JP2015043471A - 半導体チップの製造方法及び半導体ウェハの切断方法 - Google Patents
半導体チップの製造方法及び半導体ウェハの切断方法 Download PDFInfo
- Publication number
- JP2015043471A JP2015043471A JP2014245216A JP2014245216A JP2015043471A JP 2015043471 A JP2015043471 A JP 2015043471A JP 2014245216 A JP2014245216 A JP 2014245216A JP 2014245216 A JP2014245216 A JP 2014245216A JP 2015043471 A JP2015043471 A JP 2015043471A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- semiconductor wafer
- dicing
- pressure
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000005520 cutting process Methods 0.000 title claims description 66
- 239000012790 adhesive layer Substances 0.000 claims abstract description 198
- 239000010410 layer Substances 0.000 claims abstract description 65
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 230000002093 peripheral effect Effects 0.000 abstract description 32
- 239000000463 material Substances 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 description 24
- 230000001070 adhesive effect Effects 0.000 description 24
- 239000000758 substrate Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- -1 polytetrafluoroethylene Polymers 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- 241001050985 Disco Species 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
(実施例1)
(実施例2〜8)
(比較例1)
(実施例9〜16)
(比較例2)
(評価)
Claims (8)
- 基材フィルム上に粘着剤層が形成され、前記粘着剤層に接するように当該粘着剤層上に接着剤層が形成されたダイシング・ダイボンディング一体型フィルムの前記接着剤層に、前記接着剤層の周縁が全体にわたって10mmよりも大きくはみ出るように、半導体ウェハを貼付する半導体ウェハ貼付工程と、
前記接着剤層の周縁の外側で、ウェハリングを前記粘着剤層に貼付するウェハリング貼付工程と、
前記半導体ウェハをブレードダイシングし、個片化された複数の半導体チップを得るチップ化工程とを備えることを特徴とする半導体チップの製造方法。 - 前記チップ化工程において、前記半導体ウェハからはみ出す前記接着剤層のはみ出し部分に切削水を吹き付けることを特徴とする請求項1記載の半導体チップの製造方法。
- 前記切削水の供給圧力は、0.2MPa〜0.6MPaであることを特徴とする請求項2記載の半導体チップの製造方法。
- 前記切削水の流量は、0.5L/分〜2.0L/分であることを特徴とする請求項2又3は記載の半導体チップの製造方法。
- 基材フィルム上に粘着剤層が形成され、前記粘着剤層に接するように当該粘着剤層上に接着剤層が形成されたダイシング・ダイボンディング一体型フィルムの前記接着剤層に、前記接着剤層の周縁が全体にわたって10mmよりも大きくはみ出るように、半導体ウェハを貼付する半導体ウェハ貼付工程と、
前記接着剤層の周縁の外側で、ウェハリングを前記粘着剤層に貼付するウェハリング貼付工程と、
前記半導体ウェハをブレードダイシングし、個片化された複数の半導体チップを得るチップ化工程とを備えることを特徴とする半導体ウェハの切断方法。 - 前記チップ化工程において、前記半導体ウェハからはみ出す前記接着剤層のはみ出し部分に切削水を吹き付けることを特徴とする請求項5記載の半導体ウェハの切断方法。
- 前記切削水の供給圧力は、0.2MPa〜0.6MPaであることを特徴とする請求項6記載の半導体ウェハの切断方法。
- 前記切削水の流量は、0.5L/分〜2.0L/分であることを特徴とする請求項6又7は記載の半導体ウェハの切断方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014245216A JP5979207B2 (ja) | 2010-07-13 | 2014-12-03 | 半導体チップの製造方法及び半導体ウェハの切断方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010159030 | 2010-07-13 | ||
JP2010159030 | 2010-07-13 | ||
JP2014245216A JP5979207B2 (ja) | 2010-07-13 | 2014-12-03 | 半導体チップの製造方法及び半導体ウェハの切断方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012524577A Division JP5833005B2 (ja) | 2010-07-13 | 2011-07-13 | ダイシング・ダイボンディング一体型フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015043471A true JP2015043471A (ja) | 2015-03-05 |
JP5979207B2 JP5979207B2 (ja) | 2016-08-24 |
Family
ID=45469488
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012524577A Active JP5833005B2 (ja) | 2010-07-13 | 2011-07-13 | ダイシング・ダイボンディング一体型フィルム |
