JP2014192452A5 - - Google Patents
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- Publication number
- JP2014192452A5 JP2014192452A5 JP2013068549A JP2013068549A JP2014192452A5 JP 2014192452 A5 JP2014192452 A5 JP 2014192452A5 JP 2013068549 A JP2013068549 A JP 2013068549A JP 2013068549 A JP2013068549 A JP 2013068549A JP 2014192452 A5 JP2014192452 A5 JP 2014192452A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- substrate
- electronic component
- layer
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 46
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000011162 core material Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013068549A JP6200178B2 (ja) | 2013-03-28 | 2013-03-28 | 電子部品内蔵基板及びその製造方法 |
| US14/221,567 US9331011B2 (en) | 2013-03-28 | 2014-03-21 | Electronic component built-in substrate and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013068549A JP6200178B2 (ja) | 2013-03-28 | 2013-03-28 | 電子部品内蔵基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014192452A JP2014192452A (ja) | 2014-10-06 |
| JP2014192452A5 true JP2014192452A5 (enExample) | 2016-01-28 |
| JP6200178B2 JP6200178B2 (ja) | 2017-09-20 |
Family
ID=51620014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013068549A Active JP6200178B2 (ja) | 2013-03-28 | 2013-03-28 | 電子部品内蔵基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9331011B2 (enExample) |
| JP (1) | JP6200178B2 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101601815B1 (ko) * | 2014-02-06 | 2016-03-10 | 삼성전기주식회사 | 임베디드 기판, 인쇄회로기판 및 그 제조 방법 |
| US10199337B2 (en) | 2015-05-11 | 2019-02-05 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and method of manufacturing the same |
| KR20160132751A (ko) * | 2015-05-11 | 2016-11-21 | 삼성전기주식회사 | 전자부품 패키지 및 그 제조방법 |
| US9984979B2 (en) | 2015-05-11 | 2018-05-29 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package and method of manufacturing the same |
| US9837484B2 (en) * | 2015-05-27 | 2017-12-05 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming substrate including embedded component with symmetrical structure |
| KR101994752B1 (ko) * | 2016-07-26 | 2019-07-01 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
| KR101952865B1 (ko) | 2016-10-10 | 2019-02-27 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 및 감광성 수지 조성물 |
| KR102004801B1 (ko) * | 2016-11-17 | 2019-07-29 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
| US10700024B2 (en) * | 2017-08-18 | 2020-06-30 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
| KR102029535B1 (ko) * | 2017-08-28 | 2019-10-07 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
| EP3474639B1 (en) * | 2017-10-20 | 2021-07-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Embedding a component into a component carrier by transferring the component into a cavity being already filled with filling material |
| WO2019111873A1 (ja) * | 2017-12-05 | 2019-06-13 | 株式会社村田製作所 | モジュール |
| KR102005351B1 (ko) * | 2017-12-07 | 2019-07-31 | 삼성전자주식회사 | 팬-아웃 센서 패키지 |
| KR102039711B1 (ko) * | 2018-03-13 | 2019-11-01 | 삼성전자주식회사 | 팬-아웃 부품 패키지 |
| US10797017B2 (en) * | 2018-03-20 | 2020-10-06 | Unimicron Technology Corp. | Embedded chip package, manufacturing method thereof, and package-on-package structure |
| CN208691627U (zh) * | 2018-08-03 | 2019-04-02 | 奥特斯科技(重庆)有限公司 | 具有嵌入腔中的部件且前侧上具有双介电层的部件承载件 |
| US10790162B2 (en) | 2018-09-27 | 2020-09-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
| DE102019117844A1 (de) | 2018-09-27 | 2020-04-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrierte-schaltung-package und verfahren |
| KR102595864B1 (ko) * | 2018-12-07 | 2023-10-30 | 삼성전자주식회사 | 반도체 패키지 |
| US10903169B2 (en) | 2019-04-30 | 2021-01-26 | Advanced Semiconductor Engineering, Inc. | Conductive structure and wiring structure including the same |
| US11145624B2 (en) | 2019-07-26 | 2021-10-12 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
| JP2021082786A (ja) * | 2019-11-22 | 2021-05-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3709882B2 (ja) * | 2003-07-22 | 2005-10-26 | 松下電器産業株式会社 | 回路モジュールとその製造方法 |
| TWI324901B (en) * | 2007-01-08 | 2010-05-11 | Unimicron Technology Corp | Printed circuit board structure integrating electronic components |
| TWI363411B (en) * | 2008-07-22 | 2012-05-01 | Advanced Semiconductor Eng | Embedded chip substrate and fabrication method thereof |
| JP2010114434A (ja) * | 2008-10-08 | 2010-05-20 | Ngk Spark Plug Co Ltd | 部品内蔵配線基板及びその製造方法 |
| US8299366B2 (en) * | 2009-05-29 | 2012-10-30 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
| JP5001395B2 (ja) | 2010-03-31 | 2012-08-15 | イビデン株式会社 | 配線板及び配線板の製造方法 |
| US8895380B2 (en) * | 2010-11-22 | 2014-11-25 | Bridge Semiconductor Corporation | Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby |
| US9406658B2 (en) * | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
-
2013
- 2013-03-28 JP JP2013068549A patent/JP6200178B2/ja active Active
-
2014
- 2014-03-21 US US14/221,567 patent/US9331011B2/en active Active
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