JP2015085466A - フランジ機構 - Google Patents

フランジ機構 Download PDF

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Publication number
JP2015085466A
JP2015085466A JP2013227263A JP2013227263A JP2015085466A JP 2015085466 A JP2015085466 A JP 2015085466A JP 2013227263 A JP2013227263 A JP 2013227263A JP 2013227263 A JP2013227263 A JP 2013227263A JP 2015085466 A JP2015085466 A JP 2015085466A
Authority
JP
Japan
Prior art keywords
flange
cutting blade
boss
fixed
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013227263A
Other languages
English (en)
Japanese (ja)
Inventor
亮 畑
Akira Hata
亮 畑
研悟 奥鳴
Kengo Okunari
研悟 奥鳴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2013227263A priority Critical patent/JP2015085466A/ja
Priority to TW103131383A priority patent/TW201519997A/zh
Priority to KR1020140134723A priority patent/KR20150050356A/ko
Priority to CN201410592779.0A priority patent/CN104589520A/zh
Publication of JP2015085466A publication Critical patent/JP2015085466A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2013227263A 2013-10-31 2013-10-31 フランジ機構 Pending JP2015085466A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013227263A JP2015085466A (ja) 2013-10-31 2013-10-31 フランジ機構
TW103131383A TW201519997A (zh) 2013-10-31 2014-09-11 凸緣機構
KR1020140134723A KR20150050356A (ko) 2013-10-31 2014-10-07 플랜지 기구
CN201410592779.0A CN104589520A (zh) 2013-10-31 2014-10-29 法兰机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013227263A JP2015085466A (ja) 2013-10-31 2013-10-31 フランジ機構

Publications (1)

Publication Number Publication Date
JP2015085466A true JP2015085466A (ja) 2015-05-07

Family

ID=53048817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013227263A Pending JP2015085466A (ja) 2013-10-31 2013-10-31 フランジ機構

Country Status (4)

Country Link
JP (1) JP2015085466A (zh)
KR (1) KR20150050356A (zh)
CN (1) CN104589520A (zh)
TW (1) TW201519997A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016209980A (ja) * 2015-05-13 2016-12-15 Ｔｏｗａ株式会社 切断装置及び切断方法
WO2017013837A1 (ja) * 2015-07-17 2017-01-26 Ｔｏｗａ株式会社 切断装置及び切断方法
JP2019130604A (ja) * 2018-01-30 2019-08-08 Ｔｏｗａ株式会社 フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法
KR20210023685A (ko) 2019-08-22 2021-03-04 가부시기가이샤 디스코 플랜지 기구

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6698436B2 (ja) * 2016-06-14 2020-05-27 株式会社ディスコ ブレードケース
JP6934334B2 (ja) * 2017-06-30 2021-09-15 株式会社ディスコ 切削ブレードの装着方法
JP7138452B2 (ja) * 2018-03-01 2022-09-16 株式会社ディスコ フランジ機構
CN109093518B (zh) * 2018-09-11 2024-05-03 陕西富泰工业材料科技有限公司 一种金刚石砂轮用安装保护装置
JP2022101893A (ja) * 2020-12-25 2022-07-07 株式会社ディスコ ブレード交換装置
CN114425721B (zh) * 2021-12-27 2023-03-31 昂拓科技（苏州）有限公司 磨抛机床的磨抛方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543761U (ja) * 1991-11-14 1993-06-11 エヌデーシー株式会社 モータの軸受装置
JP2006212748A (ja) * 2005-02-04 2006-08-17 Disco Abrasive Syst Ltd 切削工具の装着機構及び切削装置
JP2009274177A (ja) * 2008-05-15 2009-11-26 Disco Abrasive Syst Ltd 切削装置
JP2010036291A (ja) * 2008-08-04 2010-02-18 Disco Abrasive Syst Ltd 切削装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2644135Y (zh) * 2003-09-23 2004-09-29 杨燕军 连结法兰的环状金刚石切割片
JP2011251366A (ja) * 2010-06-01 2011-12-15 Disco Corp 切削装置
CN102441808A (zh) * 2010-09-30 2012-05-09 富泰华工业（深圳）有限公司 刀把
JP5216075B2 (ja) * 2010-12-22 2013-06-19 Ｔｏｗａ株式会社 ブレード着脱装置
JP2013146826A (ja) * 2012-01-19 2013-08-01 Disco Corp フランジ機構

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543761U (ja) * 1991-11-14 1993-06-11 エヌデーシー株式会社 モータの軸受装置
JP2006212748A (ja) * 2005-02-04 2006-08-17 Disco Abrasive Syst Ltd 切削工具の装着機構及び切削装置
JP2009274177A (ja) * 2008-05-15 2009-11-26 Disco Abrasive Syst Ltd 切削装置
JP2010036291A (ja) * 2008-08-04 2010-02-18 Disco Abrasive Syst Ltd 切削装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016209980A (ja) * 2015-05-13 2016-12-15 Ｔｏｗａ株式会社 切断装置及び切断方法
WO2017013837A1 (ja) * 2015-07-17 2017-01-26 Ｔｏｗａ株式会社 切断装置及び切断方法
JP2019130604A (ja) * 2018-01-30 2019-08-08 Ｔｏｗａ株式会社 フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法
KR20210023685A (ko) 2019-08-22 2021-03-04 가부시기가이샤 디스코 플랜지 기구

Also Published As

Publication number Publication date
KR20150050356A (ko) 2015-05-08
TW201519997A (zh) 2015-06-01
CN104589520A (zh) 2015-05-06

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