JP2014245216A Active JP5979207B2 (ja) | 2010-07-13 | 2014-12-03 | 半導体チップの製造方法及び半導体ウェハの切断方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012524577A Active JP5833005B2 (ja) | 2010-07-13 | 2011-07-13 | ダイシング・ダイボンディング一体型フィルム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8975161B2 (ja) |
JP (2) | JP5833005B2 (ja) |
KR (1) | KR101521727B1 (ja) |
CN (1) | CN103109353B (ja) |
TW (1) | TWI460779B (ja) |
WO (1) | WO2012008491A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014192462A (ja) * | 2013-03-28 | 2014-10-06 | Lintec Corp | 樹脂膜形成用シート |
KR102029861B1 (ko) * | 2013-07-24 | 2019-11-08 | 엘지이노텍 주식회사 | 발광 소자 제조 방법, 발광 소자 제조 장치 및 이에 의해 제조된 발광 소자 |
US9299614B2 (en) * | 2013-12-10 | 2016-03-29 | Applied Materials, Inc. | Method and carrier for dicing a wafer |
KR102535477B1 (ko) * | 2014-05-23 | 2023-05-23 | 가부시끼가이샤 레조낙 | 다이본드 다이싱 시트 |
JP7281873B2 (ja) * | 2018-05-14 | 2023-05-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP7130323B2 (ja) | 2018-05-14 | 2022-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
WO2019220599A1 (ja) * | 2018-05-17 | 2019-11-21 | 日立化成株式会社 | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法 |
JP7139047B2 (ja) * | 2018-07-06 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
KR102417467B1 (ko) * | 2019-05-10 | 2022-07-06 | 쇼와덴코머티리얼즈가부시끼가이샤 | 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법 |
JP6835296B1 (ja) * | 2019-05-10 | 2021-02-24 | 昭和電工マテリアルズ株式会社 | ピックアップ性の評価方法、ダイシング・ダイボンディング一体型フィルム、ダイシング・ダイボンディング一体型フィルムの評価方法及び選別方法、並びに半導体装置の製造方法 |
JP7008164B1 (ja) * | 2020-07-30 | 2022-01-25 | 古河電気工業株式会社 | 半導体加工用テープ |
CN112201600B (zh) * | 2020-10-14 | 2024-03-08 | 北京中科镭特电子有限公司 | 一种晶圆劈裂扩片装置及晶圆裂片扩片方法 |
CN114479705B (zh) * | 2022-01-20 | 2023-11-07 | 三星半导体(中国)研究开发有限公司 | 晶圆贴合膜及其制造方法 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03230546A (ja) * | 1990-02-06 | 1991-10-14 | Disco Abrasive Syst Ltd | ダイシング装置 |
JPH09263734A (ja) * | 1996-01-22 | 1997-10-07 | Texas Instr Japan Ltd | ポリイミド接着シートおよびポリイミド用工程フィルム |
JPH10335271A (ja) * | 1997-06-02 | 1998-12-18 | Texas Instr Japan Ltd | ウェハ貼着用シートおよび半導体装置の製造方法 |
JP2001185563A (ja) * | 1999-12-27 | 2001-07-06 | Hitachi Chem Co Ltd | ダイボンディング用接着フィルム及び半導体装置の製造方法 |
JP2004356412A (ja) * | 2003-05-29 | 2004-12-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2007019151A (ja) * | 2005-07-06 | 2007-01-25 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いたチップの製造方法 |
JP2007123914A (ja) * | 2006-11-27 | 2007-05-17 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
US20070126129A1 (en) * | 2005-12-06 | 2007-06-07 | Ace Industries Co., Ltd. | Die bonding adhesive tape |
JP2007288170A (ja) * | 2006-03-20 | 2007-11-01 | Hitachi Chem Co Ltd | ダイボンドダイシングシート |
US20080160300A1 (en) * | 2006-12-27 | 2008-07-03 | Yong Ha Hwang | Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same |
WO2008105169A1 (ja) * | 2007-02-28 | 2008-09-04 | Sumitomo Bakelite Co., Ltd. | 半導体用接着フィルムおよびそれを用いた半導体装置 |
JP2008211224A (ja) * | 2008-03-17 | 2008-09-11 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
JP2009032799A (ja) * | 2007-07-25 | 2009-02-12 | Lintec Corp | ウェハ加工用テープ |
JP2009094127A (ja) * | 2007-10-04 | 2009-04-30 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用フィルム |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59177942A (ja) * | 1983-03-28 | 1984-10-08 | Nitto Electric Ind Co Ltd | ウエハ固定方法 |
JPH0715087B2 (ja) | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JP3521099B2 (ja) | 1994-11-29 | 2004-04-19 | リンテック株式会社 | ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート |
MY118036A (en) | 1996-01-22 | 2004-08-30 | Lintec Corp | Wafer dicing/bonding sheet and process for producing semiconductor device |
JP3578592B2 (ja) | 1997-06-03 | 2004-10-20 | 住友ベークライト株式会社 | 半導体用ダイアタッチ樹脂ペースト |
JP2002158276A (ja) | 2000-11-20 | 2002-05-31 | Hitachi Chem Co Ltd | ウエハ貼着用粘着シートおよび半導体装置 |
JP2002226796A (ja) | 2001-01-29 | 2002-08-14 | Hitachi Chem Co Ltd | ウェハ貼着用粘着シート及び半導体装置 |
JP2005060435A (ja) * | 2003-08-14 | 2005-03-10 | Three M Innovative Properties Co | 両面粘着シート |
JP4691365B2 (ja) | 2005-02-04 | 2011-06-01 | 株式会社巴川製紙所 | 半導体装置用接着剤組成物および半導体装置用接着シート |
JP4839629B2 (ja) | 2005-02-18 | 2011-12-21 | 日立化成工業株式会社 | フィルム状接着剤、接着シート及びそれを使用した半導体装置 |
JP2006232985A (ja) | 2005-02-24 | 2006-09-07 | Shin Etsu Chem Co Ltd | 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート |
JP4650024B2 (ja) | 2005-02-28 | 2011-03-16 | 住友ベークライト株式会社 | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法及び半導体装置。 |
US20100112272A1 (en) | 2006-10-06 | 2010-05-06 | Sumitomo Bakelite Co., Ltd. | Film for use in manufacturing semiconductor devices, method for producing the film and semiconductor device |
EP2270112B1 (en) | 2008-04-25 | 2014-08-13 | LG Chem, Ltd. | Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
JP5438522B2 (ja) * | 2010-01-07 | 2014-03-12 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ及びその製造方法 |
-
2011
- 2011-07-13 US US13/809,816 patent/US8975161B2/en active Active
- 2011-07-13 JP JP2012524577A patent/JP5833005B2/ja active Active
- 2011-07-13 TW TW100124757A patent/TWI460779B/zh active
- 2011-07-13 WO PCT/JP2011/065986 patent/WO2012008491A1/ja active Application Filing
- 2011-07-13 KR KR1020137003315A patent/KR101521727B1/ko active IP Right Grant
- 2011-07-13 CN CN201180034409.XA patent/CN103109353B/zh active Active
-
2014
- 2014-12-03 JP JP2014245216A patent/JP5979207B2/ja active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03230546A (ja) * | 1990-02-06 | 1991-10-14 | Disco Abrasive Syst Ltd | ダイシング装置 |
JPH09263734A (ja) * | 1996-01-22 | 1997-10-07 | Texas Instr Japan Ltd | ポリイミド接着シートおよびポリイミド用工程フィルム |
JPH10335271A (ja) * | 1997-06-02 | 1998-12-18 | Texas Instr Japan Ltd | ウェハ貼着用シートおよび半導体装置の製造方法 |
JP2001185563A (ja) * | 1999-12-27 | 2001-07-06 | Hitachi Chem Co Ltd | ダイボンディング用接着フィルム及び半導体装置の製造方法 |
