|
JPH01214141A
(ja)
*
|
1988-02-23 |
1989-08-28 |
Nec Corp |
フリップチップ型半導体装置
|
|
KR101095753B1
(ko)
*
|
2002-08-01 |
2011-12-21 |
니치아 카가쿠 고교 가부시키가이샤 |
반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치
|
|
US6977396B2
(en)
|
2003-02-19 |
2005-12-20 |
Lumileds Lighting U.S., Llc |
High-powered light emitting device with improved thermal properties
|
|
US7141828B2
(en)
*
|
2003-03-19 |
2006-11-28 |
Gelcore, Llc |
Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact
|
|
JP2005012206A
(ja)
*
|
2003-05-29 |
2005-01-13 |
Mitsubishi Cable Ind Ltd |
窒化物系半導体素子およびその製造方法
|
|
KR100576855B1
(ko)
*
|
2003-12-20 |
2006-05-10 |
삼성전기주식회사 |
고출력 플립 칩 발광다이오드
|
|
TWI223457B
(en)
|
2004-01-20 |
2004-11-01 |
Opto Tech Corp |
Light-emitting device to increase the area of active region
|
|
US7683391B2
(en)
*
|
2004-05-26 |
2010-03-23 |
Lockheed Martin Corporation |
UV emitting LED having mesa structure
|
|
KR20050113736A
(ko)
*
|
2004-05-31 |
2005-12-05 |
엘지이노텍 주식회사 |
발광 다이오드 패키지
|
|
JP4345591B2
(ja)
*
|
2004-06-30 |
2009-10-14 |
豊田合成株式会社 |
発光装置
|
|
US7812360B2
(en)
*
|
2004-10-04 |
2010-10-12 |
Kabushiki Kaisha Toshiba |
Light emitting device, lighting equipment or liquid crystal display device using such light emitting device
|
|
US20060138443A1
(en)
*
|
2004-12-23 |
2006-06-29 |
Iii-N Technology, Inc. |
Encapsulation and packaging of ultraviolet and deep-ultraviolet light emitting diodes
|
|
EP2280430B1
(en)
*
|
2005-03-11 |
2020-01-01 |
Seoul Semiconductor Co., Ltd. |
LED package having an array of light emitting cells coupled in series
|
|
KR100597166B1
(ko)
*
|
2005-05-03 |
2006-07-04 |
삼성전기주식회사 |
플립 칩 발광다이오드 및 그 제조방법
|
|
US8129739B2
(en)
*
|
2005-07-15 |
2012-03-06 |
Panasonic Corporation |
Semiconductor light emitting device and semiconductor light emitting device mounted board
|
|
US7847302B2
(en)
*
|
2005-08-26 |
2010-12-07 |
Koninklijke Philips Electronics, N.V. |
Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
|
|
US7659546B2
(en)
*
|
2005-12-23 |
2010-02-09 |
Hong Kong Applied Science And Technology Research Institute Co., Ltd. |
Light emitting device
|
|
JP2007324577A
(ja)
|
2006-05-01 |
2007-12-13 |
Mitsubishi Chemicals Corp |
集積型半導体発光装置およびその製造方法
|
|
JP5125795B2
(ja)
*
|
2007-07-18 |
2013-01-23 |
日亜化学工業株式会社 |
半導体発光素子および発光装置
|
|
DE102009034359A1
(de)
*
|
2009-07-17 |
2011-02-17 |
Forschungsverbund Berlin E.V. |
P-Kontakt und Leuchtdiode für den ultravioletten Spektralbereich
|
|
US20110062454A1
(en)
*
|
2009-09-11 |
2011-03-17 |
Hong Kong Applied Science And Technology Research Institute Co., Ltd. |
Light emitting device having remotely located light scattering material
|
|
JP2011181576A
(ja)
*
|
2010-02-26 |
2011-09-15 |
Citizen Holdings Co Ltd |
半導体発光素子及びそれを用いた半導体発光装置
|
|
JP5849215B2
(ja)
*
|
2010-06-21 |
2016-01-27 |
パナソニックＩｐマネジメント株式会社 |
紫外半導体発光素子
|
|
KR101171361B1
(ko)
*
|
2010-11-05 |
2012-08-10 |
서울옵토디바이스주식회사 |
발광 다이오드 어셈블리 및 그의 제조 방법
|
|
JP5475732B2
(ja)
*
|
2011-02-21 |
2014-04-16 |
株式会社東芝 |
照明装置
|
|
JP2013012559A
(ja)
*
|
2011-06-29 |
2013-01-17 |
Nichia Chem Ind Ltd |
発光素子の製造方法
|
|
JP5575715B2
(ja)
*
|
2011-08-29 |
2014-08-20 |
日立アプライアンス株式会社 |
電球型照明装置
|
|
JP5747741B2
(ja)
*
|
2011-08-30 |
2015-07-15 |
豊田合成株式会社 |
半導体発光チップの製造方法
|
|
US9847372B2
(en)
*
|
2011-12-01 |
2017-12-19 |
Micron Technology, Inc. |
Solid state transducer devices with separately controlled regions, and associated systems and methods
|
|
EP2605295A3
(en)
*
|
2011-12-13 |
2015-11-11 |
LG Innotek Co., Ltd. |
Ultraviolet light emitting device
|
|
KR20130098048A
(ko)
*
|
2012-02-27 |
2013-09-04 |
엘지이노텍 주식회사 |
발광소자 패키지
|
|
JP2013197456A
(ja)
*
|
2012-03-22 |
2013-09-30 |
Stanley Electric Co Ltd |
Ｌｅｄアレイ及び車両用灯具
|
|
KR20130128931A
(ko)
*
|
2012-05-18 |
2013-11-27 |
삼성전자주식회사 |
Ｎ형 알루미늄 갈륨 나이트라이드 박막 및 자외선 발광소자
|
|
KR102075147B1
(ko)
*
|
2013-06-05 |
2020-02-10 |
엘지이노텍 주식회사 |
발광 소자 및 발광 소자 패키지
|
|
KR102075655B1
(ko)
*
|
2013-06-24 |
2020-02-10 |
엘지이노텍 주식회사 |
발광 소자 및 발광 소자 패키지
|
|
US10283681B2
(en)
*
|
2013-09-12 |
2019-05-07 |
Cree, Inc. |
Phosphor-converted light emitting device
|