-28 Headway Technologies, Inc. Layered chip package with wiring on the side surfaces
US7915083B1 (en) * 2009-10-28 2011-03-29 Headway Technologies, Inc. Method of manufacturing layered chip package
US8421243B2 (en) * 2010-06-24 2013-04-16 Headway Technologies, Inc. Layered chip package and method of manufacturing same
US8203216B2 (en) * 2010-07-13 2012-06-19 Headway Technologies, Inc. Layered chip package and method of manufacturing same
WO2013172786A1 (en) 2012-05-17 2013-11-21 Heptagon Micro Optics Pte. Ltd. Assembly of wafer stacks
MY171261A (en) 2014-02-19 2019-10-07 Carsem M Sdn Bhd Stacked electronic packages
JP7360204B2 (en) 2019-10-09 2023-10-12 ウルトラメモリ株式会社 Manufacturing method for laminated semiconductors

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648131A (en) * 1969-11-07 1972-03-07 Ibm Hourglass-shaped conductive connection through semiconductor structures
JPS61288455A (en) * 1985-06-17 1986-12-18 Fujitsu Ltd Manufacture of multilayer semiconductor device
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US4953005A (en) * 1987-04-17 1990-08-28 Xoc Devices, Inc. Packaging system for stacking integrated circuits
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US4983533A (en) * 1987-10-28 1991-01-08 Irvine Sensors Corporation High-density electronic modules - process and product
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
CA2118994A1 (en) * 1993-06-21 1994-12-22 Claude L. Bertin Polyimide-insulated cube package of stacked semiconductor device chips
JPH07168036A (en) * 1993-12-16 1995-07-04 Sony Corp Thin film optical waveguide apparatus and manufacture thereof
US5502333A (en) * 1994-03-30 1996-03-26 International Business Machines Corporation Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
US5698895A (en) * 1994-06-23 1997-12-16 Cubic Memory, Inc. Silicon segment programming method and apparatus

Also Published As

Publication number Publication date
CA2338335A1 (en) 2000-02-10
EP1135802A4 (en) 2004-08-25
KR20010106420A (en) 2001-11-29
JP2002521844A (en) 2002-07-16
EP1135802A1 (en) 2001-09-26
WO2000007240A1 (en) 2000-02-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase