JP2015109301A5 - - Google Patents
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- Publication number
- JP2015109301A5 JP2015109301A5 JP2013250145A JP2013250145A JP2015109301A5 JP 2015109301 A5 JP2015109301 A5 JP 2015109301A5 JP 2013250145 A JP2013250145 A JP 2013250145A JP 2013250145 A JP2013250145 A JP 2013250145A JP 2015109301 A5 JP2015109301 A5 JP 2015109301A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- magnetic thin
- wiring boards
- sealing resin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims description 41
- 238000007789 sealing Methods 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000000696 magnetic material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000011572 manganese Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013250145A JP6282451B2 (ja) | 2013-12-03 | 2013-12-03 | 電子装置及び電子装置の製造方法 |
| US14/547,498 US9456504B2 (en) | 2013-12-03 | 2014-11-19 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013250145A JP6282451B2 (ja) | 2013-12-03 | 2013-12-03 | 電子装置及び電子装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015109301A JP2015109301A (ja) | 2015-06-11 |
| JP2015109301A5 true JP2015109301A5 (enExample) | 2016-10-20 |
| JP6282451B2 JP6282451B2 (ja) | 2018-02-21 |
Family
ID=53266496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013250145A Active JP6282451B2 (ja) | 2013-12-03 | 2013-12-03 | 電子装置及び電子装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9456504B2 (enExample) |
| JP (1) | JP6282451B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203690294U (zh) * | 2013-11-07 | 2014-07-02 | 新科实业有限公司 | 电子元件组件 |
| US9899330B2 (en) * | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US9997468B2 (en) | 2015-04-10 | 2018-06-12 | STATS ChipPAC Pte. Ltd. | Integrated circuit packaging system with shielding and method of manufacturing thereof |
| DE102016000264B4 (de) * | 2016-01-08 | 2022-01-05 | Infineon Technologies Ag | Halbleiterchipgehäuse, das sich lateral erstreckende Anschlüsse umfasst, und Verfahren zur Herstellung desselben |
| US20190035744A1 (en) * | 2016-03-31 | 2019-01-31 | Tdk Corporation | Electronic circuit package using composite magnetic sealing material |
| JP7039224B2 (ja) * | 2016-10-13 | 2022-03-22 | 芝浦メカトロニクス株式会社 | 電子部品の製造装置及び電子部品の製造方法 |
| JP2019016716A (ja) * | 2017-07-07 | 2019-01-31 | 国立大学法人 鹿児島大学 | 積層基板及び金属ボールの実装方法 |
| JP6905493B2 (ja) * | 2018-08-24 | 2021-07-21 | 株式会社東芝 | 電子装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3432534B2 (ja) * | 1992-09-29 | 2003-08-04 | イビデン株式会社 | プリント配線板 |
| US7625640B2 (en) | 2004-02-24 | 2009-12-01 | Shin-Etsu Polymer Co., Ltd. | Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
| KR100691160B1 (ko) * | 2005-05-06 | 2007-03-09 | 삼성전기주식회사 | 적층형 표면탄성파 패키지 및 그 제조방법 |
| CN101300911B (zh) * | 2005-11-28 | 2010-10-27 | 株式会社村田制作所 | 电路模块以及制造电路模块的方法 |
| JP2011124366A (ja) | 2009-12-10 | 2011-06-23 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| JP2011198866A (ja) * | 2010-03-18 | 2011-10-06 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| KR101711045B1 (ko) * | 2010-12-02 | 2017-03-02 | 삼성전자 주식회사 | 적층 패키지 구조물 |
| JP6076653B2 (ja) * | 2012-08-29 | 2017-02-08 | 新光電気工業株式会社 | 電子部品内蔵基板及び電子部品内蔵基板の製造方法 |
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2013
- 2013-12-03 JP JP2013250145A patent/JP6282451B2/ja active Active
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2014
- 2014-11-19 US US14/547,498 patent/US9456504B2/en active Active