JP2015511773A - 波長変換側面被覆を具備する発光装置 - Google Patents
波長変換側面被覆を具備する発光装置 Download PDFInfo
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- JP2015511773A JP2015511773A JP2015502519A JP2015502519A JP2015511773A JP 2015511773 A JP2015511773 A JP 2015511773A JP 2015502519 A JP2015502519 A JP 2015502519A JP 2015502519 A JP2015502519 A JP 2015502519A JP 2015511773 A JP2015511773 A JP 2015511773A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (16)
- 半導体発光装置、前記半導体発光装置の上面上に配置される第1波長変換部材、及び 前記半導体発光装置の側面上に配置される第2波長変換部材を有し、前記第1波長変換部材及び前記第2波長変換部材は、異なる波長変換材料を有する、構造体。
- 前記第1波長変換部材は、前もって作製された波長変換部材を有する、請求項1に記載の構造体。
- 前記第1波長変換部材は、透明材料に埋め込まれた蛍光体を有する、請求項2に記載の構造体。
- 前記第1波長変換部材は、セラミック蛍光体を有する、請求項1に記載の構造体。
- 前記第2波長変換部材は、透明マトリックス内に配置される粉末蛍光体を有する、請求項1に記載の構造体。
- 前記第1波長変換部材は、緑色光又は黄色光を放射する波長変換材料を有し、前記第2波長変換部材は、赤色光を放射する波長変換材料を有する、請求項1に記載の構造体。
- 前記第2波長変換部材は、散乱粒子を有する、請求項1に記載の構造体。
- 半導体発光装置を供給すること、前記半導体発光装置の上面を覆って第1波長変換材料を配置すること、及び前記半導体発光装置の前記上面を覆って第1波長変換材料を配置した後に、前記半導体発光装置の側面上に第2波長変換材料を配置すること、を有する方法。
- 前記半導体発光装置の上面を覆って第1波長変換材料を配置することは、前記半導体発光装置の前記上面に前もって作製された波長変換部材を取り付けることを含む、請求項8に記載の方法。
- 前記第1波長変換材料は、セラミック蛍光体である、請求項9に記載の方法。
- 前記第1波長変換材料は、ガラスに埋め込まれた蛍光体である、請求項9に記載の方法。
- 前記前もって作製された波長変換部材は、波長変換材料の第1領域と、透明材料の第2領域とを有する、請求項9に記載の方法。
- 前記半導体発光装置の前記上面に前もって作製された波長変換部材を取り付けることは、前記第1領域が、前記半導体発光装置と前記第2領域との間に配置されるように、前記前もって作製された波長変換部材を取り付けることを含む、請求項12に記載の方法。
- 前記半導体発光装置の前記上面に前もって作製された波長変換部材を取り付けることは、前記第2領域が、前記半導体発光装置と前記第1領域との間に配置されるように、前記前もって作製された波長変換部材を取り付けることを含む、請求項12に記載の方法。
- 前記半導体発光装置の側面上に第2波長変換材料を配置することは、前記第2波長変換材料を成型することを含む、請求項8に記載の方法。
- 前記第1波長変換材料及び前記第2波長変換材料は、異なる色の光を放射する、請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261617903P | 2012-03-30 | 2012-03-30 | |
US61/617,903 | 2012-03-30 | ||
PCT/IB2013/052390 WO2013144834A1 (en) | 2012-03-30 | 2013-03-26 | Light emitting device with wavelength converting side coat |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015511773A true JP2015511773A (ja) | 2015-04-20 |
JP2015511773A5 JP2015511773A5 (ja) | 2018-02-15 |
JP6435258B2 JP6435258B2 (ja) | 2018-12-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015502519A Active JP6435258B2 (ja) | 2012-03-30 | 2013-03-26 | 波長変換側面被覆を具備する発光装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10043952B2 (ja) |
EP (1) | EP2831932B1 (ja) |
JP (1) | JP6435258B2 (ja) |
KR (1) | KR20150004818A (ja) |
CN (1) | CN104205374B (ja) |
RU (1) | RU2639565C2 (ja) |
WO (1) | WO2013144834A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019061230A (ja) * | 2017-09-08 | 2019-04-18 | マブン オプトロニックス カンパニー リミテッドMaven Optronics Co., Ltd. | 量子ドットに基づいて色変換する発光装置、および、その製造方法 |
JP2020161773A (ja) * | 2019-03-28 | 2020-10-01 | 日亜化学工業株式会社 | 発光装置 |
JP2021522683A (ja) * | 2018-05-04 | 2021-08-30 | エルジー イノテック カンパニー リミテッド | 照明モジュール及び照明装置 |
US11212495B2 (en) | 2019-09-20 | 2021-12-28 | Seiko Epson Corporation | Wavelength conversion element, light source device, and projector |
Families Citing this family (10)
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JP2015176960A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 発光装置 |
CN104953014B (zh) | 2014-03-28 | 2019-01-29 | 深圳光峰科技股份有限公司 | 一种多层结构玻璃荧光粉片及其制备方法及发光装置 |
KR20150116986A (ko) * | 2014-04-08 | 2015-10-19 | 삼성디스플레이 주식회사 | 퀀텀 도트 시트 및 이를 포함하는 라이트 유닛과 액정 표시 장치 |
KR102408839B1 (ko) * | 2014-06-19 | 2022-06-14 | 루미리즈 홀딩 비.브이. | 작은 소스 크기를 갖는 파장 변환 발광 디바이스 |
US9373761B2 (en) * | 2014-09-23 | 2016-06-21 | Osram Sylvania Inc. | Patterned thin-film wavelength converter and method of making same |
JP6484982B2 (ja) | 2014-09-30 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN104465540A (zh) * | 2014-12-22 | 2015-03-25 | 永新电子常熟有限公司 | 稳定性好的电子芯片 |
KR20170026801A (ko) * | 2015-08-28 | 2017-03-09 | 삼성전자주식회사 | 반도체 발광소자 패키지 및 이를 이용한 광원모듈 |
CN107068841A (zh) * | 2017-04-11 | 2017-08-18 | 安徽芯瑞达科技股份有限公司 | 一种五面发光的量子点夹层csp背光源及其制作方法 |
CN111213249B (zh) * | 2017-08-18 | 2023-10-03 | 奥斯兰姆奥普托半导体有限责任公司 | 半导体器件的生产 |
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Also Published As
Publication number | Publication date |
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JP6435258B2 (ja) | 2018-12-05 |
WO2013144834A1 (en) | 2013-10-03 |
RU2639565C2 (ru) | 2017-12-21 |
CN104205374B (zh) | 2020-10-16 |
KR20150004818A (ko) | 2015-01-13 |
US20170352788A1 (en) | 2017-12-07 |
US10224466B2 (en) | 2019-03-05 |
CN104205374A (zh) | 2014-12-10 |
EP2831932B1 (en) | 2020-09-30 |
US10043952B2 (en) | 2018-08-07 |
RU2014143771A (ru) | 2016-05-27 |
US20150060917A1 (en) | 2015-03-05 |
EP2831932A1 (en) | 2015-02-04 |
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