JP2004356412A (ja) * | 2003-05-29 | 2004-12-16 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2007019151A (ja) * | 2005-07-06 | 2007-01-25 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いたチップの製造方法 |
US20070126129A1 (en) * | 2005-12-06 | 2007-06-07 | Ace Industries Co., Ltd. | Die bonding adhesive tape |
JP2007288170A (ja) * | 2006-03-20 | 2007-11-01 | Hitachi Chem Co Ltd | ダイボンドダイシングシート |
JP2007123914A (ja) * | 2006-11-27 | 2007-05-17 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
US20080160300A1 (en) * | 2006-12-27 | 2008-07-03 | Yong Ha Hwang | Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same |
WO2008105169A1 (ja) * | 2007-02-28 | 2008-09-04 | Sumitomo Bakelite Co., Ltd. | 半導体用接着フィルムおよびそれを用いた半導体装置 |
JP2009032799A (ja) * | 2007-07-25 | 2009-02-12 | Lintec Corp | ウェハ加工用テープ |
JP2009094127A (ja) * | 2007-10-04 | 2009-04-30 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用フィルム |
JP2008211224A (ja) * | 2008-03-17 | 2008-09-11 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2012008491A1 (ja) | 2013-09-09 |
CN103109353A (zh) | 2013-05-15 |
TW201205662A (en) | 2012-02-01 |
JP5833005B2 (ja) | 2015-12-16 |
KR20130051475A (ko) | 2013-05-20 |
US8975161B2 (en) | 2015-03-10 |
CN103109353B (zh) | 2015-11-25 |
US20130143390A1 (en) | 2013-06-06 |
KR101521727B1 (ko) | 2015-05-19 |
JP5979207B2 (ja) | 2016-08-24 |
TWI460779B (zh) | 2014-11-11 |
WO2012008491A1 (ja) | 2012-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5979207B2 (ja) | 半導体チップの製造方法及び半導体ウェハの切断方法 | |
JP3521099B2 (ja) | ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート | |
KR102535477B1 (ko) | 다이본드 다이싱 시트 | |
JP2005162818A (ja) | ダイシングダイボンドシート | |
WO2008047708A1 (fr) | Feuille pour tri de puce et procédé de transfert d'une puce ayant une couche d'adhésif | |
JP2008066336A (ja) | ウエハ加工用シート | |
JP2005167182A (ja) | 粘接着シート | |
JP5683794B2 (ja) | ウェハ加工用テープ | |
JP5323331B2 (ja) | ウェハ加工用シート | |
JP5666659B2 (ja) | ウェハ加工用シート | |
JP2013021109A (ja) | 粘着シート及び粘着シートを用いた円板状被加工物の加工方法 | |
JP2005116790A (ja) | 半導体素子製造用工程フィルム、及びダイシング・ダイボンド一体型テープ | |
JP2017139409A (ja) | ダイボンドダイシングシート | |
JP5090241B2 (ja) | ダイソート用シート | |
JP2003273042A (ja) | 半導体装置の製造方法 | |
JP2009032799A (ja) | ウェハ加工用テープ | |
JP2003324112A (ja) | 半導体装置の製造方法 | |
JP2012169670A (ja) | ダイソート用シート | |
JP2003324080A (ja) | 半導体装置の製造方法 | |
JP2011198797A (ja) | ダイボンドダイシングシート及び半導体チップの製造方法 | |
JP2012253286A (ja) | ウェハ加工用テープ、ウェハ加工用テープの製造方法、及び半導体装置の製造方法 | |
JP2012169337A (ja) | ダイシング・ダイボンディング一体型シート、およびその製造方法 | |
JP2014150121A (ja) | 半導体チップの製造方法 | |
JP2013006925A (ja) | 接着シート | |
JP2014022513A (ja) | ウェハ加工用テープ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141224 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151202 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160210 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160628 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160711 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5979207 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |