JP2015084386A - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
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- JP2015084386A JP2015084386A JP2013222589A JP2013222589A JP2015084386A JP 2015084386 A JP2015084386 A JP 2015084386A JP 2013222589 A JP2013222589 A JP 2013222589A JP 2013222589 A JP2013222589 A JP 2013222589A JP 2015084386 A JP2015084386 A JP 2015084386A
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- 238000009713 electroplating Methods 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 36
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 230000002265 prevention Effects 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 158
- 239000002585 base Substances 0.000 description 59
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 239000011521 glass Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000009434 installation Methods 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Microelectronics & Electronic Packaging (AREA)
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- Computer Hardware Design (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【解決手段】本発明の電子デバイスは、複数の貫通電極が形成される絶縁性のベース基板と、前記貫通電極と電気的に接続し、前記ベース基板の一方の表面に実装される電子素子と、前記電子素子を収容し前記ベース基板の前記一方の表面に接合される蓋体と、前記ベース基板の他方の表面に露出する前記貫通電極の端面から前記端面の周囲の前記他方の表面まで覆う外部電極と、を備え、前記外部電極は、前記端面から前記端面の周囲の前記他方の表面まで覆う導電膜と、前記導電膜の表面に電解メッキ法により形成される第1の電解メッキ膜と、前記第1の電解メッキ膜の表面に電解メッキ法により形成される第2の電解メッキ膜とを有し、前記第2の電解メッキ膜は、スズ又はスズ合金で形成されることを特徴とする。
【選択図】図1
Description
また、前記貫通電極は鉄−ニッケル系合金で形成されてもよい。
また、前記導電膜の側面は露出していてもよい。
また、前記第1の電解メッキ膜は1μm〜3μmの厚さで形成してもよい。
また、前記第2の電解メッキ膜は10μm〜30μmの厚さで形成してもよい。
貫通電極3は、コバール、インバー、パーマロイ、42アロイ、ステンレス鋼等の鉄−ニッケル系合金、その他の金属材料を使用することができる。
これにより、導電膜と貫通電極の間の導電性が低下するのを防止することができる。以下、具体的に説明する。
また、導電膜を他方の表面LS全面に形成することで、複数の電子デバイスに対して一括で電界メッキを行うことができる。
本実施例の製造方法においては、導電膜4の側面は露出している。また、第1の電界メッキ膜1及び第2の電界メッキ膜2の側面も露出している。
めっきを形成後にレジスト除去及びパターン以外のスパッタや蒸着膜形成した金属膜を酸やアルカリ溶液をしようするウェットエッチングや反応性ガスを使用するドライエッチング法により除去する。
なお、電子デバイスの製造方法は、本実施例に限らず、種々の方法を採用することができる。
2 ベース基板
3 貫通電極
4 導電膜
5 電子素子
6 蓋体
8 配線電極
9 接合材
10 金属バンプ
11 第1の電解メッキ膜
12 第2の電解メッキ膜
13 外部電極
15 電極パターン
16 パターンマスク(外部電極反転パターン)
US 一方の表面
LS 他方の表面
Claims (6)
- 複数の貫通電極が形成される絶縁性のベース基板と、
前記貫通電極と電気的に接続し、前記ベース基板の一方の表面に実装される電子素子と、
前記電子素子を収容し前記ベース基板の前記一方の表面に接合される蓋体と、
前記ベース基板の他方の表面に露出する前記貫通電極の端面から前記端面の周囲の前記他方の表面まで覆う外部電極と、を備え、
前記外部電極は、前記端面から前記端面の周囲の前記他方の表面まで覆う導電膜と、前記導電膜の表面に電解メッキ法により形成される第1の電解メッキ膜と、前記第1の電解メッキ膜の表面に電解メッキ法により形成される第2の電解メッキ膜とを有し、
前記第2の電解メッキ膜は、スズ又はスズ合金で形成されることを特徴とする電子デバイス。 - 前記第1の電解メッキ膜はニッケル膜又は銅膜で形成されることを特徴とする請求項1に記載の電子デバイス。
- 前記貫通電極は鉄−ニッケル系合金で形成されることを特徴とする請求項1または2に記載の電子デバイス。
- 前記導電膜の側面は露出していることを特徴とする請求項1〜3のいずれか一項に記載の電子デバイス。
- 前記第1の電解メッキ膜は1μm〜3μmの厚さである請求項1〜4のいずれか一項に記載の電子デバイス。
- 前記第2の電解メッキ膜は10μm〜30μmの厚さである請求項1〜5のいずれか一項に記載の電子デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013222589A JP6516399B2 (ja) | 2013-10-25 | 2013-10-25 | 電子デバイス |
TW103135368A TWI640161B (zh) | 2013-10-25 | 2014-10-13 | 電子裝置及電子裝置的製造方法 |
US14/519,331 US10076031B2 (en) | 2013-10-25 | 2014-10-21 | Electronic device and method of manufacturing electronic device |
KR1020140143183A KR102228131B1 (ko) | 2013-10-25 | 2014-10-22 | 전자 디바이스 및 전자 디바이스의 제조 방법 |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013222589A JP6516399B2 (ja) | 2013-10-25 | 2013-10-25 | 電子デバイス |
Publications (2)
Publication Number | Publication Date |
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JP2015084386A true JP2015084386A (ja) | 2015-04-30 |
JP6516399B2 JP6516399B2 (ja) | 2019-05-22 |
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US (1) | US10076031B2 (ja) |
JP (1) | JP6516399B2 (ja) |
KR (1) | KR102228131B1 (ja) |
TW (1) | TWI640161B (ja) |
Cited By (1)
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CN104900540A (zh) * | 2015-06-17 | 2015-09-09 | 上海集成电路研发中心有限公司 | 一种晶圆级真空封装的mems晶振及其制备方法 |
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JP6247006B2 (ja) * | 2013-01-23 | 2017-12-13 | セイコーインスツル株式会社 | 電子デバイス、発振器及び電子デバイスの製造方法 |
CN109156080B (zh) * | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | 陶瓷电子部件 |
CN112511129A (zh) * | 2020-12-02 | 2021-03-16 | 赛莱克斯微系统科技(北京)有限公司 | 一种薄膜体声波谐振器的气密封装结构及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010166018A (ja) * | 2008-12-16 | 2010-07-29 | Seiko Instruments Inc | 電子部品およびその製造方法 |
JP2011035660A (ja) * | 2009-07-31 | 2011-02-17 | Kyocera Kinseki Corp | 圧電デバイス |
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CN104900540B (zh) * | 2015-06-17 | 2018-04-06 | 上海集成电路研发中心有限公司 | 一种晶圆级真空封装的mems晶振及其制备方法 |
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